NPO0402A KOA | Alldatasheet

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Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. This document applies to miniaturized ceramic chip capacitors for applications in circuits of electronic devices. Table 13. Dimensions and Construction Dimensions in inches (mm)

0805 K101

  1. Terminations ■ Standard Nickel Barrier ■ Solder Plated 5. Applications and Ratings KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 2 OF 13 .47pF~8.2pF= C:±0.25pF 5.6pF~8.2pF= D±0.5pF 10pF~10000pF= F:±1%, G:±2%, J:±5% K: ±10% K: ±10% +80, -20% Dielectric Capacitance Tolerance* Voltage Ratings Dissipation Factor T.C.C. Test Voltage Operating Temperature Insulation Resistance For Values >30pF: 0.1% max., ≤30pF: Q = 400 + 20 x C DF = 1/Q C is in pF 0 ± 30 ppm/°C 1.0 ± 0.2 Vrms -55°C to +125°C +25°C 100,000MΩ min. or 1000 MΩ - µF min. whichever is less NPO Capacitance Range 0.47pF - 0.039µF 16V 25V 50V 100V 200V 6.3 = 7.3% -55°C to +85°C +25°C 100,000MΩ min. or 500 MΩ - µF min. whichever is less X5R 0.068µF - 10µF 6.3V 10V For 50 & 100 volts 2.5% max. 25 = 3.0% 16 = 3.5% ±15% (0 VDC) 1.0 ± 0.2 Vrms -55°C to +125°C +25°C 100,000MΩ min. or 1000 MΩ - µF min. whichever is less X7R 100pF - 4.7µF 10V 16V 25V 50V 100V 200V 16V & 25V = 7.0% 50V = 5.0% +22% to -82% max. 1.0 ± 0.2 Vrms -30°C to +85°C +25°C 10,000MΩ min. or 1000 MΩ - µF min. whichever is less Y5V 2200pF - 10µF 10V 16V 25V 50V * Special tolerances available, please consult factory. TN-196 R12 1/25/07 9:45 AM Page 2

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 3 OF 13 6. NPO Capacitance Voltage Availability (H) 100 (I) (H) 100 (I) 200 (J) (H) 200 (J) (H) 100 (I) 200 (J) Capacitance values pF µF Cap. Code WVDC Size 0402* 0603* 0805 1206 1210 (C) (E) (H) * IR and vapor phase solder only recommended

0.47 R47

0.56 R56

0.68 R68

0.82 R82

1.2 1R2 1.5 1R5 1.8 1R8 2.2 2R2 2.7 2R7 3.3 3R3 3.9 3R9 4.7 4R7 5.6 5R6 6.8 6R8 8.2 8R2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 .0001 101 120 .00012 121 150 .00015 151 180 .00018 181 220 .00022 221 270 .00027 271 330 .00033 331 390 .00039 391 470 .00047 471 560 .00056 561 680 .00068 681 820 .00082 821 1000 .0010 102 1200 .0012 122 1500 .0015 152 1800 .0018 182 2200 .0022 222 2700 .0027 272 3300 .0033 332 3900 .0039 392 4700 .0047 472 5600 .0056 562 6800 .0068 682 8200 .0082 822 10000 .010 103 12000 .012 123 15000 .015 153 18000 .018 183 22000 .022 223 27000 .027 273 33000 .033 333 39000 .039 393 TN-196 R12 1/25/07 9:45 AM Page 3

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 4 OF 13 7. X5R Capacitance Voltage Availability Capacitance values pF µF Size 0402 0603 0805 1206 1210 6.3 (K) (A) (C) 6.3 (K) (A) (C) (E) 6.3 (K) (A) (C) (E) 6.3 (K) (A) (C) (E) 6.3 (K) (A) Capacitance tolerance available: ±10% 100 150 220 330 470 680 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 0.010 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 3.3 4.7 6.8 100 TN-196 R12 1/25/07 9:45 AM Page 4

KOA SPEERKOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 5 OF 13 8. X7R Capacitance Voltage Availability Capacitance values pF µF Cap. Code Size 0402* 0603* 0805 1206 1210 (C) (E) (H) (C) (E) (H) (C) (E) (H) 100 (I) 200 (J) (C) (E) (H) 100 (I) 200 (J) (H) 100 (I) 200 (J) (A) (A) (A) * IR and vapor phase solder only recommended Capacitance tolerance available: ±10% (A) 100 .0001 101 120 .00012 121 150 .00015 151 180 .00018 181 220 .00022 221 270 .00027 271 330 .00033 331 390 .00039 391 470 .00047 471 560 .00056 561 680 .00068 681 820 .00082 821 1000 .0010 102 1200 .0012 122 1500 .0015 152 1800 .0018 182 2200 .0022 222 2700 .0027 272 3300 .0033 332 3900 .0039 392 4700 .0047 472 5600 .0056 562 6800 .0068 682 8200 .0082 822 10000 .010 103 12000 .012 123 15000 .015 153 18000 .018 183 22000 .022 223 27000 .027 273 33000 .033 333 39000 .039 393 47000 .047 473 56000 .056 563 68000 .068 683 82000 .082 823 100000 .100 104 120000 .120 124 150000 .150 154 180000 .180 184 220000 .220 224 270000 .270 274 330000 .330 334 390000 .390 394 470000 .470 474 560000 .560 564 680000 .680 684 1000000 1.00 105 1200000 1.20 125 1500000 1.50 155 1800000 1.80 185 2200000 2.20 225 3900000 3.90 395 4700000 4.70 475 TN-196 R12 1/25/07 9:45 AM Page 5

