P2N2907AG ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • These are Pb- -Free Devices* MAXIMUM RATINGS Rating Symbol Value Unit Collector- -Emitter Voltage VCEO -- 6 0 Vdc Collector- -Base Voltage VCBO -- 6 0 Vdc Emitter- -Base Voltage VEBO -- 5 . 0 Vdc Collector Current - - Continuous IC - -600 mAdc Total Device Dissipation @ TA =2 5°C Derate above 25°C PD 625 5.0 mW mW/°C Total Device Dissipation @ TC =2 5°C Derate above 25°C PD 1.5 W mW/°C Operating and Storage Junction Temperature Range TJ,T stg -- 5 5 t o +150 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction to Ambient RθJA 200 °C/W Thermal Resistance, Junction to Case RθJC 83.3 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb- -Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com P2N2907ARL1G TO- -92 (Pb- -Free)

5000 Units / Bulk

Device Package Shipping † P2N2907AG TO- -92 (Pb- -Free)

ORDERING INFORMATION

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 2000 / Tape & Reel 1 2 3 1 2 BENT LEAD TAPE & REEL AMMO PACK STRAIGHT LEAD BULK PACK TO- -92 CASE 29 STYLE 17 MARKING DIAGRAM P2N2 907A AYWW G G A = Assembly Location Y = Year WW = Work Week G = Pb- -Free Package (Note: Microdot may be in either location)

http://onsemi.com ELECTRICAL CHARACTERISTICS(TA =2 5°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector- -Emitter Breakdown Voltage (Note 1) (IC =- - 1 0m A d c ,IB =0 ) V(BR)CEO -- 6 0 -- Vdc Collector- -Base Breakdown Voltage (IC =- - 1 0mAdc, IE =0 ) V(BR)CBO -- 6 0 -- Vdc Emitter- -Base Breakdown Voltage (IE =- - 1 0mAdc, IC =0 ) V(BR)EBO -- 5 . 0 -- Vdc Collector Cutoff Current (VCE =- - 3 0V d c ,VEB(off) =- - 0 . 5V d c ) ICEX -- -- 5 0 nAdc Collector Cutoff Current (VCB =- - 5 0V d c ,IE =0 ) (VCB =- - 5 0V d c ,IE =0 ,TA = 150°C) ICBO - -0.01 -- 1 0 mAdc Emitter Cutoff Current (VEB =- - 3 . 0V d c ) IEBO -- -- 1 0 nAdc Collector Cutoff Current (VCE =- - 1 0V ) ICEO -- -- 1 0 nAdc Base Cutoff Current (VCE =- - 3 0V d c ,VEB(off) =- - 0 . 5V d c ) IBEX -- -- 5 0 nAdc ON CHARACTERISTICS DC Current Gain (IC =- - 0 . 1m A d c ,VCE =- - 1 0V d c ) (IC =- - 1 . 0m A d c ,VCE =- - 1 0V d c ) (IC =- - 1 0m A d c ,VCE =- - 1 0V d c ) (IC = - -150 mAdc, VCE = - -10 Vdc) (Note 1) (IC = - -500 mAdc, VCE = - -10 Vdc) (Note 1) hFE 100 100 100 300 Collector- -Emitter Saturation Voltage (Note 1) (IC = - -150 mAdc, IB =- - 1 5m A d c ) (IC = - -500 mAdc, IB =- - 5 0m A d c ) VCE(sat) -- 0 . 4 -- 1 . 6 Vdc Base- -Emitter Saturation Voltage (Note 1) (IC = - -150 mAdc, IB =- - 1 5m A d c ) (IC = - -500 mAdc, IB =- - 5 0m A d c ) VBE(sat) -- 1 . 3 -- 2 . 6 Vdc SMALL- -SIGNAL CHARACTERISTICS Current- -Gain - - Bandwidth Product (Notes 1 and 2) (IC =- - 5 0m A d c ,VCE = - -20 Vdc, f = 100 MHz) fT 200 -- MHz Output Capacitance (VCB =- - 1 0V d c ,IE =0 ,f=1 . 0M H z ) Cobo -- 8.0 pF Input Capacitance (VEB =- - 2 . 0V d c ,IC =0 ,f=1 . 0M H z ) Cibo -- 30 pF SWITCHING CHARACTERISTICS Turn- -On Time (VCC =- - 3 0V d c ,IC = - -150 mAdc, IB1 = - -15 mAdc) (Figures 1 and 5) ton -- 50 ns Delay Time td -- 10 ns Rise Time tr -- 40 ns Turn- -Off Time (VCC =- - 6 . 0V d c ,IC = - -150 mAdc, IB1 =I B2 =- - 1 5m A d c )( F i g u r e2 ) toff -- 110 ns Storage Time ts -- 80 ns Fall Time tf -- 30 ns 1. Pulse Test: Pulse Width≤ 300 ms, Duty Cycle≤ 2.0%. 2. fT is defined as the frequency at which |hfe| extrapolates to unity.

Figure 1. Delay and Rise Time Test Circuit Figure 2. Storage and Fall Time Test Circuit

http://onsemi.com PACKAGE DIMENSIONS TO- -92 (TO- -226) CASE 29- -11 ISSUE AM NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X- -X CV D N N XX SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 N 0.080 0.105 2.04 2.66 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J B K G SECTION X- -X CV D N XX SEATING PLANE DIM MIN MAX MILLIMETERS A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 - -- -- - N 2.04 2.66 P 1.50 4.00 R 2 . 9 3 -- -- -- V 3 . 4 3 -- -- -- T STRAIGHT LEAD BULK PACK BENT LEAD TAPE & REEL AMMO PACK STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER ON Semiconductorand are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose,nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses,and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800- -282- -9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center P2N2907A/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P .O. Box 5163, Denver, Colorado 80217 USA Phone: 303- -675- -2175 or 800- -344- -3860 Toll Free USA/Canada Fax: 303- -675- -2176 or 800- -344- -3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative