OP07C_06 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
/C0079/C0080/C0048/C0055/C0067/C0044 /C0079/C0080/C0048/C0055/C0068 /C0080/C0082/C0069/C0067/C0073/C0083/C0073/C0079/C0078 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 SLOS099E − OCTOBER 1983 − REVISED MAY 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Low Noise /C0068No External Components Required /C0068Replace Chopper Amplifiers at a Lower Cost /C0068Wide Input-Voltage Range ...0 t o ±14 V Typ /C0068Wide Supply-Voltage Range ...±3 V to ±18 V description/ordering information These devices offer low offset and long-term stability by means of a low-noise, chopperless, bipolar-input-transistor amplifier circuit. For most applications, external components are not required for offset nulling and frequency compensation. The true differential input, with a wide input-voltage range and outstanding common-mode rejection, provides maximum flexibility and performance in high-noise environments and in noninverting applications. Low bias currents and extremely high input impedances are maintained over the entire temperature range. The OP07 is unsurpassed for low-noise, high-accuracy amplification of very-low-level signals. These devices are characterized for operation from 0°C to 70°C.
ORDERING INFORMATION
TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP (P) Tube of 50 OP07CP OP07CP PDIP (P) Tube of 50 OP07DP OP07DP 0°C to 70°C Tube of 75 OP07CD OP07C0°C to 70°C SOIC (D) Reel of 2500 OP07CDR OP07C SOIC (D) Tube of 75 OP07DD OP07D Reel of 2500 OP07DDR OP07D † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. symbol OUT OFFSET N2 IN− IN+ OFFSET N1 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OFFSET N1 IN− IN+ VCC− OFFSET N2 V CC+ OUT NC D OR P PACKAGE (TOP VIEW) NC−No internal connection Copyright 2004, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046
/C0079/C0080/C0048/C0055/C0067/C0044 /C0079/C0080/C0048/C0055/C0068 /C0080/C0082/C0069/C0067/C0073/C0083/C0073/C0079/C0078 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 SLOS099E − OCTOBER 1983 − REVISED MAY 2004
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VCC− OFFSET N1 OFFSET N2 IN+ IN− COMPONENT COUNT Resistors Transistors Capacitors absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC− . 2. Differential voltages are at IN+ with respect to IN−. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or to either power supply. 5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7.
/C0079/C0080/C0048/C0055/C0067/C0044 /C0079/C0080/C0048/C0055/C0068 /C0080/C0082/C0069/C0067/C0073/C0083/C0073/C0079/C0078 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 SLOS099E − OCTOBER 1983 − REVISED MAY 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN MAX UNIT VCC ± Supply voltage ±3 ±18 V VIC Common-mode input voltage VCC ± = ±15 V −13 13 V TA Operating free-air temperature 0 70 °C
/C0079/C0080/C0048/C0055/C0067/C0044/C0032/C0079/C0080/C0057/C0055/C0068 /C0080/C0082/C0069/C0067/C0073/C0083/C0073/C0079/C0078/C0032/C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076/C0032/C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 SLOS099E − OCTOBER 1983 − REVISED MAY 2004
4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265•
