OPT101 TI | Alldatasheet
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1 M/c87
/c108 VB 7.5 mV Wavelength (nm) 200 300 400 500 600 700 800 900 1000 1100 Voltage Output (V/µW) Using Internal 1-M Resistor/c87 InfraredUltraviolet BlueGreenYellowRed 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Photodiode Responsivity (A/W) Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community OPT101 SBBS002B –JANUARY 1994–REVISED JUNE 2015 OPT101MonolithicPhotodiodeandSingle-SupplyTransimpedanceAmplifier
1 Features 3 Description
The OPT101 is a monolithic photodiode with on-chip 1• Single Supply: 2.7 to 36 V
- Internal 1-MΩ Feedback Resistor encountered in discrete designs, such as leakage current errors, noise pick-up, and gain peaking as a• High Responsivity: 0.45 A/W (650 nm) result of stray capacitance. Output voltage increases• Bandwidth: 14 kHz at RF = 1 MΩ linearly with light intensity. The amplifier is designed
- Low Quiescent Current: 120 μA for single or dual power-supply operation.
- Packages: Clear Plastic 8-pin PDIP and J-Lead The 0.09 inch × 0.09 inch (2.29 mm × 2.29 mm)SOP photodiode operates in the photoconductive mode for excellent linearity and low dark current. 2 Applications The OPT101 operates from 2.7 V to 36 V supplies
- Medical Instrumentation and quiescent current is only 120 μA. This device is available in clear plastic 8-pin PDIP, and J-lead SOP• Laboratory Instrumentation for surface mounting. The temperature range is 0°C• Position and Proximity Sensors to 70°C.• Photographic Analyzers
- Barcode Scanners Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM)• Smoke Detectors PDIP (8) 9.53 mm × 6.52 mm• Currency Changers OPT101 SOP (8) 9.52 mm × 6.52 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Block Diagram Spectral Responsivity An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com Table of Contents
4 Revision History
Changes from Revision A (October 2003) to Revision B Page
- Added Pin Functions, ESD Ratings, Recommended Operating Conditions, and Thermal information tables, and Parameter Measurement Information, Detailed Description, Application and Implementation, Power-Supply
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Product Folder Links: OPT101
–In 1M Feedback/c87 Common NC NC Output (1) OPT101 www.ti.com SBBS002B –JANUARY 1994–REVISED JUNE 2015
5 Pin Configuration and Functions
(1) Photodiode location. Pin Functions PIN I/O DESCRIPTION NO. NAME 1 VS Power Power supply of device. Apply 2.7 V to 36 V relative to –V pin. Negative input of op amp and the cathode of the photodiode. Either do not connect, or apply2 –In Input additional op amp feedback. Most negative power supply. Connect to ground or a negative voltage that meets the recommended3 –V Power operating conditions. 4 1MΩ Feedback Input Connection to internal feedback network. Typically connect to Output, pin 5. 5 Output Output Output of device.
6 NC — Do not connect
7 NC — Do not connect
8 Common Input Anode of the photodiode. Typically, connect to ground. Copyright © 1994–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: OPT101
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage (VS to Common pin or –V pin) 0 36 V Output short-circuit (to ground) Continuous Operating –25 85 °C Temperature Junction 85 °C Storage, Tstg –25 85 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY Operating voltage 2.7 36 V TEMPERATURE Specified 0 70 °C Operating 0 70 °C
6.4 Thermal Information
THERMAL METRIC(1) DTL (SOP) NTC (PDIP) UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 138.6 128.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 96.4 113.1 °C/W RθJB Junction-to-board thermal resistance 126.6 107.0 °C/W ψJT Junction-to-top characterization parameter 17.8 24.2 °C/W ψJB Junction-to-board characterization parameter 118.8 105.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: OPT101
www.ti.com SBBS002B –JANUARY 1994–REVISED JUNE 2015
6.5 Electrical Characteristics
