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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • FCC Approved Method of EMI Attenuation
  • Generates a Low EMI Spread Spectrum and a Non Spread Reference Signal of the Input Clock Frequency
  • Optimized for Input Frequency Range from 20 to 32 MHz
  • Internal Loop Filter Minimizes External Components and Board Space
  • Two Selectable Spread Ranges
  • 3.3 V Operating V oltage
  • Ultra Low Power CMOS Design: 5.50 mA @ 3.3 V
  • Supports Notebook VGA and Other LCD Timing Controller

Applications

  • Available in 8−pin SOIC and TSSOP
  • These are Pb−Free Devices This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. http://onsemi.com SOIC−8 S SUFFIX CASE 751BD PIN CONFIGURATION (Top View) See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

TSSOP−8 T SUFFIX CASE 948AL P2560B

Figure 1. Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Table 2. PIN DESCRIPTION connected to either an external crystal or an external reference clock. 2 VDD P Power Supply for the entire chip. 3 VSS P Ground to entire chip. 4 ModOUT O Spread spectrum low EMI output. 8 XOUT O Crystal Connection. If using an external reference, this pin must be left unconnected. Table 3. SPREAD RANGE SELECTION, VDD = 3.3 V

Figure 2. Schematic for Notebook VGA Application

27 MHz

Table 4. DC ELECTRICAL CHARACTERISTICS Table 5. AC ELECTRICAL CHARACTERISTICS

  1. t LH and tHL are measured into a capacitive load of 15 pF.

http://onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30

0.65 BSC

1.00 REF

1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40

http://onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80

1.27 BSC

1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35

Table 6. ORDERING INFORMATION arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.