TPS659038-Q1 TI1 | Alldatasheet

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Sample & Buy T echnical Documents Tools & Software Support & Community TPS659038-Q1, TPS659039-Q1 SWCS115B – AUGUST 2013– REVISED OCTOBER 2015 TPS65903x-Q1AutomotivePowerManagementUnit(PMU)forProcessor

1 Device Summary

1.1 Features

Supply• Seven Step-Down Switched-Mode Power Supply (SMPS) Regulators: – One 0.9 to 3.3 V at 50 mA With Preregulated Supply– One 0.7 to 1.65 V at 6 A (10-mV Steps) – One 100-mA USB LDO• Dual-Phase Configuration With Digital – One Low-Noise LDO 0.9 to 3.3 V up to 100 mAVoltage Scaling (DVS) Control (Low Noise Performance up to 50 mA)– One 0.7 to 1.65 V at 4 A (10-mV Steps) – Two Additional LDOs for PMU Internal Use• Dual-Phase Configuration With DVS Control – Short-Circuit Protection– One 0.7 to 3.3 V at 3 A (10 or 20-mV Steps)

  • Clock Management 16-MHz Crystal Oscillator and• Single-Phase Configuration 32-kHz RC Oscillator• This Regulator can be Combined With the 6 – One Buffered 32-kHz OutputA Resulting in a 9 A Triple-Phase Regulator
  • Real-Time Clock (RTC) With Alarm Wake-Up(DVS Controlled) Mechanism– Two 0.7 to 3.3 V at 2 A (10 or 20-mV Steps)
  • 12-bit Sigma-Delta General-Purpose Analog-to-• Single-Phase Configuration Digital-Converter (GPADC) With Three External• One Regulator With DVS Control, Which can Input Channels and Six Internal Channels for Selfalso be Configured as a 3-A Regulator Monitoring– Two 0.7 to 3.3 V at 1 A (10 or 20-mV Steps) • Thermal Monitoring• Single-Phase Configuration – High Temperature Warning• One Regulator With DVS Control – Thermal Shutdown– Output Current Measurement in All Except 1-A • ControlSMPS Regulators – Configurable Power-Up and Power-Down– Differential Remote Sensing (Output and Sequences (One-Time Programmable [OTP] )Ground) in Dual-Phase and Triple-Phase – Configurable Sequences Between the SLEEPRegulators and ACTIVE States (OTP Programmable)– Hardware and Software-Controlled ECO- – One Dedicated Digital Output Signal (REGEN)mode™ up to 5 mA with 15-µA Quiescent that can be Included in the Start-up SequenceCurrent – Three Digital Output Signals MUXed With GPIO– Short-Circuit Protection that can be Included in the Start-up Sequence– Powergood Indication (Voltage and Overcurrent – Selectable Control InterfaceIndication)
  • One Serial Peripheral Interface (SPI) for– Internal Soft-Start for In-Rush Current Limitation Resource Configurations and DVS Control– Ability to synchronize SMPS to External Clock
  • Two I2C Interfaces. One Dedicated for DVSor Internal Fallback Clock With Phase Control, and a General Purpose I2C InterfaceSynchronization for Resource Configuration and DVS Control• Eleven General-Purpose Low Dropout (LDO)
  • Undervoltage LockoutRegulators (50-mV Steps):
  • System Voltage Range from 3.135 to 5.25 V– Two 0.9 to 3.3 V at 300 mA With Preregulated
  • Package OptionsSupply – 12-mm × 12-mm 169-pin nFBGA with 0,8-mm– Six 0.9 to 3.3 V at 200 mA With Preregulated Ball Pitch

1.2 Applications

  • Automotive Infotainment • Automotive Sensor Fusion
  • Automotive Digital Cluster • Programmable Logic Controller An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS659038-Q1, TPS659039-Q1 SWCS115B – AUGUST 2013– REVISED OCTOBER 2015 www.ti.com

1.3 Description

The TPS659038-Q1 and TPS659039-Q1 devices are integrated power-management integrated circuits (PMICs) for automotive applications. The device provides seven configurable step-down converters with up to 6 A of output current for memory, processor core, input-output (I/O), or preregulation of LDOs. One of these configurable step-down converters can be combined with another 3-A regulator to allow up to 9 A of output current. All of the step-down converters can synchronize to an external clock source between 1.7 Mhz and 2.7 MHz, or an internal fall back clock at 2.2 MHz. The TPS659038-Q1 device contains 11 LDO regulators while the TPS659039-Q1 device contains six LDO regulators for external use. These LDO regulators can be supplied from either a system supply or a preregulated supply. The power-up and power-down controller is configurable and supports any power-up and power-down sequences (OTP based). The TPS659038-Q1 and TPS659039-Q1 devices include a 32-kHz RC oscillator to sequence all resources during power up and power down. In cases where a fast start up is needed, a 16-MHz crystal oscillator is also included to quickly generate a stable 32-kHz for the system. All LDOs and SMPS converters can be controlled by the SPI or I2C interface, or by power request signals. In addition, voltage scaling registers allow transitioning the SMPS to different voltages by SPI, I2C, or roof and floor control. One dedicated pin in each package can be configured as part of the power-up sequence to control external resources. General-purpose input-output (GPIO) functionality is available and two GPIOs can be configured as part of the power-up sequence to control external resources. Power request signals enable power mode control for power optimization. The device includes a general-purpose (GP) sigma-delta analog-to-digital converter (ADC) with three external input channels. The TPS659038-Q1 and TPS659039- Q1 device is available in a 13-ball × 13-ball nFBGA package with a 0,8-mm pitch. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS659038-Q1 ZWS (169) 12.00 mm × 12.00 mm TPS659039-Q1 (1) For all available packages, see the orderable addendum at the end of the datasheet.