At TA = 25°C, VS = 2.7 V to 36 V, λ = 650 nm, internal 1-MΩ feedback resistor, and RL = 10 kΩ (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RESPONSIVITY Photodiode current 0.45 A/W Voltage output 0.45 V/µW Voltage output vs temperature 100 ppm/°C Unit-to-unit variation ±5% Nonlinearity(1) Full-scale (FS) output = 24 V ±0.01 % of FS 0.090 in × 0.090 in 0.008 in2 Photodiode area 2.29 mm × 2.29 mm 5.2 mm2 DARK ERRORS, RTO(2) Offset voltage, output 5 7.5 10 mV Offset voltage vs temperature ±10 µV/°C Offset voltage vs power supply VS = 2.7 V to 36 V 10 100 µV/V fB = 0.1 Hz to 20 kHz, VS = 15 V,Voltage noise, dark 300 µVrmsVPIN3 = –15 V TRANSIMPEDANCE GAIN Resistor 1 MΩ Tolerance ±0.5% ±2% Tolerance vs temperature ±50 ppm/°C FREQUENCY RESPONSE Bandwidth VOUT = 10 VPP 14 kHz Rise and fall time 10% to 90%, VOUT = 10-V step 28 µs to 0.05%, VOUT = 10-V step 160 µs Settling time to 0.1%, VOUT = 10-V step 80 µs to 1%, VOUT = 10-V step 70 µs Overload recovery 100%, return to linear operation 50 µs OUTPUT Voltage output, high (VS) – 1.3 (VS) – 1.15 V Capacitive load, stable operation 10 nF Short-circuit current VS = 36 V 15 mA POWER SUPPLY Dark, VPIN3 = 0 V 120 µA Quiescent current RL = ∞, VOUT = 10 V 220 µA (1) Deviation in percent of full scale from best-fit straight line. (2) Referred to output. Includes all error sources. Copyright © 1994–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPT101
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com
6.6 Electrical Characteristics: Photodiode
At TA = 25°C and VS = 2.7 V to 36 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.090 in × 0.090 in 0.008 in2 Photodiode area 2.29 mm × 2.29 mm 5.2 mm2
0.45 A/W
Current responsivity λ = 650 nm (µA/W)/cm865 2 Dark current VDIODE = 7.5 mV 2.5 pA Dark current vs temperature VDIODE = 7.5 mV Doubles every 7°C — Capacitance 1200 pF
6.7 Electrical Characteristics: Op Amp(1)
At TA = 25°C, VS = 2.7 V to 36 V, λ = 650 nm, internal 1-MΩ feedback resistor, and RL = 10 kΩ (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT Offset voltage ±0.5 mV vs temperature ±2.5 µV/°C vs power supply 10 µV/V Input bias current (–) input 165 pA vs temperature (–) input Doubles every 10°C — Differential 400 || 5 MΩ || pF Input impedance Common-mode 250 || 35 GΩ || pF Common-mode input voltage range Linear operation 0 to (VS – 1) V Common-mode rejection 90 dB OPEN-LOOP GAIN Open-loop voltage gain 90 dB FREQUENCY RESPONSE Gain bandwidth product(2) 2 MHz Slew rate 1 V/µs 0.05% 8.0 µs Settling time 0.1% 7.7 µs 1% 5.8 µs OUTPUT Voltage output, high (VS) – 1.3 (VS) – 1.15 V Short-circuit current VS = 36 V 15 mA POWER SUPPLY Dark, VPIN3 = 0 V 120 µA Quiescent current RL = ∞, VOUT = 10 V 220 µA (1) Op amp specifications provided for information and comparison only. (2) Stable gains ≥ 10 V/V.
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Product Folder Links: OPT101
6.8 Typical Characteristics
Figure 1. Normalized Spectral Responsivity Figure 2. Voltage Responsivity vs Radiant Power Figure 4. Voltage Responsivity vs FrequencyFigure 3. Voltage Responsivity vs Irradiance Figure 5. Response vs Incident Angle Figure 6. Dark VOUT vs Temperature
Figure 7. Quiescent Current vs Temperature Figure 8. Quiescent Current vs (VOUT – VPIN3) Figure 9. Short-Circuit Current vs VS Figure 10. (IBIAS – IDARK) vs Temperature Figure 11. Output Noise Voltage vs Measurement Bandwidth Figure 12. Noise Effective Power vs Measurement
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7 Parameter Measurement Information
7.1 Light Source Positioning and Uniformity
The OPT101 is tested with a light source that uniformly illuminates the full area of the integrated circuit, including the op amp. Although the silicon of integrated circuit (IC) amplifiers is light-sensitive to some degree, the OPT101 op amp circuitry is designed to minimize this effect. Sensitive junctions are shielded with metal, and the photodiode area is very large relative to the op amp input circuitry. If the light source is focused to a small area, be sure that it is properly aimed to fall on the photodiode. A narrowly-focused beam falling only on the photodiode provides improved settling times compared to a source that uniformly illuminates the full area of the die. If a narrowly-focused light source misses the photodiode area and falls only on the op amp circuitry, the OPT101 does not perform properly. The large 0.09-in × 0.09-in (2.29 mm × 2.29 mm) photodiode area allows easy positioning of narrowly-focused light sources. The photodiode area is easily visible because the area appears very dark compared to the surrounding active circuitry. The incident angle of the light source also effects the apparent sensitivity in uniform irradiance. For small incident angles, the loss in sensitivity is simply due to the smaller effective light gathering area of the photodiode (proportional to the cosine of the angle). At a greater incident angle, light is diffracted and scattered by the package. These effects are shown in Figure 5.
