P2008A

P2008A PULSECORE | Alldatasheet

Document overview

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Technical content

Features

• FCC approved method of EMI attenuation.
• Provides up to 15dB of EMI suppression.
• Generates a 1X or ½ X low EMI spread spectrum clock of the input frequency.
• Input frequency range: 4MHz to 32MHz.
• Internal loop filter minimizes external components and board space.
• Spreading ranges from ±0.8% to ±3.2%.
• SSON# control pin for spread spectrum enable and disable options.
• Low Cycle-to-Cycle jitter.
• 3.3V Operating Voltage.
• Ultra-low power CMOS design.
• Available in 8-pin SOIC and TSSOP Packages. Product Description The P2008A is a versatile spread spectrum frequency modulator designed specifically for digital camera and other digital video and imaging applications. The P2008A reduces electromagnetic inte rference (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data depen dent signals. The P2008A allows significant system co st savings by reducing the number of circuit board layers ferrite beads, shielding and other passive components that are traditionally required to pass EMI regulations. The P2008A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. The P2008A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’.

Applications

The P2008A is targeted towards cable, xDSL, fax modem, set-top box, USB controller, DSC, and other embedded systems. Block Diagram VSS VDD XIN/CLKIN Frequenc y Feedbac k Modulation Phase Detector Loop Filter VCO Output Divider ModOUT PLL SSON# DIV2 SR0 Crystal Oscillator XOUT

rev 1.4 General purpose EMI Reduction IC 2 of 8 Notice: The information in this document is subject to change without notice. 4 5 P2008A XIN/ CLKIN XOUT DIV21 VSS SSON# ModOUT SR0 VDD Pin Configuration Pin Description Pin# Pin Name Type Description

1 XIN/CLKIN I

Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected.

3 DIV2 I

Digital logic input used to select no rmal output mode or divide-by-two output mode. When this pin is HIGH, the frequency of the output clock is the same as the input clock frequency. When it is tied lo w, the output frequency is half the input clock frequency. This pin has an internal pull-up resistor. 4 VSS P Ground to entire chip. Connect to system ground.

5 SSON# I

Digital logic input used to enable Spread Spectrum function (Active LOW). Spread Spectrum function enabled when LOW, disabled when HIGH. This pin has an internal pull-low resistor. 6 ModOUT O Spread spectrum clock output.

7 SR0 I Digital logic input used to select Spreading Range ( Refer Modulation Output and

Spreading Range Selection Table.) This pin has an internal pull-up resistor.

8 VDD P Power supply for the entire chip

Modulation Output and Spreading Selection (ModOUT = XIN/CLKIN) Output Frequency Range DIV2 = 1 Modulation Rate SR0 8MHz 12MHz 16MHz 20MHz 24MHz 28MHz 32MHz (XIN/CLKIN/20) * 62.5 KHz Modulation Output and Spreading Selection (ModOUT = ½ XIN/CLKIN) Output Frequency Range DIV2 = 0 Modulation Rate SR0 4MHz 6MHz 8MHz 10MHz 12MHz 14MHz 16MHz (XIN/CLKIN/20) * 62.5 KHz

rev 1.4 General purpose EMI Reduction IC 3 of 8 Notice: The information in this document is subject to change without notice. Spread Spectrum The Modulation Output and Spreading Selection Tables illustrate the two possible spread spectrum options. The optimal setting should minimize system EMI to the fullest without a ffecting system performance. The spreading is described as a percentage deviation of the center frequency (Note: The center frequency is the frequency of the external reference input on XIN/CLKIN, Pin1). Example: The P2008A is designed for communications, digital video and imag ing applications. It is not only optimized for operation in the 4MHz – 32MHz range, but its output frequency can be extended down to one half of the input clock frequency using the divide-by-two feature. This feature extends low frequency as low as to 2MHz. Setting Pin 3 low (DIV2 = 0; Divide-by-two mode) sets the output frequency (ModOUT) to half the frequency of the input clock (XIN/CLKIN). This is a simple way to generate a spread spectrum modulated low frequency clock when only a higher frequency signal is available. If you want the output frequency to be the same as the input, you can either set DIV2=1 or leave it unconnected. Selecting the P2008A’s spread options is a matter of eit her setting SR0=1 or SR0=0. Setting SR0=0 set as a lower modulation spread, while setting it to 1 introduces a wider spectral spread in the output clock. Refer Modulation output and Spreading Selections Tables. The example given in the figure below shows the device set to the divide-by-two mode (DIV2=0) with a lower spectrum range (SR0=0). The versatility provided by allowing both clock division and spread spectrum on one chip is already proving to be a popular solution among leading system manufacturers. Modulated 4.416MHz is connected to CLK input pin of the system XIN/CLKIN XOUT DIV2 VSS SR0 SSON# Mod OUT VDD 8.832MHz Crystal +3.3V 0.1µF P2008A

