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  • PDF pages: 7

Technical content

Features

  • FCC Approved Method of EMI Attenuation
  • Provides up to 15 dB of EMI Suppression
  • Generates a 1X or 1/2X Low EMI Spread Spectrum Clock of the Input Frequency
  • Input Frequency Range: 4 MHz to 32 MHz
  • Internal Loop Filter Minimizes External Components and Board Space
  • Spreading Ranges from ±0.8% to ±3.2%
  • SSON# Control Pin for Spread Spectrum Enable and Disable Options
  • Low Cycle−to−Cycle Jitter
  • 3.3 V Operating V oltage
  • Ultra−low Power CMOS Design
  • Available in 8−pin SOIC and TSSOP Packages
  • These are Pb−Free Devices http://onsemi.com SOIC−8 S SUFFIX CASE 751BD PIN CONFIGURATION (Top View) See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

SSON# XOUT DIV2 XIN / CLKIN VSS TSSOP−8 T SUFFIX CASE 948AL

Figure 1. Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Table 2. DC ELECTRICAL CHARACTERISTICS

Table 3. AC ELECTRICAL CHARACTERISTICS

  1. t LH and tHL are measured into a capacitive load of 15 pF.

Table 4. PIN DESCRIPTION connected either to an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 4 VSS P Ground to entire chip. Connect to system ground. function enabled when LOW, disabled when HIGH. This pin has an internal pull−low resistor. 6 ModOUT O Spread spectrum clock output.

7 SR0 I Digital logic input used to select Spreading Range (Refer to Modulation Output and Spreading

Selection Table.) This pin has an internal pull−up resistor.

8 VDD P Power supply for the entire chip

Table 5. MODULATION OUTPUT AND SPREADING SELECTION (ModOUT = XIN / CLKIN) Table 6. MODULATION OUTPUT AND SPREADING SELECTION (ModOUT = 1/2 XIN / CLKIN)

reference input on XIN / CLKIN, Pin1). DIV2=1 or leave it unconnected. Figure 2. P2008A Application Schematic

8.832 MHz Crystal

http://onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30

0.65 BSC

1.00 REF

1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40

http://onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80

1.27 BSC

1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35

Table 7. ORDERING INFORMATION arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.