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Product Folder Links: OPT101
/c108 VB 7.5 mV OPT101 www.ti.com SBBS002B –JANUARY 1994–REVISED JUNE 2015
8 Detailed Description
8.1 Overview
The OPT101 is a large-area photodiode integrated with an optimized operational amplifier that makes the OPT101 a small, easy-to-use, light-to-voltage device. The photodiode has a very large measurement area that collects a significant amount of light, and thus allows for high-sensitivity measurements. The photodiode has a wide spectral response with a maximum peak in the infrared spectrum, and a useable range from 300 nm to 1100 nm. The wide power-supply range of 2.7 V to 36 V makes this device useful in a variety of architectures; from all-analog circuits to data conversion base circuits. The on-chip voltage source keeps the amplifier in a good operating region, even at low light levels. The OPT101 voltage output is the product of the photodiode current times the feedback resistor, (IDRF), plus a pedestal voltage, VB, of approximately 7.5 mV introduced for single-supply operation. Output is 7.5 mV dc with no light, and increases with increasing illumination. Photodiode current, ID, is proportional to the radiant power, or flux, (in watts) falling on the photodiode. At a wavelength of 650 nm (visible red) the photodiode responsivity, RI, is approximately 0.45 A/W. Responsivity at other wavelengths is shown in Figure 1. The internal feedback resistor is laser trimmed to 1 MΩ. Using this resistor, the output voltage responsivity, RV, is approximately 0.45 V/μW at 650-nm wavelength. See Figure 2 for the response throughout a wide range of radiant power in microwatts. Figure 3 shows the response throughout a wide range of irradiance in watts per square meter.
8.2 Functional Block Diagram
Copyright © 1994–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: OPT101
8.3 Feature Description
8.3.1 Dark Performance
because this node has signal-dependent currents. Figure 17. Dark Error (Offset) Adjustment Circuit
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8.3.2 Feedback Network and Dynamic Response
identical large-signal and small-signal response.
- tr is the rise time (10% to 90%)
- fC is the –3dB bandwidth (1)
8.3.2.1 Changing Responsivity
V/A when using external resistors that are less than 1 MΩ. Figure 18. Changing Responsivity with External Resistor in Series with Internal Resistor Table 1. Responsivity and Bandwidth for Figure 18
Figure 19. Changing Responsivity with External Resistor Only (Internal Resistor Disabled) Table 2. Responsivity and Bandwidth for Figure 19 (1) May require 1 kΩ in series with pin 5 when driving large capacitances. sure that the op amp output remains in the linear operating region when the photodiode is not exposed to light. information discussed in the Dark Performance section and Figure 10 to analyze the desired configuration.
8.3.3 Noise Performance
μVrms. This decreased bandwidth enables a low-level signal to be resolved. large feedback resistance, if decreased bandwidth is acceptable to the application.
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or W/√Hz to convey spectral information about the noise. Figure 12 illustrates the NEP for the OPT101.
8.3.4 Linearity Performance
power, but nonlinearity increases to several percent in this region. This very linear performance at high radiant power assumes that the full photodiode area is uniformly illuminated. If the light source is focused to a small area of the photodiode, nonlinearity occurs at lower radiant power.
8.3.5 Capacitive Load Drive
in Figure 15 and Figure 16. These figures compare operation with pin 3 (–V) grounded and connected to –15 V. Figure 20. Bipolar Power-Supply Circuit Connections current increases by approximately 100 μA, as shown in Figure 8.
