P2182BF-08-ST

P2180 PULSECORE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

Features

• FCC approved method of EMI attenuation.
• Provides up to 15dB EMI reduction.
• Generates a 1X low EMI spread spectrum clock from the input frequency.
• Optimized for frequency range:
• P2180 / 84: 20MHz to 40MHz
• P2181: 60MHz to 160MHz
• P2182 / 83: 10MHz to 20MHz
• Internal loop filter minimizes external components and board space.
• Selectable spread options: Down Spread and Center Spread.
• Low inherent cycle-to-cycle jitter.
• Eight spread % selections:
• 3.3V operating voltage.
• CMOS/TTL compatible inputs and outputs.
• Low-power CMOS design.
• Supports notebook VGA and other LCD timing controller applications.
• Drop-in replacement to Cypress W180/1.
• Products are available for industrial temperature range.
• Available in 8-pin SOIC and TSSOP packages. Product Description The P2180/81X is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies from 20MHz to 40MHz and 60MHz to 160MHz (Refer Input Frequency and Modulation Rate Table.) The P2180/81X can generate an EMI reduced clock form an OSC or a system generated clock. The P2180/81A to P2180/81D offer various combinations of spread options and percentage deviations. (Refer Spread Deviation Selections Table.) These combinations include Down and Center Spread and percentage deviation range from ± 0.625% to –3.50%. The P2180/81X reduces electromagnetic interference (EMI) at t he clock source, allowing system wide reduction of EMI of down stream clock and data dependent signals. The P2180/81X allows significant system cost savings by reducing the number of circuit board layers and shielding that are traditionally required to pass EMI regulations. The P2180/81X modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, thereby decreasing the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s bandwidth is called spread spectrum clock generation. The P2180/81X uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all-digital method.

Applications

The P2180/81X is targeted towards EMI management for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC peripheral devices, consumer electronics, and embedded controller systems.

Low EMI Clock for Mobile VGA 2 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. Block Diagram Pin Diagram Pin Description Pin# Pin Name Type Description 1 XIN I Connect to externally generated clock signal or crystal. 2 NC No connect. 3 VSS P Ground to entire chip. 4 SRS I Spread Range Select. Digital logic input used to select frequency deviation (Refer Spread Deviation Selections Table). This pin has an internal pull-up resistor. 5 ModOUT O Spread spectrum low EMI output. 6 VDD P Connect to +3.3V. 7 NC No connect. 8 NC No connect. 8* XOUT O Crystal connection. * Available for P2183 and P2184 only. 4 5

8 XIN

Low EMI Clock for Mobile VGA 3 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. Input Frequency and Modulation Rate Part Number Input Frequency Range (MHz) Output Frequency Range (MHz) Modulation Rate P2180/P2184 20 to 40 20 to 40 Input frequency / 768 P2181 60 to 160 60 to 160 Input frequency / 2048 P2182/P2183 10 to 20 10 to 20 TBD Spread Deviation Selections Part Number SRS Spread Deviation 1 -1.75% (Down) 1 ± 1.75% (Center) 1 -3.50 (Down) 1 ± 0.875% (Center) Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V TSTG Storage temperature -65 to +125 °C TA Operating temperature 0 to +70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.

Low EMI Clock for Mobile VGA 4 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. Unless otherwise noted, VDD = 3.3V and TA =25°C Symbol Parameter Min Typ Max Unit VIL Input low voltage GND – 0.3 - 0.8 V VIH Input high voltage - - V DD + 0.3 V IIL Input low current (input SRS) -60.0 - -20.0 µA IIH Input high current - - 1.00 µA IXOL X OUT output low current (@ 0.4V, VDD = 3.3V) 2.00 - 12.00 mA IXOH X OUT output high current (@2.5V, VDD = 3.3V) - - 12.00 mA VOL Output low voltage (V DD = 3.3V, IOL = 20mA) - - 0.4 V VOH Output high voltage (V DD = 3.3V, IOH = 20mA) 2.8 - - V ICC Dynamic supply current normal mode (3.3V and 10pF loading) 8.6 fIN - min - 27.0 f IN - max mA IDD Static supply current standby mode - 4.5 - mA VDD Operating voltage - 3.3 - V tON Power up time (first locked clock cycle after power up) - - - mS ZOUT Clock output impedance - - - Ω Symbol Parameter Min Typ Max Unit fIN Input frequency 10 - 160 MHz fOUT Output frequency 10 - 160 MHz tLH* Output rise time (measured at 0.8V to 2.0V) - 0.69 - ns tHL* Output fall time (measured at 2.0V to 0.8V) - 0.66 - ns tJC Jitter (cycle to cycle) -200 - 200 ps tD Output duty cycle 45 50 55 % * tLH and tHL are measured into a capacitive load of 15pF

Low EMI Clock for Mobile VGA 5 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice.

Package Information

D E H D A2 A θ L C B e Dimensions Inches Millimeters Symbol Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters. SOIC: 0.074 grams unit weight.

Low EMI Clock for Mobile VGA 6 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. E H A D B C L θ e 8-Pin TSSOP Dimensions Inches Millimeters Symbol Min Max Min Max A 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8°

Low EMI Clock for Mobile VGA 7 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice.

Ordering Information

Part number Marking Package Type Temperature P218XxF-08-ST P2181XxF 8-Pin SOIC, Tube, Pb Free Commercial P218XxF-08-SR P2181XxF 8-Pin SOIC, Tape and Reel, Pb Free Commercial P218XxF-08-TT P2181XxF 8-Pin TSSOP, Tube, Pb Free Commercial P218XxF-08-TR P2181XxF 8-Pin TSSOP, Tape and Reel, Pb Free Commercial P218XxG-08-ST P2181XxG 8-Pin SOIC, Tube, Green Commercial P218XxG-08-SR P2181XxG 8-Pin SOIC, Tape and Reel, Green Commercial P218XxG-08-TT P2181XxG 8-Pin TSSOP, Tube, Green Commercial P218XxG-08-TR P2181XxG 8-Pin T SSOP, Tape and Reel, Green Commercial Note: X= 0 / 1 / 2 / 3 / 4 x= A / B / C / D Device Ordering Information P 2 1 8 X x F - 08 ST SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R ST – SOIC, TUBE DEVICE NUMBER F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) Deviation (%) and Spread option Identifier DEVICE PIN COUNT

Low EMI Clock for Mobile VGA 8 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. Licensed under US patent numbers 5,488,627 and 5,631,920.

Low EMI Clock for Mobile VGA 9 of 9 November 2006 P2180 / 81 / 82 / 83 / 84 rev 1.1 Notice: The information in this document is subject to change without notice. © Copyright 2006 PulseCore Semiconductor Corporation. A ll rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make c hanges to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors t hat may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or lia bility arising out of the app lication or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particu lar purpose, merchantability, or infringement of any intellec tual property rights, except as express agreed to in PulseCore’ s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusiv ely according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third pa rties. PulseCore does not authorize its products for use as critical components in life-supporting systems wh ere a malfunction or failure may reasonably be expected to result in significant injury to the user , and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: P2180/81/82/83/84 Document Version: v1.1 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003