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Application Note Please read the Important Notice, the Safety precautions and the Warnings <Revision 1.0> www.infineon.com <2022-05-27> AN-HPDKIT-SiC-G1-QUICKSTART Quickstart Manual for EVAL KIT HPD G1 SiC About this document Scope and purpose This application note describes how to operate the evaluation kit “EVAL KIT HPD G1 SiC”. Intended audience Experienced engineers evaluating HybridPACK™ Drive CoolSiC™ power modules. Evaluation Kit This Evaluation Kit is to be used during the design-in process for evaluating and measuring characteristic curves, and for checking datasheet specifications in designing inverter applications with the HybridPACK™ Drive CoolSiC™ power module and gate driver EiceDRIVERTM. An evaluation kit is not intended to be an optimal design for every specific requirement. But it gives a good starting point and useful design hints for serial development. Furthermore, practical experience from the power module switching characteristic as well as the gate driver features can be obtained in the lab at a minimum effort by using such evaluation tools. Note: PCB and auxiliary circuits are NOT optimized for a final customer design.
Application Note 2 <Revision 1.0> <2022-05- 27> Important notice Quickstart Manual for EVAL KIT HPD G1 SiC Important notice “Evaluation Boards and Reference Boards” shall mean products embedded on a printed circuit board (PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration, reference and evaluation boards, kits and design (collectively referred to as “Reference Board”). Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards has been tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime. The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD). Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for evaluation and testing purposes. In particular, they shall not be used for reliability testing or production. The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards (including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the country in which they are operated by the customer. The customer shall ensure that all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant requirements and standards of the country in which they are operated. The Evaluation Boards and Reference Boards as well as the information provided in this document are addressed only to qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the terms and conditions set forth in this document and in other related documentation supplied with the respective Evaluation Board or Reference Board. It is the responsibility of the customer’s technical departments to evaluate the suitability of the Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness and correctness of the information provided in this document with respect to such application. The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not cause any harm to persons or third party property. The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and Infineon Technologies disclaims any warranties, express or implied, including but not limited to warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or for merchantability. Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation Boards and Reference Boards and/or from any information provided in this document. The customer is obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or damages arising out of or resulting from any use thereof. Infineon Technologies reserves the right to modify this document and/or any information provided herein at any time without further notice.
Application Note 3 <Revision 1.0> <2022-05- 27> Safety precautions Quickstart Manual for EVAL KIT HPD G1 SiC Safety precautions Note: Please note the following warnings regarding the hazards associated with development systems. Table 1 Safety precautions Warning: The DC link potential of this board is up to 500 VDC. When measuring voltage waveforms by oscilloscope, high voltage differential probes must be used. Failure to do so may result in personal injury or death. Warning: The evaluation or reference board contains DC bus capacitors which take time to discharge after removal of the main supply. Before working on the drive system, wait five minutes for capacitors to discharge to safe voltage levels. Failure to do so may result in personal injury or death. Darkened display LEDs are not an indication that capacitors have discharged to safe voltage levels. Warning: The evaluation or reference board is connected to the grid input during testing. Hence, high-voltage differential probes must be used when measuring voltage waveforms by oscilloscope. Failure to do so may result in personal injury or death. Darkened display LEDs are not an indication that capacitors have discharged to safe voltage levels. Warning: Remove or disconnect power from the drive before you disconnect or reconnect wires, or perform maintenance work. Wait five minutes after removing power to discharge the bus capacitors. Do not attempt to service the drive until the bus capacitors have discharged to zero. Failure to do so may result in personal injury or death. Caution: The heat sink and device surfaces of the evaluation or reference board may become hot during testing. Hence, necessary precautions are required while handling the board. Failure to comply may cause injury. Caution: Only personnel familiar with the drive, power electronics and associated machinery should plan, install, commission and subsequently service the system. Failure to comply may result in personal injury and/or equipment damage. Caution: The evaluation or reference board contains parts and assemblies sensitive to electrostatic discharge (ESD). Electrostatic control precautions are required when installing, testing, servicing or repairing the assembly. Component damage may result if ESD control procedures are not followed. If you are not familiar with electrostatic control procedures, refer to the applicable ESD protection handbooks and guidelines. Caution: A drive that is incorrectly applied or installed can lead to component damage or reduction in product lifetime. Wiring or application errors such as undersizing the motor, supplying an incorrect or inadequate AC supply, or excessive ambient temperatures may result in system malfunction. Caution: The evaluation or reference board is shipped with packing materials that need to be removed prior to installation. Failure to remove all packing materials that are unnecessary for system installation may result in overheating or abnormal operating conditions.
