P0406FC33C PROTEC | Alldatasheet
Document overview
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Technical content
P0406FC3.3C* thru P0406FC36C* 05155.R4 3/05 www.protekdevices.com FLIP CHIP ARRAY Only One Name Means ProTek’Tion™ *U.S. Patent No. Des. “D456,367S”
APPLICATIONS
✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
FEATURES
✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 3 to 5 Lines ✔ RoHS in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0406 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Plating ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) 0406 (Single Chip Shown) 05155 PIN CONFIGURATION
www.protekdevices.com 05155.R4 3/05 P0406FC3.3C* thru P0406FC36C* *U.S. Patent No. Des. “D456,367S” GRAPHS 0 5 10 15 20 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0406FC05C IPP - Peak Pulse Current - Amps ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR P0406FC05C
5 Volts per Division
TL - Lead Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE
www.protekdevices.com 05155.R4 3/05 P0406FC3.3C* thru P0406FC36C* *U.S. Patent No. Des. “D456,367S” Ramp-up Ramp-down Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down TS - Preheat TSMAX TSMIN TL t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm
60 Seconds
270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.
APPLICATION INFORMATION
www.protekdevices.com 05155.R4 3/05 P0406FC3.3C* thru P0406FC36C* *U.S. Patent No. Des. “D456,367S” PACKAGE OUTLINE & DIMENSIONS A B C E F G H I
0.56 NOM
0.86 NOM
0.99 ± 0.0254 0.15 SQ 1.5 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001 0.006 SQ 0.059 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). PACKAGE OUTLINE MOUNTING PAD LAYOUT - Option 1 A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 PAD DIMENSIONS DIM MILLIMETERS INCHES Outline & Dimensions: Rev 3 - 11/02, 06023 G H E F I SIDE A B C TOP END C SOLDER PRINT A H D I SOLDER PADS F G E SOLDER MASK DIE SOLDER BUMPS
www.protekdevices.com 05155.R4 3/05 P0406FC3.3C* thru P0406FC36C* *U.S. Patent No. Des. “D456,367S” PACKAGE OUTLINE & DIMENSIONS COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com A F G H I 0.51 0.15 SQ 0.71 0.99 0.51 0.020 0.006 SQ 0.028 0.039 0.020 DIM MILLIMETERS INCHES PACKAGE DIMENSIONS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. MOUNTING PAD LAYOUT - Option 2 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0406FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., P0406FC05C-T75-2). 4. Suffix - LF = Lead-Free, i.e., P0406FC05C-LF-T75-2. Outline & Dimensions: Rev 3 - 11/02, 06023 TAPE & REEL ORIENTATION NOTE: 1. Top view of tape. Solder bumps are face down in tape package. Triple Die - 0406 SOLDER PRINT 0.014” [0.36] DIA. A H I F G SOLDER MASK DIE SOLDER BUMPS COPPER CONTACTS 0.009” [0.23] DIA.