8.4 Device Functional Modes
V. The maximum power supply voltage for the OPT101 is 36 V.
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
close to the device pins as shown. Figure 21. Basic Circuit Connections
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9.2 Typical Applications
9.2.1 Color and Reflective Wavelength Tester
material by determining the optical reflection, transmission, or absorption properties at particular wavelengths. These test materials can be solid objects, biological or chemical liquids, or any other type of material. wavelengths, that are appropriate for the objective of that application. Figure 22. Fixture for Measurement of Optical Reflective Properties of a Test Material
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 3 as the input design requirement parameters. Table 3. Design Parameters
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com
9.2.1.2 Detailed Design Procedure
This design illuminates a test material with specific wavelengths, and measures the resulting reflection. Choose an RGB LED that sequentially creates individual red, green, and blue wavelengths. Red material has a strong reflection of red wavelengths, and a weaker reflection of green and blue wavelengths. Green and blue materials follow a similar pattern, reflecting the respective primary color wavelengths stronger than other color wavelengths. Design a fixture with a chamber that allows the RGB LED to illuminate the test material and allows the OPT101 to receive the resulting reflection, as shown in Figure 22. Design the chamber to keep out ambient light from the room. Line the chamber with a matte black foil so that the chamber walls absorb as much light as possible. The matte black foil helps the OPT101 sensor measure reflections primarily from the test material and only minimally from the chamber walls. Design a baffle structure between the RGB LED and the OPT101 sensor so that light does not transmit directly from the RGB LED to the OPT101 sensor without reflecting off of the test material. Place an additional enclosure over the chamber to enhance the isolation from any light in the room. Drive the OPT101 power supply pin, VS, with a 5-V power supply, and measure the output pin voltage with a voltmeter. This voltmeter can easily be replaced with an ADC. Choose LED drive currents for each of the RGB LEDs. Throughout this procedure, either drive each LED with this specific chosen current, or do not drive the LED at all. Choose an LED drive current that equalizes the power dissipation (the drive current times the forward-biased voltage drop across each LED). This equal power dissipation minimizes thermal transient settling time when switching between the LEDs. This equal power dissipation is not a requirement if test speed and settling time are not an issue for the application. Calibrate the fixture by measuring a standard white card as a test material. Drive the red LED, and record the resulting voltage from the OPT101. Repeat this procedure with the green and blue LEDs. Next, measure a test material with the same procedure used for the white card. Normalize the results by dividing the test material result by the white card result for each LED. Determine the color of the object by selecting the largest of the three LED normalized measurements. Perform an additional normalization step for data clarity by dividing each of the three LED measurements by the largest of the three measurements.
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Product Folder Links: OPT101
9.2.1.3 Application Curves
test results are very similar to each other, as expected (within 10% of each other). Figure 23. Normalized Reflections for Red Materials Figure 24. Normalized Reflections for Blue Materials Figure 25. Normalized Reflections for Green Materials Figure 26. Normalized Reflections for Neutral Materials
0.1 F μ
9.2.2 Three-Wire Remote Light Measurement
wire light measurement circuit. Figure 27. Three-Wire Remote Light Measurement
9.2.3 Differential Light Measurement
Use a configuration similar to Figure 28 for applications that sense light gradients or differential light. Figure 28. Differential Light Measurement
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0.03 Fμ11 k/c87
9.2.4 LED Output Regulation Circuit
degrades, this circuit increases the LED drive current to keep the output at the appropriate constant level. Figure 29. LED Output Regulation Circuit
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com
9.3 Dos and Don'ts
As with any optical product, special care must be taken into consideration when handling the OPT101. Although the OPT101 has low sensitivity to dust and scratches, proper optical device handling procedures are still recommended. The optical surface of the device must be kept clean for optimal performance in both prototyping with the device and mass production manufacturing procedures. Tweezers with plastic or rubber contact surfaces are recommended to avoid scratches on the optical surface. Avoid manipulation with metal tools when possible. The optical surface must be kept clean of fingerprints, dust, and other optical-inhibiting contaminants. If the device optical surface requires cleaning, use deionized water or isopropyl alcohol. A few gentile brushes with a soft swab are appropriate. Avoid potentially abrasive cleaning and manipulating tools and excessive force that can scratch the optical surface. If the OPT101 performs less than optimally, inspect the optical surface for dirt, scratches, or other optical artifacts. Any light falling on the op amp circuitry area must be uniform; see the Parameter Measurement Information section for more information about light uniformity.
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Product Folder Links: OPT101
10 Power-Supply Recommendations
additional bypass capacitor between VS (pin 1) and Common (pin 8).
11 Layout
11.1 Layout Guidelines
Make all power connections with short, low impedance connections. for easier mounting of any required optical-mechanical structures around the OPT101.