Application Note 4 <Revision 1.0> <2022-05- 27> Table of Contents Quickstart Manual for EVAL KIT HPD G1 SiC Table of Contents
Application Note 5 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC How to order HybridKit Drive
1 How to order HybridKit Drive
The evaluation kit EVAL KIT HPD G1 SiC can be ordered via Infineon sales partners: SAP ordering number for EVAL KIT HPD G1 SiC: SP005594933. The evaluation kit is also available at the webshop: http://www.ehitex.com The shipping content of the EVAL KIT HPD G1 SiC include the: HybridPACK™ Drive power module FS03MR12A6MA1B (SP001720764) Reference aluminium cooler + recommended sealing ring Gate driver board HPD GD BOARD G1 SIC (SP005592047) DC-Link capacitor The typical appearance of the evaluation kit is shown in Figure 1. Figure 1 Typical appearance of the evaluation kit EVAL KIT HPD G1 SiC SP005594933.
Application Note 6 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Feature and Limitations Overview
2 Feature and Limitations Overview
The evaluation kit EVAL KIT HPD G1 SiC is a partial inverter system including B6 bridge power module, gate driver board, DC-link capacitor and cooler. The evaluation kit supports the customers in their first steps in designing applications with the HybridPACK™ Drive CoolSiC™.
2.1 Block Diagram
Figure 2 shows the block diagram with simplified signal and power flow connections as well as the implemented key components. Power Supply EiceDRIVER U_HS Supply Connector X1 Interface PCB EiceDRIVER U_LS Supply EiceDRIVER V_HS Supply EiceDRIVER V_LS Supply EiceDRIVER W_HS Supply EiceDRIVER W_LS Supply PressFIT Signal connectors Gate Driver Board U_HS Switch U_LS Switch NTC_U V_HS Switch V_LS Switch NTC_V W_HS Switch W_LS Switch NTC_W M HybridPACKTM Drive CoolSiCTM Liquid Cooling System DC Link Cap HV Supply 8..18V HybridKIT Drive SiC Figure 2 Simplified Block Diagram
Application Note 7 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Feature and Limitations Overview
2.2 Recommended Operating Conditions
The following recommended operating conditions describe the targeted lab testing environment. The evaluation kit is not designed for a fixed specification and it cannot be regarded as a protected system, as it would require strict shutdown routines and would limit the main evaluation purpose. Therefore, please respect the specifications of individual parts and especially the thermal limits. Please see also section 2.4 to understand the limitations. Table 2 Operating Conditions Type Symb Min Max Conditions Gate Driver Board Supply Vsupply 8V 18V Working Voltage (DC-Link Voltage) VDC 0V 500V Gate driver board’s creepage and clearance distances comply with norm IEC-60664- 1 for 500V. Transient Phase Current Iph -800A +800A limited by Tvj,op_max HybridPACKTM Drive CoolSiC TM module Junction Temperature Tvj,op -40°C 150°C PCB Temperature TPCB 150°C Ambient Temperature Tamb 75°C Limited by TPCB. A higher Tamb is achievable at active cooling like a fan Switching frequency fsw 20 kHz Limited by T PCB. A higher f sw is achievable at low ambient temperature or active cooling like a fan
2.3 Key Features
The key features can be summarized: Inverter evaluation kit for xEV main inverter applications (up to 200 kW). Automotive power module HybridPACK™ Drive CoolSiCTM FS03MR12A6MA1B. Automotive gate driver solution based on EiceDRIVER™ 1EDI3033AS. SiC MOSFET desaturation (short circuit) detection. NTC temperature measurement featured by ADC of EiceDRIVER™. DC-Link voltage measurement featured by ADC of EiceDRIVER™. Gate driver board’s creepage and clearance distances comply with norm IEC -60664-1 for 500V working voltage.
Application Note 8 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Feature and Limitations Overview
2.4 Limitations of the Evaluation Kit
The evaluation kit should not be regarded as a protected system. It was designed for evaluation under lab conditions with minimum automatic shutdown routines. The design was intended to be usable also under extreme conditions where protection mechanisms would limit the evaluation possibilities. The evaluation kit is not protected against: Over- & under- voltages on the signal connectors. Overvoltages of the HV working voltage (>500V should be avoided) Overtemperature of the PCB and Module. The power module NTC temperature info is read as a digital signal, but no shutdown limit is set. Testing at higher switching frequencies than 20 kHz may require active cooling of the gate driver board at high ambient temperature. Please read and understand the manual and the safety precautions. Please note that the list are giving examples and should not be seen as exhaustive.