rev 1.4 General purpose EMI Reduction IC 4 of 8 Notice: The information in this document is subject to change without notice. Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V TSTG Storage temperature -65 to +125 °C TA Operating temperature 0 to +70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS – 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current (pull-up resistors on inputs SR0 and DIV2) - - -35 µA IIH Input high current (pull-down resistor on input SSON#) - - 35 µA IXOL XOUT Output Low Current (@ 0.4V, VDD = 3.3V) - 3 - mA IXOH XOUT Output High Current (@ 2.5V, VDD = 3.3V) - 3 - mA VOL Output low voltage (VDD = 3.3V, I OL = 10mA) - - 0.4 V VOH Output high voltage (VDD = 3.3V, I OH = 10mA) 2.5 - - V ICC Dynamic supply current normal mode (3.3V, and 15pF loading) 6.0 7.0 8.3 mA IDD Static supply current standby mode - 0.6 - mA VDD Operating volt age 3.0 3.3 3.6 V tON Power up time (first locked clo ck cycle after power up) - 0.18 - mS ZOUT Clock output impedance - 50 - Ω Symbol Parameter Min Typ Max Unit fIN Input frequency 4 20 32 MHz DIV2 =0 2 10 16 fOUT Output frequency DIV2 =1 4 20 32 MHz tJC Jitter (cycle to cycle) - - 360 pS tD Output duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF

rev 1.4 General purpose EMI Reduction IC 5 of 8 Notice: The information in this document is subject to change without notice.

Package Information

D E H D A2 A θ L C B e Dimensions Inches Millimeters Symbol Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8°

rev 1.4 General purpose EMI Reduction IC 6 of 8 Notice: The information in this document is subject to change without notice. E H A D B C L θ e 8-Pin TSSOP Package Dimensions Inches Millimeters Symbol Min Max Min Max A 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8°

rev 1.4 General purpose EMI Reduction IC 7 of 8 Notice: The information in this document is subject to change without notice. Ordering Codes Part Number Marking Package type Temperature P2008AF-08ST P2008AF 8 PIN SOIC, TUBE, Pb Free Commercial P2008AF-08SR P2008AF 8-PIN SOIC, TAPE AND REEL, Pb Free Commercial P2008AF-08TT P2008AF 8-PIN TSSOP, TUBE, Pb Free Commercial P2008AF-08TR P2008AF 8-PIN TSSOP, TAPE AND REEL, Pb Free Commercial P2008AG-08ST P2008AG 8 PIN SOIC, TUBE, Green Commercial P2008AG-08SR P2008AG 8-PIN SOIC, TAPE AND REEL, Green Commercial P2008AG-08TT P2008AG 8-PIN TSSOP, TUBE, Green Commercial P2008AG-08TR P2008AG 8-PIN TSSOP, TAPE AND REEL, Green Commercial Device Ordering Information P 2 0 0 8 A F - 08 ST Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Package: ST – SOIC, TUBE SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R DEVICE NUMBER P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) X = Automotive Temperature Range (-40°C to 125°C) Pin Count F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS

rev 1.4 General purpose EMI Reduction IC 8 of 8 Notice: The information in this document is subject to change without notice. Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Cor poration. All rights reserved. Our logo and name are trademarks or registered trade marks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein repres ents PulseCore’s best data and/or estimates at the time of is suance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is und er development, significant changes to these s pecifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product descri bed herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warrant ies related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agree d to in PulseCore’s Terms and Conditions of Sale (whi ch are available from PulseCore). All sa les of PulseCore products are made exclusi vely according to PulseCore’s Terms and Conditions of Sale. The purc hase of products from PulseCor e does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property right s of PulseCore or third parti es. PulseCore does not authorize its products for use as critical components in life-supporting system s where a malfunction or failure may re asonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems i mplies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: P2008A Document Version: v1.4