11.2 Layout Example
Figure 30. Layout Example
SBBS002B –JANUARY 1994–REVISED JUNE 2015 www.ti.com
12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Moisture Sensitivity and Soldering
Clear plastic does not contain the structural-enhancing fillers used in black plastic molding compound. As a result, clear plastic is more sensitive to environmental stress than black plastic. This can cause difficulties if devices have been stored in high humidity prior to soldering. The rapid heating during soldering can stress wire bonds and cause failures. Prior to soldering, it is recommended that plastic devices be baked-out at 85°C for 24 hours. The fire-retardant fillers used in black plastic are not compatible with clear molding compound. The OPT101 plastic packages cannot meet flammability test, UL-94.
12.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: OPT101
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) OPT101P Active Production PDIP (NTC) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 OPT101 OPT101P-J Active Production SOP (DTL) | 8 50 | TUBE Yes NIPDAU Level-4-250C-72 HR 0 to 70 OPT101 OPT101P-J.A Active Production SOP (DTL) | 8 50 | TUBE Yes NIPDAU Level-4-250C-72 HR 0 to 70 OPT101 OPT101P.A Active Production PDIP (NTC) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 OPT101 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) OPT101P NTC PDIP 8 50 509 15.24 12.32 4.57 OPT101P-J DTL SOP 8 50 530.5 14.8 7.7 5.5 OPT101P.A NTC PDIP 8 50 509 15.24 12.32 4.57 Pack Materials-Page 1
MPDI059 – APRIL 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 NTC (R-PDIP-T8) PLASTIC DUAL-IN-LINE 4202487/A 03/01 0.390 (9,91) 0.360 (9,14) 0.238 (6,05) 0.275 (6,99) 0.300 (7,62) 0.325 (8,26) 0.008 (0,20) 0.015 (0,38) 5.5°–8.5° 0.100 (2,54) 0.120 (3,05) 0.120 (3,05) 0.135 (3,43) 0.015 (0,38) MIN 0.070 (1,78) 0.045 (1,14) 0.005 (0,13) MIN 4 PL 1/2 Lead 0.030 (0,762) 0.045 (1,143) 4 PL 0.014 (0,36) 0.022 (0,56) Base Plane Seating Plane Index Area – C – 0.100 (2,54) 0.010 (0,25) 0.160 (4,06) 0.115 (2,92) 0.165 (4,19) MAX 0.300 (7,63) 0.430 (10,92) MAX 0.060 (1,52) MAX Polished Surface CM Photodiode Area E F F C C H D H D L D C E NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Dimensions are measured with the package seated in JEDEC seating plane gauge GS-3. D. Dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 (0,25). E. Dimensions measured with the leads constrained to be perpendicular to Datum C. F. Dimensions are measured at the lead tips with the leads unconstrained. G. Pointed or rounded lead tips are preferred to ease insertion. H. Maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 (0,25). I. Distance between leads including dambar protrusions to be 0.005 (0,13) minumum. J. A visual index feature must be located within the cross–hatched area. K. For automatic insertion, any raised irregularity on the top surface (step, mesa, etc.) shall be symmetrical about the lateral and longitudinal package centerlines. L. Center of photodiode must be within 0.010 (0,25) of center of photodiode area
www.ti.com PACKAGE OUTLINE C 6X 2.54 2X 7.62 4X 1.14 0.76 4X 1.78 1.148X 0.56 0.36
4.95 MAX
0.13 MIN
10.54 MAX
8.22 7.58 9.141 8.633 TYP0.945 0.796
10.54 MAX TYP
A NOTE 3 9.91 9.14 B 6.99 6.05 (2.62) TYP (3.24) 4220739/B 02/2016 SOP - 4.95 mm max heightDTL0008A PLASTIC SMALL OUTLINE NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 4. For automatic insertion, any raised irregularity on the top surface (step, mesa, etc.) shall be symmetrical about the lateral and longitudinal package centerlines. 5. Center of the photodiode must be within 0.25 of the center of the photodiode area. 6. The mold compoud for this package is clear. 1 8
0.25 C A B
SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT (9.2)
0.07 MAX
0.07 MIN
8X (2.1) 8X (0.65) 6X (2.54) (R ) TYP 0.05 4220739/B 02/2016 SOP - 4.95 mm max heightDTL0008A PLASTIC SMALL OUTLINE SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 4 5 NOTES: (continued) 7. Publication IPC-7351 may have alternate designs. 8. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (9.2) 6X (2.54) 8X (0.65) 8X (2.1) (R ) TYP0.05 4220739/B 02/2016 SOP - 4.95 mm max heightDTL0008A PLASTIC SMALL OUTLINE NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SYMM SYMM 4 5 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X
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