P0404FC3.3C PROTEC | Alldatasheet
Document overview
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- PDF pages: 6
Technical content
105154.R6 2/07 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” PFLIP CHIP ARRAY P0404FC3.3C* thru P0404FC36C* 05154
APPLICATIONS
✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
FEATURES
✔ ESD Protection > 25 kilovolts ✔ Available in Voltages Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 to 3 Lines ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0404 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION
0402 CHIP SHOWN
305154.R6 2/07 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0404FC3.3C* thru P0404FC36C* GRAPHS 0 5 10 15 20 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0404FC05C IPP - Peak Pulse Current - Amps ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR P0404FC05C
5 Volts per Division
TA - Ambient T emperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE
405154.R6 2/07 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0404FC3.3C* thru P0404FC36C*
APPLICATION INFORMATION
t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm
60 Seconds
270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.
505154.R6 2/07 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0404FC3.3C* thru P0404FC36C*
0404 PACKAGE OUTLINE & DIMENSIONS
A B C E F G H I
0.56 NOM
0.86 NOM
1.0 ± 0.02 0.15 SQ 1.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001 0.006 SQ 0.039 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). PACKAGE OUTLINE MOUNTING PAD LAYOUT - Option 1 A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 PAD DIMENSIONS DIM MILLIMETERS INCHES /MT67 /MT65 /MT68 /MT68/MT73/MT69 /MT83/MT79/MT76/MT68/MT69/MT82 /MT66/MT85/MT77/MT80 /MT69 /MT70 /MT71/MT72 /MT73 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT80/MT82/MT73/MT78/MT84 /MT48/MT46/MT48/MT49/MT48/MT148/MT32/MT45/MT32/MT48/MT46/MT48/MT49/MT50/MT148/MT32/MT68/MT73/MT65/MT46 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT80/MT65/MT68/MT83 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT77/MT65/MT83/MT75 /MT65/MT66 /MT67 /MT71 /MT69 /MT70 /MT84/MT79/MT80 /MT69/MT78/MT68 /MT73 /MT72
605154.R6 2/07 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0404FC3.3C* thru P0404FC36C* COPYRIGHT © ProT ek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com A F G H I 0.51 0.15 SQ 0.71 0.99 0.51 0.020 0.006 SQ 0.028 0.039 0.020 DIM MILLIMETERS INCHES PACKAGE DIMENSIONS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). Preferred: Using 0.1mm (0.004”) stencil. MOUNTING PAD LAYOUT - Option 2 /MT67 /MT65 /MT68 /MT68/MT73/MT69 /MT83/MT79/MT76/MT68/MT69/MT82 /MT66/MT85/MT77/MT80 /MT69 /MT70 /MT71/MT72 /MT73 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT80/MT82/MT73/MT78/MT84 /MT48/MT46/MT48/MT49/MT48/MT148/MT32/MT45/MT32/MT48/MT46/MT48/MT49/MT50/MT148/MT32/MT68/MT73/MT65/MT46 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT80/MT65/MT68/MT83 /MT83/MT79/MT76/MT68/MT69/MT82/MT32/MT77/MT65/MT83/MT75 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 4. Suffix - LF = Lead-Free, i.e., P0404FC05C-LF-T710-2. TAPE & REEL ORIENTATION NOTE: 1. Top view of tape. Solder bumps are face down in tape package. Dual Die - 0404 Laser Orientation Line Outline & Dimensions: Rev 4 - 9/04, 06022