2.5 Key Components List
Some key components can be found in Table 3. The evaluation kit uses more active and passive components which are not listed here. Table 3 Key components list. Part Number Manufacturer Description / Implementation FS03MR12A6MA1B Infineon Automotive HybridPACK™ Drive CoolSiC™ power module with 1200V SiC MOSFET 1EDI3033AS Infineon Automotive Isolated Gate Driver EiceDRIVER™ TLE8386-2EL Infineon Automotive SMPS controller used in 500kHz SEPIC converter B25655P8307K351 TDK Automotive PCC DC-Link Capacitor 855V, 300μF P301085-A2 (B78308-A2387-A003) TDK Automotive Transformer 1:1.0 7 with 10mm creepage distance
Application Note 9 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Quickstart Guide
3 Quickstart Guide
This chapter explains briefly the recommended lab equipment and how to connect the evaluation kit . Please ensure an appropriate current/power/voltage limit of the source. It can happen at any time that the inverter changes the output conditions and/or stops immediately.
3.1 Recommended equipment for evaluation
To perform evaluation tests with the EVAL KIT HPD G1 SiC, following equipment is minimum recommended. Logic Supply: 8-18V, 2A. Pulse generator: 0V…5V Power Source: minimum 30V/2A. up to 500V/600A depending on evaluation tests. Load: passive 3-phase inductive load or alternative 3-phase asynchronous (induction) machine. Scope: 4 channel scope. Cooling system: Optional for light load tests. For high power tests use cooling with 10L/min and <2bar absolute pressure operation.
3.2 Connect the Evaluation Kit to power supply and load
The right connec tion of power supplies and load is shown in Figure 3a. The high voltage DC source has to be connected to the capacitor. Depending on the required currents for the evaluation tests it can be required to mount a busbar over all DC -, DC+ conne ctions. Some busbar examples for high power load tests are shown in Figure 3b and c. For low loads and high power short -term operation it is typically enough to connect the high voltage DC source only at the center DC-Link connections with the cable shoes included in the standard shipping content of the evaluation kit. Refer to [2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC” for logic supply connection on gate driver board.
Application Note 10 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Quickstart Guide Figure 3 Typical appearance of the evaluation kit and req uired supplies and load connections (a). For long- term high power load tests a busbar with appropriate current carrying capability may be required at the DC terminals. Concepts with additional external busbars are shown in (b), this example shows solutions from TDK/Epcos [3]. Concepts with busbars integrated in the capacitor is shown in (c), this example shows a solution from SB Electronics [4].
3.3 Connect the Evaluation Kit to a cooling system
The cooler can be connected via the ½ inch G series British standard pipe interface as shown in Figure 4. Please use as c ooling fluid 50% water / 50% ethylen e glycol and ensure that the cooling fluid corrosion protection is compatible with aluminium cooler and Ni plated baseplate (like typ ical released automotive cooling mixtures). Do not use pure water cooling fluids as it might damage the power module and reference cooler. Figure 4 Typical appearance of the evaluation kit and the cooling system interface.
Application Note 11 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC Advanced Features
4 Advanced Features
4.1 Double Pulse Testing
For a deeper investigation of the corresponding switching characteristics , it is sometimes useful to perform double pulse tests rather than inverter tests. Such tests can be easily performed by using the following sequence: 1. Connect supplies, load and pulse generator properly 2. Turn on the logic supply (8..18V) 3. Activate and enable gate driver EiceDRIVERTM 4. Turn on the high voltage supply and perform double pulse tests Refer to [2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC” for gate driver board configuration detail, such as logic supply connection, enabling gate driver EiceDRIVERTM, etc. The pulse generator can be connected to test pads on the gate driver board as shown in Figure 5. Figure 5 Example how test pads on the gate driver board can be utilized for double pulse test.
Application Note 12 <Revision 1.0> <2022-05- 27> Quickstart Manual for EVAL KIT HPD G1 SiC References and Revision History
5 References and Revision History
The referenced application notes can be found at http://www.infineon.com [1] Infineon Application Note AN-HPD-ASSEMBLY, “Assembly Instructions for the HybridPACK Drive” [2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC” [3] TDK/Epcos Capacitor “B25655P5507K***” [4] SBE Electronics Capacitor “700D50794-204” OR “700D50795-186”
Revision History
Date Version Changed By Change Description 2022-May 1.0 Dehuai Jiang (IFAG ATV HP HMD TM) Initial Version
All referenced product or service names and trademarks are the property of their respective owners. ifx1owners. Edition <2022-05-27> Published by Infineon Technologies AG
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© 2022 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference AN-HPDKIT-SiC-G1-QUICKSTART For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies o ffice (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.