2 Device Summary Copyright © 2013–2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: TPS659038-Q1 TPS659039-Q1

0.7 to 1.6 V, 10-mV step, 6 A SMPS3 0.7 to 1.6 V, 10-mV step 1 to 3.3 V, 20-mV step, 3 A Dual Phase or Triple Phase SMPS6 0.7 to 1.6 V, 10-mV step 1 to 3.3 V, 20-mV step, 2 or 3 A SMPS8 0.7 to 1.6 V, 10-mV step 1 to 3.3-V, 20-mV step, 1 A SMPS9 0.7 to 1.6 V, 10-mV step 1 to 3.3 V, 20-mV step, 1 A SMPS45 0.7 to 1.6 V, 10-mV step, 4 A SMPS7 0.7 to 1.6 V, 10-mV step 1 to 3.3 V, 20-mV step, 2 A Dual Phase or Triple Phase LDO1 300 mA LDO2 300 mA LDO3 200 mA LDO9 50 mA LDOLN 50 mA LDOUSB 100 mA LDOVRTC 20 mA OTP Controller OTP Registers Registers Power Good Monitor LDO5 200 mA LDO6 200 mA LDO7 200 mA LDO8 170 mA LDO4 200 mA TPS659038-Q1 Only RTC12-Bit GPADC with 3 External Channels VSYS Monitor TPS659038-Q1 TPS659039-Q1 TPS659038-Q1, TPS659039-Q1 www.ti.com SWCS115B –AUGUST 2013– REVISED OCTOBER 2015

1.4 Simplified Block Diagram

1.5 Device Comparison

POWER BREAKDOWN TPS659038-Q1 TPS659039-Q1 Total DC-DC converters 9 9 Total DC-DC converter rails 7 7 LDOs 11 6 0,8-mm pitch 169ZWS 0,8-mm 169ZWSPackage (12 × 12 mm) nFBGA (12 × 12 mm) nFBGA Copyright © 2013–2015, Texas Instruments Incorporated Device Summary 3 Submit Documentation Feedback Product Folder Links: TPS659038-Q1 TPS659039-Q1

TPS659038-Q1, TPS659039-Q1 SWCS115B – AUGUST 2013– REVISED OCTOBER 2015 www.ti.com Table of Contents

4 Table of Contents Copyright © 2013–2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: TPS659038-Q1 TPS659039-Q1

TPS659038-Q1, TPS659039-Q1 www.ti.com SWCS115B –AUGUST 2013– REVISED OCTOBER 2015

2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (August 2014) to Revision B Page Copyright © 2013–2015, Texas Instruments Incorporated Revision History 5 Submit Documentation Feedback Product Folder Links: TPS659038-Q1 TPS659039-Q1

TPS659038-Q1, TPS659039-Q1 SWCS115B – AUGUST 2013– REVISED OCTOBER 2015 www.ti.com

3 Device and Documentation Support

3.1 Documentation Support

3.1.1 Related Documentation

For related documentation see the following: Guide to Using the GPADC in TPS65903x and TPS6591x Devices SLIA087

3.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3-1. Related Links TECHNICAL TOOLS & SUPPORT &PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY TPS659038-Q1 Click here Click here Click here Click here Click here TPS659039-Q1 Click here Click here Click here Click here Click here

3.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

3.4 Trademarks

ECO-mode, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners.

3.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

4 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 6 Mechanical, Packaging, and Orderable Information Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS659038-Q1 TPS659039-Q1

www.ti.com 23-Apr-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples O9038A342IZWSRQ1 PREVIEW NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659038 OTP 42 1.3 O9038A352IZWSRQ1 ACTIVE NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659038 OTP 52 1.3 O9039A344IZWSRQ1 ACTIVE NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659039 OTP 44 1.3 O9039A360IZWSRQ1 ACTIVE NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659039 OTP 60 1.3 O9039A36BIZWSRQ1 ACTIVE NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659039 OTP 6B 1.3 O9039A387IZWSRQ1 ACTIVE NFBGA ZWS 169 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 TPS659039 OTP 87 1.3 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

www.ti.com 23-Apr-2016 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2016 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) O9038A342IZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 O9038A352IZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 O9039A344IZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 O9039A360IZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 O9039A36BIZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 O9039A387IZWSRQ1 NFBGA ZWS 169 0 336.6 336.6 41.3 PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2016 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C

1.4 MAX

TYP0.45 0.35 9.6 TYP

9.6 TYP

0.8 TYP

169X 0.55 0.45 A 12.1 11.9 B 12.1 11.9 (1.2) TYP (1.2) TYP (0.9) PBGA - 1.4 mm max heightZWS0169A PLASTIC BALL GRID ARRAY 4221886/B 09/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.12 C

0.15 C A B

0.05 C SYMM SYMM BALL A1 CORNER C D E F G H J K L M 1 2 3 4 5 6 7 8 9 10 A B 12 13 N SCALE 1.100

www.ti.com EXAMPLE BOARD LAYOUT (0.8) TYP ( ) METAL 0.4 0.05 MAX SOLDER MASK OPENING METAL UNDER SOLDER MASK ( ) SOLDER MASK OPENING 0.4

0.05 MIN

PBGA - 1.4 mm max heightZWS0169A PLASTIC BALL GRID ARRAY 4221886/B 09/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SSZA002 (www.ti.com/lit/ssza002). SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 1 2 3 4 5 6 7 8 9 10 11 B A C D E F G H J K L M N 12 13 NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (0.8) TYP (0.8) TYP ( ) TYP0.4 PBGA - 1.4 mm max heightZWS0169A PLASTIC BALL GRID ARRAY 4221886/B 09/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:8X 1 2 3 4 5 6 7 8 9 10 11 B A C D E F G H J K L M N 12 13

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