P2010A PULSECORE | Alldatasheet

Document overview

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Technical content

Features

  • FCC approved method of EMI attenuation
  • Provides up to 20dB of EMI suppression
  • Generates a low EMI spre ad spectrum clock of the input frequency
  • Optimized for 10MHz to 35MHz input frequency range
  • Internal loop filter minimizes external components and board space
  • 4 selectable spread ranges
  • SSON control pin for spread spectrum enable and disable options
  • Low Cycle-to-cycle jitter
  • Wide operating range (3V to 5V)
  • 16mA output drives
  • TTL or CMOS compatible outputs
  • Low power CMOS design
  • Available in 8 pin SOIC and TSSOP Packages Product Description The P2010A is a selectable spread spectrum frequency modulator designed specifically for PC peripheral and embedded controller markets. The P2010A reduces electromagnetic interference (EMI) at the clock source which provides system wide reduction of EMI of all clock dependent signals. The P2010A allows significant system cost savings by reducing the number of circuit board layers and shielding that are traditionally required to pass EMI regulations. The P2010A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all-digital method. The P2010A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock and, more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called “spread spectrum clock generation”.

Applications

The P2010A is targeted towards the embedded controller market and PC peripheral markets including scanners, facsimile, MFP’s, printers, PDA, IA, and GPS devices. Block Diagram XOUT XIN ModOUT VSS Frequency Divider Feedback Divider Modulation Phase Detector Loop Filter VCO Output Divider PLL VDD SSON FS0 SR1 Crystal Oscillator

rev 0.2 Low Frequency EMI Reduction IC 2 of 8 Notice: The information in this document is subject to change without notice. Pin Configuration Pin Description Pin# Pin Name Type Description 1 XIN/CLK I Connect to crystal or externally generated clock signal. 2 XOUT I Connect to crystal. No connect if externally generated clock signal is used. 3 FS0 I Digital logic input used to select Input Frequency Range (see Table 1). This pin has an internal pull-up resistor. 4 VSS P Ground Connection. Connect to system ground. 5 SSON I Digital logic input used to enable Spread Spectrum function (Active Low). Spread Spectrum function enable when low. This pin has an internal pull-low resistor. 6 ModOUT O Spread Spectrum Clock Output. 7 SR0 I Digital logic input used to select Spreading Range (see Table 1). This pin has an internal pull-up resistor. 8 VDD P Connect to +3.3V or +5.0V Table 1 - Spread Range Selection FS0 SR0 Spreading Range Input Frequency Modulation rate 1 0 +/- 1.50% 10MHz to 20MHz (Fin/10)*20.83KHz 1 1 +/- 2.50% 10MHz to 20MHz (Fin/10)*20.83KHz 0 0 +/- 1.25% 20MHz to 35MHz (Fin/10)*20.83KHz 0 1 +/- 2.00% 20MHz to 35MHz (Fin/10)*20.83KHz XOUT SSON ModOUT SR0 4 5 P2040C XIN/CLK VSS VDD 1 4 5 P2010A FS0

rev 0.2 Low Frequency EMI Reduction IC 3 of 8 Notice: The information in this document is subject to change without notice. Spread Spectrum Selection Table 1 illustrates the possible spread spectrum options. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is described as a percentage deviation of the center frequency (Note: the center frequency is the frequency of the external reference input on XIN/CLK, Pin 1). Example of a typical printer or scanner application that operates on a clock frequency of 16MHz: A spreading selection of FS0=1 and SR0=1 provides a perce ntage deviation of +/-2.50%* (see Table 1) of Center Frequency. This results in the frequency on ModOUT being sw ept from 16.40MHz to 15.60MHz at a modulation rate of 33.33KHz (see Table 1). This particular example (see Figur e below) given here is a common EMI reduction method for scanner, printer or embedded applications and has already been adopted by most of the leading manufacturers. Note: Spreading range selection varies from different system manufacturers and their designs. VDD SR0 ModOUT SSONVSS FS0 XOUT XIN/CLK P2010A VDD Connected to CLK input pin of the system 16MHz Crystal Input 0.1µF

