P0404FC33C PROTEC | Alldatasheet
Document overview
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Technical content
P0404FC3.3C* thru P0404FC36C* 05154.R5 4/05 www.protekdevices.com FLIP CHIP ARRAY Only One Name Means ProTek’Tion™ *U.S. Patent No. Des. “D456,367S”
APPLICATIONS
✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
FEATURES
✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 to 3 Lines ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0404 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Plating ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) 0404 (Single Chip Shown) 05154 PIN CONFIGURATION
www.protekdevices.com 05154.R5 4/05 P0404FC3.3C* thru P0404FC24C* *U.S. Patent No. Des. “D456,367S” GRAPHS 0 5 10 15 20 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0404FC05C IPP - Peak Pulse Current - Amps ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR P0404FC05C
5 Volts per Division
TL - Lead Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE
www.protekdevices.com 05154.R5 4/05 P0404FC3.3C* thru P0404FC36C* *U.S. Patent No. Des. “D456,367S”
APPLICATION INFORMATION
t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm
60 Seconds
270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.
www.protekdevices.com 05154.R5 4/05 P0404FC3.3C* thru P0404FC24C* *U.S. Patent No. Des. “D456,367S” PACKAGE OUTLINE & DIMENSIONS A B C E F G H I
0.56 NOM
0.86 NOM
1.0 ± 0.02 0.15 SQ 1.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001 0.006 SQ 0.039 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). PACKAGE OUTLINE MOUNTING PAD LAYOUT - Option 1 A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 PAD DIMENSIONS DIM MILLIMETERS INCHES C SOLDER PRINT A H D I SOLDER PADS F G E DIE SOLDER BUMP SOLDER MASK G H E F I SIDE A B C TOP END Outline & Dimensions: Rev 4 - 9/04, 06022
www.protekdevices.com 05154.R5 4/05 P0404FC3.3C* thru P0404FC36C* *U.S. Patent No. Des. “D456,367S” PACKAGE OUTLINE & DIMENSIONS COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com A F G H I 0.51 0.15 SQ 0.71 0.99 0.51 0.020 0.006 SQ 0.028 0.039 0.020 DIM MILLIMETERS INCHES PACKAGE DIMENSIONS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. MOUNTING PAD LAYOUT - Option 2 SOLDER PRINT A H I SOLDER MASK F G DIE SOLDER BUMP COPPER CONTACTS 0.009” [0.23] DIA. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0404FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0404FC05C-T710-2). 4. Suffix = LF = Lead-Free, i.e., P0404FC05C-LF-T75-1. Outline & Dimensions: Rev 4 - 9/04, 06022 TAPE & REEL ORIENTATION NOTE: 1. Top view of tape. Solder bumps are face down in tape package. Dual Die - 0404 Laser Orientation Line