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Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 1 05107 P0402FC3.3C - P0402FC36C 250w FliP ChiP tvs a RRay

DesCRiPtion

The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the P0402FCxxC series features superior clamping performance, low leak- age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

FeatuRes

  • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
  • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
  • ESD Protection > 25 kilovolts
  • Available in Voltages Ranging from 3.3V to 36V
  • 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
  • Protection for 1 Line
  • RoHS Compliant
  • REACH Compliant MeChani Cal ChaRaCteRisti Cs
  • Standard EIA Chip Size: 0402
  • Approximate Weight: 0.73 milligrams
  • Lead-Free Plating
  • Solder Reflow Temperature:
  • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
  • Flammability Rating UL 94V-0
  • 8mm Tape per EIA Standard 481
  • Top Contacts: Solder Bump 0.004” in Height (Nominal)

aPPliCations

  • Cellular Phones
  • MCM Boards
  • Wireless Communication Circuits
  • IR LEDs
  • SMART & PCMCIA Cards

0402 PaCkage

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 2 05107 P0402FC3.3C - P0402FC36C tyPiCal Devi Ce ChaRaCteRisti Cs MaXiMuM Ratings @ 25°C unless otherwise specified PaRaMete R syMBol value units Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 250 Watts Operating Temperature TA -55 to 150 °C Storage Temperature TSTG -55 to 150 °C eleCtRiCal ChaRaCteRisti Cs PeR line @ 25°C unless otherwise specified PaRt nuMBeR (note 1) RateD stanD-oFF voltage vwM volts Mini MuM BReakDown voltage @ 1ma v(BR) volts MaXiMuM ClaMPing voltage (Fig. 2) @ iP = 1a vC volts MaXiMuM ClaMPing voltage (Fig. 2) @ 8/20µs vC @ iPP MaXiMuM leakage CuRRent (note 2) @vwM iD µa tyPiCal CaPaCitanCe @0v, 1Mhz C pF P0402FC05C 5.0 6.0 11.0 14.7V @ 17A 10 100 P0402FC08C 8.0 8.5 13.2 19.2V @ 13A 10* 75 P0402FC12C 12.0 13.3 19.8 29.7V @ 9A 1 50 P0402FC15C 15.0 16.7 25.4 35.7V @ 7A 1 40 P0402FC24C 24.0 26.7 37.2 55.0V @ 5A 1 30 P0402FC36C 36.0 40.0 70.0 84.0V @ 3A 1 25 notes 1. All devices are bidirectional. Electrical characteristics apply in both directions.

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 3 05107 P0402FC3.3C - P0402FC36C tyPiCal Devi Ce ChaRaCteRisti Cs Figu Re 1 Peak Pulse PoweR vs Pulse ti Me td - Pulse Duration - µs 250W, 8/20µs Waveform 0.1 1 10 100 1,000 10,000 PPP - Peak Pulse Power - watts 100 1,000 10,000 Peak Pulse Power 8/20µs Average Power Figu Re 3 PoweR DeRating CuRve ta - ambient temperature - °C 0 25 50 75 100 125 150 100 % of Rated Power TEST WAVEFORM PARAMETERS t f = 8µs td = 20µs tf e-t Peak Value IPP td = t/(IPP/2) Figu Re 2 Pulse wave FoRM t - time - µs 0 5 10 15 20 25 30 iPP - Peak Pulse Current - % of iPP 100 120

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 4 05107 P0402FC3.3C - P0402FC36C tyPiCal Devi Ce ChaRaCteRisti Cs Figu Re 4 oveRshoot & ClaMPing voltage FoR P0402FC05C esD test Pulse - 25 kilovolt, 1/30ns (waveshape) 5 volts per Division Figu Re 5 tyPiCal ClaMPing voltage vs Peak Pulse CuRRent P0402FC05C iPP - Peak Pulse Current - amps 0 5 10 15 20 vC - Clamping voltage - volts

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 5 05107 P0402FC3.3C - P0402FC36C sPiCe MoDel Figu Re 1 sPiCe MoDel FoR I/O GND ABD ABD aBD - avalanche Breakdown Diode (tvs) taBle 1 - s PiCe PaRaMete Rs PaRaMete R unit aBD(tvs) BV V See Table 2 IBV µA 1 Cjo pF See Table 2 IS A See Table 2 Vj V 0.6 M - 0.33 N - 1 RS - See Table 2 TT s 1E-8 EG eV 1.11 taBle 2 - a BD sPeCiFiC sPiCe PaRaMete Rs PaRt nuMBeR Bv(volts) Cjo(pF) is (aMPs) Rs(ohMs) P0402FC3.3C 4.0 150 1E-11 0.20 P0402FC05C 6.0 100 1E-11 0.16 P0402FC08C 8.5 75 1E-13 0.33 P0402FC12C 13.3 50 1E-13 0.51 P0402FC15C 16.7 40 1E-13 0.53 P0402FC24C 26.7 20 1E-13 0.63 P0402FC36C 40.2 15 1E-13 0.73

