OP32B102K500CT

OP31B102K201CT WALSIN | Alldatasheet

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Multilayer Ceramic Capacitors Approval Sheet Page 1 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 *Contents in this sheet are subject to change without prior notice. MULTILAYER CERAMIC CAPACITORS Open-Mode Series (50V to 630V) 0805 to 1812 Sizes X7R Dielectric Halogen Free & RoHS Compliance

Multilayer Ceramic Capacitors Approval Sheet Page 2 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 1. INTRODUCTION WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation. 4. HOW TO ORDER OP 31 B 102 K 201 C T Series OP =Open-mode Size 21 =0805 (2012) 31 =1206 (3216) 32 =1210 (3225) 43 =1812 (4532) Dielectric B =X7R Capacitance Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: 102=10x10 =1000pF Tolerance K =±10% M =±20% Rated voltage Two significant digits followed by no. of zeros. And R is in place of decimal point. 500 =50 VDC 101 =100 VDC 201 =200 VDC 251 =250 VDC 501 =500 VDC 631=630 VDC Termination C =Cu/Ni/Sn Packaging T=7” reeled G =13” reeled 2. FEATURES a. High voltage in a given case size. b. Circuit open during product cracking. c. High stability and reliability. 3. APPLICATIONS a. High current applications. b. Power supply and related industries c. The other mechanical stress concerned products.

Multilayer Ceramic Capacitors Approval Sheet Page 3 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 5. EXTERNAL DIMENSIONS 6. GENERAL ELECTRICAL DATA Dielectric X7R Size 0805, 1206, 1210, 1812 Capacitance* 100pF to 1µF Capacitance tolerance K (±10%), M (±20%) Rated voltage (WVDC) 50V, 100V, 200V, 250V, 500V, 630V Dielectric strength 50V,100V: ≥2.5 x WVDC 200V and 250V: ≥2 x WVDC 500V,630V: ≥1.5 x WVDC Operating temperature -55 to +125° C Capacitance characteristic ±15% Termination Ni/Sn (lead-free termination) Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° C for 1 hour, then leave in ambient condition for 24±2 hours before measurement. T W L MB MB Fig. 1 The outline of MLCC Size Inch (mm) L (mm) W (mm) T (mm)/Symbol Remark M B (mm) 0.80±0.10 B 1.25±0.10 D # 1210 (3225) 2.50±0.30 M # # Reflow soldering only is recommended.

Multilayer Ceramic Capacitors Approval Sheet Page 4 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 7. CAPACITANCE RANGE DIELECTRIC X7R SIZE 0805 1206 1210 1812 RATED VOLTAGE 100 200 250 500 630 50 100 200 250 500 630 100 200 250 500 630 100 200 250 500 630 Capacitance 100pF (101) B B B B B 120pF (121) B B B B B 150pF (151) B B B B B B B D D D D 180pF (181) B B B B B B B D D D D 220pF (221) B B B B B B B D D D D 270pF (271) B B B B B B B D D D D 330pF (331) B B B B B B B D D D D 390pF (391) B B B B B B B D D D D 470pF (471) B B B B B B B D D D D 560pF (561) B B B B B B B D D D D 680pF (681) B B B B B B B D D D D 820pF (821) B B B B B B B D D D D 1,000pF (102) B B B B B B B D D D D C C C D D D D D D D 1,200pF (122) B B B B B B B D D D D C C C D D D D D D D 1,500pF (152) B B B B B B B D D D D C C C D D D D D D D 1,800pF (182) B B B B B B B D D D D C C C D D D D D D D 2,200pF (222) B B B B B B B D D D D C C C D D D D D D D 2,700pF (272) B B B B B B B D D D D C C C D D D D D D D 3,300pF (332) B B B B B B B D D D D C C C D D D D D D D 3,900pF (392) B B B B B D D D D C C C D D D D D D D 4,700pF (472) B B B B B D D D D C C C D D D D D D D 5,600pF (562) B D D B B D D D D C C C D D D D D D D 6,800pF (682) B D D B B D D D D C C C D D D D D D D 8,200pF (822) B D D B B D D D D C C C D D D D D D D 0.010 µF (103) B D D B B D D D D C C C D D D D D D D 0.012 µF (123) B D D B B D D D D C C C D D D D D D D 0.015 µF (153) B D D B B D D D D C C C D D D D D D D 0.018 µF (183) B D D B B D D D D C C C D D D D D D D 0.022 µF (223) B D D B B D D G G C C C D D D D D D D 0.027 µF (273) D B B D D G G C C C D D D D D D D 0.033 µF (333) D B B G G G G C C C G G D D D D D 0.039 µF (393) D B B G G C C C G G D D D D D 0.047 µF (473) D B B G G C D D G G D D D D D 0.056 µF (563) B B G G C D D G G D D D K K 0.068 µF (683) B B G G C G G G G D D D K K 0.082 µF (823) D D G G C G G D D D K K 0.10 µF (104) D D G G C G G D D D K K 0.12 µF (124) D D C G G D D D 0.15 µF (154) D G D M M D K K 0.18 µF (184) D G D M M D K K 0.22 µF (224) D G D M M D K K 0.27 µF (274) D G D K K 0.33 µF (334) D G D K K 0.39 µF (394) D M D K K 0.47 µF (474) D M K K K 0.56 µF (564) M K 0.68 µF (684) K 0.82 µF (824) K 1.0 µF (105) K The letter in cell is expressed the symbol of product thickness.

