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Technical content

Features

  • Provides up to 15 dB of EMI Suppression
  • FCC Approved Method of EMI Attenuation
  • Generates a 1X Low EMI Spread Spectrum Clock of the Input Frequency
  • Operates between 20 MHz and 38 MHz Input Frequency Range
  • External Loop Filter for Spread Percentage Adjustment
  • Spreading Ranges from ±0.25% to ±2.5%
  • Ultra Low Cycle−to−Cycle Jitter
  • Zero−Cycle Slip at Small Deviations
  • 3.3 V Operating V oltage
  • Low Power CMOS Design
  • Available in 8−pin SOIC and TSSOP Packages
  • Available in Industrial Temperature Operating Range (−40°C to +85°C)
  • These are Pb−Free Devices This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. http://onsemi.com SOIC−8 S SUFFIX CASE 751BD PIN CONFIGURATION (Top View) See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

TSSOP−8 T SUFFIX CASE 948AL P2779A

Figure 1. Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Table 2. PIN DESCRIPTION 1 XIN / CLKIN I Connect to crystal or clock input. 3 PD I Power−down control pin. Pull low to enable power−down mode. the percentage spread can be adjusted accordingly. 5 VSS P Ground connection. Connect to system ground. 6 ModOUT O Spread spectrum clock output. 7 REF O Provides a reference clock output of the input frequency.

  1. Connect to VDD if not used.

Table 3. LOOP FILTER SELECTION TABLE VDD 3.3 V (Note 2)

  1. Please contact factory for loop filter values if desired spread settings are not listed.

the EMI reduction benefits of the spread spectrum. Figure 2. Application Schematic reduced by completely turning off the IC.

27 MHz

Table 4. DC ELECTRICAL CHARACTERISTICS Table 5. AC ELECTRICAL CHARACTERISTICS

  1. t LH and tHL are measured into a capacitive load of 15 pF.

http://onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30

0.65 BSC

1.00 REF

1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40

http://onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80

1.27 BSC

1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35

Table 6. ORDERING INFORMATION arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.