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 6 05107 P0402FC3.3C - P0402FC36C sol DeR ReFlow inFoRMation PRinte D CiRCuit BoaRD ReCoMMenDations PaRaMete R value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C tP 30-60 seconds Ramp-up 15 seconds (Minimize) solder-time 15-20 seconds Ramp-Down Ramp-Down solder Melt (Maximum temp) Maximum solder Reflow (35-53°C above Maximum solder Melt temp) Ramp-up Preheat (stay Below Flux activation temp) temperature - °C ReCoMMenDeD non-sol DeR Mask DeFine D PaD illust Ration non-solder Mask Defined Pad 0.275mm Dia. solder Mask opening 0.325mm Dia. solder stencil opening 0.330mm Dia. Requi ReMents Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activa- tion temperature, component size, weight, surface area and plating.

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 7 05107 P0402FC3.3C - P0402FC36C

0402 PaCkage in FoRMation

C B A D H F E G SOLDER BUMP SOLDER PAD SOLDER PRINT DIAMETER 0.010” - 0.012” TOP A B C D E F H END I SIDE G I outline DiMensions DiM Milli Mete Rs inChes Min MaX Min MaX A 0.46 0.018 B 0.86 0.034 C 0.98 1.02 0.038 0.040 D 0.10 0.004 E 0.35 0.014 F 0.458 0.508 0.018 0.020 G 0.20 0.008 H 0.051 0.076 0.002 0.003 I 0.406 0.016 notes 1. Controlling dimensions in inches. layout DiMensions DiM Milli Mete Rs inChes noMinal noMinal A 0.23 0.009 B 0.48 0.019 C 0.69 0.027 D 0.46 0.018 E 0.99 0.039 F 0.20 0.008 G 0.20 0.008 H 0.66 0.026 I 0.13 0.005 notes 1. Controlling dimensions in inches.

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 8 05107 P0402FC3.3C - P0402FC36C taPe anD Reel inFoRMation

10 Pitches Cumulative

Tolerance on tape ± 0.2 WF EP2 P0D P T User Direction of Feed Top Cover Tape sPeCiFiCations Reel Dia. taPe wiDth a0 B0 k0 D e F w P0 P2 P tmax notes 1. Dimensions in millimeters. 2. Top view of tape. Metal contacts are face down in tape package. 3. Orientation: preferred stencil - 0.1mm (0.004”). 4. Surface mount product is taped and reeled in accordance with EIA 481. 5. 8mm plastic tape: 7” Reels - 5,000 (pocket under hole skipped) pieces per reel. 6. Marking on Reel - part number, date code and lot number. taPe & Reel o Rientation Single Die - 0402 Package outline, pad layout and tape specifications per document number 06001.R7 8/12.

oRDeRing inFoRMation

(xx = voltage) leaDFR ee suFFiX taPe suFFiX qty/Reel Reel siZe tuBe qty P0402FCxxC -LF -T75-1 5,000 7” n/a This device is only available in a Lead-Free configuration.

Only One Name Means ProTek’Tion™ www.protekdevices.com05107.R15 9/12 Page 9 05107 P0402FC3.3C - P0402FC36C CoMPany in FoRMation COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. CoMPany PRoFile In business more than 20 years, ProTek Devices™ is a privately-held company located in Tempe, Arizona, that offers a product line of tran- sient voltage suppressors (TVS); avalanche breakdown diodes; steering diode TVS arrays and other surge suppressor component products. These TVS devices protect electronic systems from the effects of lightning, electrostatic discharge (ESD), nuclear electromagnetic pulses (NEMP), inductive switching and EMI / RFI. ProTek Devices also offers high performance interface and linear products that include analog switches; multiplexers; LED drivers; audio control ICs; RF and related high frequency products. The analog devices work in a host of con- sumer; industrial; automotive and other applications. ContaCt us Corporate headquarters

2929 South Fair Lane

Tempe, Arizona 85282 USA By telephone General: 602-431-8101 Sales: & Marketing: 602-414-5109 Customer Service: 602-414-5114 Product Technical Support: 602-414-5107 By Fax General: 602-431-2288 By e-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com Protek Devices (asia Pacific) Pte. ltd.

8 Ubi Road 2, #06-19

Tel: +65-67488312 Fax: +65-67488313 web www.protekdevices.com