VNQ5E080TD1-E STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 23
Technical content
Datasheet sections
- 1 Block diagram and physical characteristics
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Electrical characteristics
- 2.3 Waveforms
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: resistor in the ground line (RGND only)
- 3.1.2 Solution 2: diode (DGND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/Os protection
- 3.4 Current sense and diagnostic
- 4 Package information
- 4.1 ECOPACK ®
- 5 DIE package options
- 6 Revision history
Features
■ General – Inrush current active management by power limitation – Very low standby current – 3.0 V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – Compliance with European directive 2002/95/EC – Very low current sense leakage ■ Diagnostic functions – Proportional load current sense – High current sense precision for wide currents range – Current sense disable – Overload and short to ground (power limitation) indication – Thermal shutdown indication ■ Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Overtemperature shutdown with auto restart (thermal shutdown) – Reverse battery protected
Description
The VNQ5E080TD1-E is a quad channel high-side driver manufactured using ST proprietary VIPower ® M0-5 technology. The VNQ5E080TD1-E is designed to drive 12 V automotive grounded loads, and to provide protection and diagnostics. It also implements a
3 V and 5 V CMOS-compatible interface for use
with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto- restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel providing enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication and overtemperature indication. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to share the external sense resistor with similar devices. Max supply voltage V CC 41 V Operating voltage range V CC 4.5 to 28 V Max on-state resistance (per ch.) R ON 80 mΩ Current limitation (typ) I LIMH 7.5 A at 25 °C Off-state supply current I S 2µ A(1) 1. Typical value with all loads connected Table 1. Device summary
Table 7. Switching (V
1 Block diagram and physical characteristics
Figure 1. Block diagram Figure 2. Pad configuration
Table 2. Pad location (axes origin: center of DIE)
Table 4. Suggested connections for unused and N.C. pins Table 3. Physical characteristics
2 Electrical specifications
2.1 Absolute maximum ratings
2.2 Electrical characteristics
Table 5. Absolute maximum ratings Table 6. Power section
- PowerMOS leakage included
Table 7. Switching (V CC =1 3V ; Tj = 25°C) Table 8. Logic input Table 6. Power section (continued)
Table 9. Protection and diagnostics (1)
- To ensure long term reliability under heavy overload or short circuit conditions, protection and related
abnormal conditions, this software must limit the duration and number of activation cycles. Table 10. Current sense (8 V < V CC < 18 V; -40°C < Tj <1 8 5 ° C ) Table 8. Logic input (continued)
- Guaranteed by design/char acterization on final product.
Table 10. Current sense (8 V < V CC < 18 V; -40°C < Tj < 185°C) (continued)
Figure 6. Delay response time between rising edge of output current and rising Table 11. Truth table
- If the V CSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
Table 12. Electrical transient requirements (part 1/3)
- The above test levels must be considered referred to V CC = 13.5 V except for pulse 5b.
- Valid in case of external load dump clamp: 40 V maximum referred to ground.
Table 13. Electrical transient requirements (part 2/3)
- Valid in case of external load dum p clamp: 40V maximum referred to ground.
Table 14. Electrical transient requirements (part 3/3) C All functions of the device performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.
2.3 Waveforms
Figure 7. Normal operation Figure 8. Overload or short to GND
3 Application information
Figure 11. Application schematic Note: Channel 2, 3, 4 have the same internal circuit as channel 1.
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R GND only)
This can be used with any type of load. The following is an indication on how to size the RGND resistor. maximum rating section of the device datasheet. maximum on-state currents of the different devices.
18/23 Doc ID 018950 Rev. 5 If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2: diode (D GND) in the ground line
A resistor (RGND =1k Ω) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (≈ 600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transients are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the MCU I/O pins from latching-up. The value of these resistors is a compromise between the leakage current of MCU and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of MCU I/Os. CCpeak/Ilatchup ≤ Rprot ≤ (VOHμC -V IH -V GND) / IIHmax Calculation example: For VCCpeak = -100 V and Ilatchup ≥ 20 mA; VOHμC ≥ 4.5 V 5k Ω ≤ Rprot ≤ 180 kΩ. Recommended values: Rprot =10 kΩ, CEXT =10 nF. Obsolete Product(s) - Obsolete Product(s)
3.4 Current sense and diagnostic
- Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a known ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5 V minimum (see parameter VSENSE in Table 10: Current sense (8 V < VCC <1 8V ; - 40°C < Tj <1 8 5 ° C )). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 10: Current sense (8 V < VCC <1 8V ; -
- Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Table 11: Truth table): – Power limitation activation –O v e r t e m p e r a t u r e A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices.
Figure 12. Current sense and diagnostic
20/23 Doc ID 018950 Rev. 5
4 Package information
4.1 ECOPACK ®
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Obsolete Product(s) - Obsolete Product(s)
5 DIE package options
Figure 13. DIE delivery package options Table 15. DIE delivery package options
- Not preferred for new design
Weight of box is approximately 1.5 kg. shells, inside a plastic envelope sealed under vacuum.
6 Revision history
Table 16. Document revision history 16-Jun-2011 1 Initial release. Delete T arget Specification.