Multilayer Ceramic Capacitors Approval Sheet Page 5 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 8. PACKAGING DIMENSION AND QUANTITY Size Thickness (mm)/Symbol Paper tape Plastic tape 7” reel 13” reel 7” reel 13” reel 0805 0.80±0.10 B 4k 15k - - 1.25±0.10 D - - 3k 10k 1206 0.80±0.10 B 4k 15k - - 0.95±0.10 C - - 3k 10k 1.25±0.10 D - - 3k 10k 1.60±0.20 G - - 2k 10k 1210 0.95±0.10 C - - 3k 10k 1.25±0.10 D - - 3k 10k 2.50±0.30 M - - 1k 6k 1812 1.25±0.10 D - - 1k 5k Unit: pieces 9. INNER CONSTRUCTION OF OPEN-MODE DESIGN CP MB Crack Fig. 2 Normal design (CP<M B) – circuit leakage during cracking. MB CP Crack Fig. 3 Open-mode design (CP>M B) – circuit open during cracking. Crack Fig. 4 Floating design (one kind of open-mode design)– circuit open during cracking.

Multilayer Ceramic Capacitors Approval Sheet Page 6 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Condition Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance 1.0±0.2Vrms, 1kHz±10% *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) * D.F. ≤2.5% * D.F. ≤3% : 50V / ≧1206 0.47 µF 4. Dielectric Strength * To apply voltage: 50V, 100V ≥2.5 times VDC 200V~300V ≥2 times VDC 500V~630V ≥1.5 times VDC * Duration: 1 to 5 sec. * Charge & discharge current less than 50mA. * No evidence of damage or flash over during test. 5. Insulation Resistance 50V, 100V, To apply rated voltage for max. 120 sec. ≥200V, To apply rated voltage for 60 sec. ≥10G Ω or RxC ≥100 Ω-F whichever is smaller. X7R=100V: RxC ≥100 Ω -F 6. Temperature Coefficient With no electrical load. Operating temperature: -55~125° C at 25° C *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. Within ±15%. 7. Adhesive Strength of Termination * Pressurizing force ： 5N ( ≤0603) and 10N (>0603) * Test time: 10±1 sec. * No remarkable damage or removal of the terminations. 8. Vibration Resistance * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. *Cap./DF(Q) Measurement to be made after de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change and Q/D.F.: To meet initial spec. Solderability * Solder temperature: 235±5° C * Dipping time: 2±0.5 sec. 95% min. coverage of all metalized area. 10. Bending Test * The middle part of substrate shall be pressurized by means of the p ressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: X7R: within ±12.5% (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to Soldering Heat * Solder temperature: 260±5° C * Dipping time: 10±1 sec * Preheating: 120 to 150° C for 1 minute before immerse the capacitor in a eutectic solder. *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. *Cap. / DF(Q) / I.R. Measurement to be made after de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: X7R: within ±7.5% * 25% max. leaching on each edge.

