P21BN300X5S

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www.knowlescapacitors.com 2777 Route 20 East, Cazenovia, NY 13035 Milli Datasheet 2020 Rev 3. MILLI -CAP® BROADBAND DATASHEET – BNL VERSION

FEATURES

 Operating frequency range extended up to 50 GHz.  Same form, fit and function as previous Milli-Cap.  Available in 0201, 0402 and 0602 footprints.  Applications: o Broadband Microwave/Millimeter Wave o Test Equipment, Photonics, SONET, TOSA/ROSA o Transimpedance Amplifiers  X7R Characteristics – ±15% Capacitance variation over temperature range of -55 to +125°C.  Low Insertion Loss Old Part Number New Part Number Case Size TCC Cap, pF Voltage Rating, V Dissipation Factor Insulation Resistance Frequency Range P21BN300x5S P21BNL300x5S 0201 X7R 30 50 3.5% > 105 MΩ 20 MHz – 50 GHz P42BN820x5S P42BNL820x5S 0402 X7R 82 50 3.5% > 105 MΩ 20 MHz – 50 GHz P62BN820x5S P62BNL820x5S 0602 X7R 82 50 3.5% > 105 MΩ 20 MHz – 50 GHz x denotes the tolerance of the part. Available in M (±20%) and Z (+80%, -20%) tolerances. Packaging Options: Tape & Reel or Waffle Package. -3.5 -2.5 -1.5 -0.5 0 5 10 15 20 25 30 35 40 45 50 Magnitude, dB Frequency, GHz Insertion Loss, S21 Chart for Milli-Caps P21BNL300M5S DB[S21] P21BNL820M5S DB[S21] P62BNL820M5S DB[S21]

www.knowlescapacitors.com 2777 Route 20 East, Cazenovia, NY 13035 Milli Datasheet 2020 Rev 3. ATTACHMENT METHOD Using Conductive Epoxy Using Solder 1. Place a single drop of conductive epoxy onto each microstrip. Keep the epoxy back from the edge based on the specific footprint. 2. Centering the termination gap in the micro strip, press with even pressure on to the micro strip ensuring the end terminations make good contact with the epoxy. 3. Cure based according to the epoxy manufacturer’s preferred schedule (typically 125 to 250°C). 4. After curing, inspect joint for epoxy shorts across the termination and micro strip gaps to verify cause of short across the capacitor. 5. It is safe to use Isopropanol and Methanol to pre- clean, but not after mounting with conductive epoxy as they would act as a solvent. 1. Place a single drop of solder on to each micro strip. Keep the solder back from the edge based on the specific footprint. 2. Centering the termination gap in the micro strip, press with even pressure on to the micro strip ensuring the end terminations make good contact with the epoxy. 3. Reflow according to solder manufacturer’s preferred profile, ensuring reflow temperature does not exceed 250°C. 4. After reflow step is completed, inspect joints for voids or excess flux and solder balls that can degrade performance or cause shorts across the gaps. 5. It is safe to use Isopropanol and Methanol with soldered Milli-caps. DIMENSIONAL SPECIFICA TIONS Part Dimensions Mounting Guidelines Case Size Length, B Width Thickness Gap, A (typ) End Block, C (typ) Epoxy Thickness, Et Epoxy Diameter Gap Distance from Trace Edge P21 (0201) 0.020” ± 0.004” 0.012” ± 0.002” 0.010” ± 0.002” 0.005” 0.005” – 0.008” 0.008” – 0.010” 0.003” to 0.004” P42 (0402) 0.038” ± 0.004” 0.020” ± 0.002” 0.020” ± 0.002” 0.005” 0.010” – 0.015” 0.015” – 0.020” 0.003” to 0.004” P62 (0602) 0.058” ± 0.004: 0.020 ± 0.002” 0.020 ± 0.002” 0.005” 0.010” – 0.015” 0.015” – 0.020” 0.003” to 0.004”