OP900SL TTELEC | Alldatasheet
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© TT electronics plc Issue A 08/2016 Page 1 OPTEK Technology, Inc.
1645 Wallace Drive, Carrollton, TX 75006|Ph: +1 972 323 2200
www.optekinc.com | www.ttelectronics.com General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. Description: Each OP900SL consists of a PN junction silicon photodiode mounted in a miniature glass-lensed hermetically sealed “pill” package. The lensing effect allows an acceptance half-angle of 18°, when measured from the optical axis to the half-power point. The OP900SL is mechanically and spectrally matched to the OP123 series emitters. Please refer to Application Bulletins 208 and 210 for additional design information and reliability (degradation) data, and to Application Bulletin 202 for pill-type soldering to PCBoard. Applications:
- Non-contact reflecƟve object sensor
- Assembly line automaƟon
- Machine automaƟon
- Machine safety
- End of travel sensor
- Door sensor Features:
- Narrow receiving angle
- Enhanced temperature range
- Ideal for direct mounƟng to PCBoard
- Fast switching speed
- Linear response vs.irradiance
- Mechanically and spectrally matched to OP123 emiƩers Part Number Sensor Viewing Angle OP900SL Photodiode 35° Ordering InformaƟon Pin # Sensor
1 Collector / Cathode
2 Emitter / Anode
[MILLIMETERS]DIMENSIONS ARE IN: RoHS
© TT electronics plc General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. PN Silicon Photodiode OP900SL Issue A 08/2016 Page 2 OPTEK Technology, Inc. www.optekinc.com | www.ttelectronics.com Absolute Maximum Ratings (TA = 25° C unless otherwise noted) Reverse Voltage 100 V OperaƟng Temperature Range -65° C to +150° C Storage Temperature Range -65° C to +125° C Lead Soldering Temperature [1/16 inch (1.6 mm) from the case for 5 seconds with soldering iron] 260° C(1) Power DissipaƟon 50 mW(2) Electrical Specifications Electrical Characteristics (TA = 25° C unless otherwise noted) SYMBOL PARAMETER MIN TYP MAX UNITS TEST CONDITIONS IL Light Current 8 14 - µA VR = 10 V, EE = 20 mW/cm2 (3)(4) ID Dark Current - - 10 nA VR = 10 V, EE = 0(3) V(BR)R Reverse Voltage Breakdown 100 150 - V IR = 100 μA tr Rise Time - 100 - ns tf Fall Time - 100 - VR = 50 V, IL = 8 µA, RL = 1 kΩ (see test circuit) Notes: (1) RMA flux is recommended. Duration can be exten ded to 10 seconds maximum when flow soldering. (2) Derate linearly 0.5 mW/° C above 25° C. (3) Junction temperature maintained at 25° C. (4) Light source is an unfiltered tungsten bulb operati ng at CT = 2870 K or equivalent infrared source..
© TT electronics plc General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. PN Silicon Photodiode OP900SL Issue A 08/2016 Page 3 OPTEK Technology, Inc. www.optekinc.com | www.ttelectronics.com Performance OP900SL