electrical characteristics at specified free-air temperature, VCC ± = ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS † TA OP07C OP07D UNITPARAMETER TEST CONDITIONS † TA MIN TYP MAX MIN TYP MAX UNIT VIO Input offset voltage VO = 0, R S = 50 Ω 25°C 60 150 60 150 VVIO Input offset voltage V O = 0, R S = 50 Ω 0°C to 70°C 85 250 85 250 µV /C0097V IO Temperature coefficient of input offset voltageVO = 0, R S = 50 Ω 0°C to 70°C 0.5 1.8 0.7 2.5 µV/°C Long-term drift of input offset voltage See Note 6 0.4 0.5 µV/mo Offset adjustment range R S = 20 kΩ, See Figure 1 25°C ±4 ±4 mV IIO Input offset current 25°C 0.8 6 0.8 6 nAIIO Input offset current 0°C to 70°C 1.6 8 1.6 8 nA /C0097IIO Temperature coefficient of input offset current 0°C to 70°C 12 50 12 50 pA/°C IIB Input bias current nAIIB Input bias current 0°C to 70°C ±2.2 ±9 ±3 ±14 nA /C0097IIB Temperature coefficient of input bias current 0°C to 70°C 18 50 18 50 pA/°C VICR Common-mode input voltge range 25°C ±13 ±14 ±13 ±14 VVICR Common-mode input voltge range 0°C to 70°C ±13 ±13.5 ±13 ±13.5 V R L ≥ 10 kΩ ±12 ±13 ±12 ±13 VOM Peak output voltage VVOM Peak output voltage R L ≥ 1 kΩ 25 C ±12 ±12 V R L ≥ 2 kΩ 0°C to 70°C ±11 ±12.6 ±11 ±12.6 AVD Large-signal differential voltage amplification VCC ± = ±3 V , R L ≥ 500 kΩ VO = ±0.5 V, 25°C 100 400 400 V/mVAVD Large-signal differential voltage amplification VO = ±10 V, R L = 2 kΩ 25°C 120 400 120 400 V/mV VO = ±10 V, R L = 2 kΩ 0°C to 70°C 100 400 100 400 B1 Unity-gain bandwidth 25°C 0.4 0.6 0.4 0.6 MHz ri Input resistance 25°C 8 33 7 31 M Ω CMRR Common-mode rejection ratio VIC =±13 V, R S = 50 Ω 25°C 100 120 94 110 dBCMRR Common-mode rejection ratio V IC =±13 V, R S = 50 Ω 0°C to 70°C 97 120 94 106 dB kSVS Supply-voltage sensitivity (∆VIO/∆VCC ) VCC ± =±3 V to ±18 V, 25°C 7 32 7 32 V/VkSVS Supply-voltage sensitivity (∆VIO/∆VCC ) VCC ± =±3 V to ±18 V, R S = 50 Ω 0°C to 70°C 10 51 10 51 µV/V VO = 0, No load 80 150 80 150 PD Power dissipation VCC ± = ±3 V, VO = 0, No load 25°C 4 8 4 8 mW † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise noted. NOTE 7: Since long-term drift cannot be measured on the individual devices prior to shipment, this specification is not intended to be a warranty. It is an engineering estimate of the averaged trend line of drift versus time over extended periods after the first 30 days of operation.
/C0079/C0080/C0048/C0055/C0067/C0044 /C0079/C0080/C0048/C0055/C0068 /C0080/C0082/C0069/C0067/C0073/C0083/C0073/C0079/C0078 /C0079/C0080/C0069/C0082/C0065/C0084/C0073/C0079/C0078/C0065/C0076 /C0065/C0077/C0080/C0076/C0073/C0070/C0073/C0069/C0082/C0083 SLOS099E − OCTOBER 1983 − REVISED MAY 2004 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 operating characteristics, VCC ± = ±15 V, TA = 25°C PARAMETER TEST OP07C OP07D UNITPARAMETER TEST CONDITIONS † TYP TYP UNIT f = 10 Hz 10.5 10.5 Vn Equivalent input noise voltage f = 100 Hz 10.2 10.3 nV/√HzVn Equivalent input noise voltage f = 1 kHz 9.8 9.8 nV/√Hz VN(PP) Peak-to-peak equivalent input noise voltage f = 0.1 Hz to 10 Hz 0.38 0.38 µV f = 10 Hz 0.35 0.35 In Equivalent input noise current f = 100 Hz 0.15 0.15 pA/√HzIn Equivalent input noise current f = 1 kHz 0.13 0.13 pA/√Hz IN(PP) Peak-to-peak equivalent input noise current f = 0.1 Hz to 10 Hz 15 15 pA SR Slew rate R L ≥ 2 kΩ 0.3 0.3 V/µs † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise noted.
APPLICATION INFORMATION
VCC− VCC+ IN− IN+ + OFFSET N1 7 6 20 kΩ OFFSET Figure 1. Input Offset-Voltage Null Circuit
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) OP-07DPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP-07DPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type OP07CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type OP07DD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type OP07DPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) PACKAGE OPTION ADDENDUM www.ti.com 24-Oct-2006 Addendum-Page 1
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 24-Oct-2006 Addendum-Page 2
MPDI001A – JANUARY 1995 – REVISED JUNE 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated