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Part Number Identification P 21 BN 300 M 5 S T Product Case Size Material Capacitance Capacitance Voltage Termination Packaging P = Milli‐Cap® 21 = 0201 300 = 30pF Tolerance Rating S = Ag term, M = ±20% 5 = 50VDC Ni barrier, Au flash ROHS Nominal 0.006" CODE BN Ceramic Material Info Resistance Insulation 25°C Temperature Coeff. of Capacitance (‐55°C to 125°C) 1MHz MAX Dissipation Factor MAX 0.024" Dim "A" CODE 21 (0201) Tolerance ± 0.001" Case Size Definitions Dim "B" SONET Functional Applications:Benefits: Very Low Series Inductance Increased Useable Bandwidth Ultra High Series Resonance Matching Filter Applications Test Equipment Photonics Milli‐Cap® Milli‐Cap®: The "Ideal" SMT Capacitor P21BN300M5S Low Loss, High Q T = Tape & Reel
Recommended Attachment Materials Conductive Epoxy (EPO TEK ® H20E, Ablebond ® 84‐1 LMI, etc.) Solder (SN62, SN63, etc.) 3. Cure according to the epoxy manufacturer's preferred schedule Typically 125°C to 150°C Max. Recommended Micro‐Strip Layout: Attachment Method: DescriptionCode Termination Termination Finish and Recommended Attachment Methods After curing, inspect the joing for epoxy shorts across the termination and microstrip gaps that would cause a short across the gap. Isopropanol and Methanol are both safe to use to pre‐clean Milli‐Caps ® They are not to be used after mounting with conductive epoxy as they act as a solvent. Recommended Attachment to Soft or Hard Substrate Using Conductive Epoxy: Place a single drop of conductive epoxy onto each micro‐strip line as illustrated. The edge of the epoxy shall be at least 0.003"‐0.004" back from the edge of the trace to prevent filling the gap with epoxy. Centering the termination gap of the capacitor within the gap in the micro‐strip, press with careful, even pressure onto the micro‐strip ensuring the terminations make good contact with the epoxy drops. S Ag Termination, minimum 50µ" Ni barrier layer, 7.5 ± 5µ" Au flash. Distance from Trace Edge: .003” - .004” Ideal Micro Strip Width: .012” - .015” Gap: .008” - .010” Epoxy Diameter: .005 - .008” Epoxy Thickness: .003” - .005”
Recommended Micro‐Strip Layout: Attachment Method: Isopropanol and Methanol are both safe to use with soldered Milli‐Caps ® Reflow according to the solder manufacturer's preferred profile, ensuring the reflow temperature does not exceed 250°C. After the reflow step is completed, inspect the joint for voids or excess flux and non‐reflowed solder balls that can degrade performance or cause shorts across the gaps. Proper cleaning after the reflow process is crucial to avoiding performance degradation and discovering poor solder joints. Recommended Attachment to Soft or Hard Substrate Using Solder: Place a single drop of solder paste onto each micro‐strip line as illustrated. The edge of the solder paste shall be at least 0.001"‐0.002" back from the edge of the trace to prevent filling the gap with solder. Centering the termination gap of the capacitor within the gap in the micro‐strip, press with careful, even pressure onto the micro‐strip ensuring the terminations make good contact with the drops of solder paste. Recommended Attachment Methods (Continued) Distance from Trace Edge: .001” - .002” Ideal Micro Strip Width: .012” - .015” Gap: .008” - .010” Solder Diameter: .010 - .015”) Solder Thickness: .004” - .006”
S Customer Specified (Drawing Required, tooling charges may apply) Packaging Packaging
Description
T Generic Waffle Pack Tape and Reel: 7" Reel, 100pc Minimum, 5000pc Maximum (Consult with a sales representative for availability)
‐30 ‐25 ‐20 ‐15 ‐10 0 5 10 15 20 25 30 35 40 45 50 Return Loss (S11 Magnitude in dB) Insertion Loss (S21 Magnitude in dB) Frequency (GHz) P21BN300M5S Insertion Loss (S21) Return Loss (S11)