rev 0.2 Low Frequency EMI Reduction IC 4 of 8 Notice: The information in this document is subject to change without notice. Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +7 V TSTG Storage temperature -65 to +125 °C TA Operating temperature -40 to+85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Symbol Parameter Min Typ Max Unit VIL Input Low Voltage GND - 0.8 V VIH Input High Voltage 2.0 - VDD + 0.3 V IIL Input Low Current (pull-up resistor on inputs SR0, FS0) - - -35 µA IIH Input High Current (pull-down resistor on input SSON) - - 35 µA IXOL XOUT output low current (at 0.4V, VDD = 3.3V) - 3 - mA IXOH XOUT output high current (at 2.5V, VDD = 3.3V) - 3 - mA VOL Output Low Voltage (VDD=3.3V, IOL = 20mA) - - 0.4 V VOH Output High Voltage (VDD=3.3V, IOH = 20mA) 2.5 - - V IDD Static Supply Current - 0.6 - mA ICC Dynamic Supply Current (3.3V and 15pF loading) 4 6 8 mA VDD Operating Voltage 2.7 3.3 5.5 V tON Power Up Time (First locked clock cycle after power up) 0.18 mS ZOUT Clock Output Impedance 50 Ω Symbol Parameter Min Typ Max Unit fIN Input Frequency 10 20 35 MHz tLH* Output rise time tHL* Output fall time tJC Jitter (Cycle to cycle) - - 360 pS tD Output duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF

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Package Information

8-lead (150-mil) SOIC Package D E H D A2 A θ L C B e Dimensions Inches Millimeters Symbol Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8°

rev 0.2 Low Frequency EMI Reduction IC 6 of 8 Notice: The information in this document is subject to change without notice. E H A D B C L θ e 8-lead TSSOP (4.40-MM Body) Dimensions Inches Millimeters Symbol Min Max Min Max A 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8°

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Ordering Information

Part number Marking Package Type Temperature P2010AF-08ST P2010AF 8-Pin SOIC, Tube, Pb Free Commercial P2010AF-08SR P2010AF 8-Pin SOIC, Tape and Reel, Pb Free Commercial P2010AG-08ST P2010AG 8-Pin SOIC, Tube, Green Commercial P2010AG-08SR P2010AG 8-Pin SOIC, Tape and Reel, Green Commercial I2010AF-08ST I2010AF 8-Pin SOIC, Tube, Pb Free Industrial I2010AF-08SR I2010AF 8-Pin SOIC, Tape and Reel, Pb Free Industrial I2010AG-08ST I2010AG 8-Pin SOIC, Tube, Green Industrial I2010AG-08SR I2010AG 8-Pin SOIC, Tape and Reel, Green Industrial P2010AF-08TT P2010AF 8-Pin TSSOP, Tube, Pb Free Commercial P2010AF-08TR P2010AF 8-Pin TSSOP, Tape and Reel, Pb Free Commercial P2010AG-08TT P2010AG 8-Pin TSSOP, Tube, Green Commercial P2010AG-08TR P2010AG 8-Pin TSSOP, Tape and Reel, Green Commercial I2010AF-08TT I2010AF 8-Pin TSSOP, Tube, Pb Free Industrial I2010AF-08TR I2010AF 8-Pin TSSOP, Tape and Reel, Pb Free Industrial I2010AG-08TT I2010AG 8-Pin TSSO P, Tube, Green Industrial I2010AG-08TR I2010AG 8-Pin TSSOP, Tape and Reel, Green Industrial Device Ordering Information P2010A F-08-ST Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R ST – SOIC, TUBE DEVICE NUMBER P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) PIN COUNT Deviation (%) and Spread option Identifier F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS

rev 0.2 Low Frequency EMI Reduction IC 8 of 8 Notice: The information in this document is subject to change without notice. © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All ot her brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors t hat may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product descri bed herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the app lication or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in PulseCore’ s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusiv ely according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellect ual property rights of PulseCore or third partie s. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseC ore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: P2010A Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003