Multilayer Ceramic Capacitors Approval Sheet Page 7 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 No. Item Test Condition Requirements 12. Temperature Cycle * Conduct the five cycles according to the temperatures and time. Step Temp. (° C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change ：within ±7.5% 13. Humidity (Damp Heat) Steady State * Test temp.: 40±2° C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. *Before initial measurement (Class II only): To apply de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±12.5% * Q/D.F. value: D.F. ≤3.0% D.F. ≤6% : 50V / ≧1206 0.47 µF * I.R.: ≥1G Ω or RxC ≥50 Ω-F whichever is smaller. X7R=100V: RxC ≥10 Ω-F 14. Humidity (Damp Heat) Load * Test temp.: 40±2° C * Humidity: 90~95%RH * Test time: 500+24/-0 hrs. * To apply voltage ：rated voltage (Max. 500V) *Before initial measurement (Class II only): To apply de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±12.5% * Q/D.F. value: D.F. ≤3.0% D.F. ≤6% : 50V / ≧1206 0.47 µF * I.R.: ≥500M Ω or RxC ≥25 Ω-F whichever is smaller. X7R=100V: RxC ≥5Ω-F 15. High Temperature Load (Endurance) * Test temp.: X7R: 125±3° C * To apply voltage: (1) V<500V: 200% of rated voltage. (2) 500V~630V: 150% of rated voltage. * Test time: 1000+24/-0 hrs. *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±12.5% * Q/D.F. value: D.F. ≤3.0% D.F. ≤6% : 50V / ≧1206 0.47 µF * I.R.: ≥1G Ω or RxC ≥50 Ω-F whichever is smaller. X7R=100V: RxC ≥10 Ω-F

Multilayer Ceramic Capacitors Approval Sheet Page 8 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 APPENDIXES ◙ Tape & reel dimensions Size 0805 1206 1210 1812 Thickness B C, D, I B C, D G C, D G D, K, M A0 1.50 B 0 2.30 T ≦1.20 0.23 +/-0.1 ≦1.20 0.23 +/-0.1 0.23 +/-0.1 0.23 +/-0.1 0.23 +/-0.1 0.23 +/-0.1 W 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 P0 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 10xP 0 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 P1 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 P2 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 D 0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 D 1 - 1.00 +/-0.10 - 1.00 +/-0.10 1.00 +/-0.10 1.00 +/-0.10 1.00 +/-0.10 1.00 +/-0.10 E 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 F 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 Fig. 6 The dimension of plastic tape Fig. 7 The dimension of reel Fig. 5 The dimension of paper tape Size 0603, 0805, 1206, 1210 1808, 1812 Reel size 7” 10” 13” 7”

Multilayer Ceramic Capacitors Approval Sheet Page 9 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 ◙ Example of customer label *Customized label is available upon request ◙ Constructions ◙ Storage and handling conditions (1) To store products at 5 to 40 °C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. Fig. 8 The construction of MLCC a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label No. Name X7R

1 Ceramic material BaTiO 3 based

2 Inner electrode Ni

4 Middle layer Ni

5 Outer layer Sn (Matt)

Multilayer Ceramic Capacitors Approval Sheet Page 10 of 10 ASC_ Open Mode_(OP)_012Q_AS Dec. 2018 ◙ Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N 2 within oven are recommended. Fig. 9 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. 4℃℃ ℃℃/ sec max Over 60sec at least by natural cooling 4℃℃ ℃℃/ sec max Over 60sec at least by natural cooling Fig. 10 Recommended wave soldering profile for SMT process with SnAgCu series solder.