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 6 OF 13 9. Y5V Capacitance Voltage Availability * IR and vapor phase solder only recommended Capacitance tolerance available: +80, -20% Capacitance values pF µF Cap. Code Size 0402* 0603* 0805 1206 (C) (C) (E) (H) (C) (E) (H) (C) (E) (H) (A) (A) (A) (A) 2200 .0022 222 2700 .0027 272 3300 .0033 332 3900 .0039 392 4700 .0047 472 5600 .0056 562 6800 .0068 682 8200 .0082 822 10000 .010 103 12000 .012 123 15000 .015 153 18000 .018 183 22000 .022 223 27000 .027 273 33000 .033 333 39000 .039 393 47000 .047 473 56000 .056 563 68000 .068 683 82000 .082 823 100000 .100 104 120000 .120 124 150000 .150 154 180000 .180 184 220000 .220 224 270000 .270 274 330000 .330 334 390000 .390 394 470000 .470 474 560000 .560 564 680000 .680 684 820000 .820 824 1000000 1.0 105 1200000 1.2 125 1500000 1.5 155 1800000 1.8 185 2200000 2.2 225 2700000 2.7 275 3300000 3.3 335 3900000 3.9 395 4700000 4.7 475 5600000 5.6 565 6800000 6.8 685 10000000 10 106 22000000 22 226 TN-196 R12 1/25/07 9:45 AM Page 6

  1. Typical Impedance Characteristics - NPO Impedance, Ω 10 100 1000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 1000 pF - C0G (NP0) 1.0 0.1 1206 0805 1812 1210 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 +20 +25 +40 +60 +80 Temperature °C Insulation Resistance vs Temperature +100 Typical Capacitance Change Envelope: 0 ± 30 ppm/°C % Δ Capacitance +0.5 -0.5 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 Temperature °C Temperature Coefficient Impedance, Ω 10 100 1000 Frequency, MHz Variation of Impedance with Ceramic Formulation Impedance vs. Frequency 1000 pF - C0G (NP0) vs X7R 0805 0.10 0.01 1.00 X7R NPO 10.00 Impedance, Ω 1,000 10,000 100 1 10 100 1000 Frequency, MHz Variation of Impedance with Cap Value Impedance vs. Frequency 0805 - C0G (NP0) 10 pF vs. 100 pF vs. 1000 pF 10 pF 100 pF 1000 pF 1.0 0.1 10.0 100,000 % Δ Capacitance 1kHz 10 kHz 100 kHz 1 MHz 10 MHz Frequency Δ Capacitance vs. Frequency KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 7 OF 13 TN-196 R12 1/25/07 9:45 AM Page 7

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 8 OF 13 11. Typical Impedance Characteristics - X5R %Δ Capacitance +10 -60 -40 -20 0 +20 +40 +60 +80 Temperature °C Temperature Coefficient -10 -15 -20 +15 +20 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 +20 +25 +40 +60 +80 Temperature °C Insulation Resistance vs Temperature +100 TN-196 R12 1/25/07 9:45 AM Page 8

KOA SPEERKOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 9 OF 13 12. Typical Impedance Characteristics - X7R % Δ Capacitance +10 +20 -10 -20 1kHz 10 kHz 100 kHz 1 MHz 10 MHz Frequency Δ Capacitance vs. Frequency Impedance, Ω 10 100 1000 Frequency, MHz Variation of Impedance with Cap Value Impedance vs. Frequency 1,000 pF vs. 10,000 pF - X7R 0805 0.10 0.01 1.00 1,000 pF 10,000 pF 10.00 Impedance, Ω 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 100,000 pF - X7R 0.1 .01 1.0 1206 0805 1210 Impedance, Ω 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 10,000 pF - X7R 0.1 .01 1.0 1206 0805 1210 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 +20 +25 +40 +60 +80 Temperature °C Insulation Resistance vs Temperature +100 %Δ Capacitance +12 -75 -50 -25 0 +25 +50 +75 +100 +125 Temperature °C Temperature Coefficient -12 -18 -24 TN-196 R12 1/25/07 9:45 AM Page 9

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 10 OF 13 13. Typical Impedance Characteristics - Y5V Impedance (Ω) 1,000 10,000 Frequency (MHz) 1 μF - 1206 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 +20 +30 +40 +60 +50 +70 +80 +85 Temperature °C Insulation Resistance vs. Temperature % Δ Capacitance +20 +10 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 Temperature °C Temperature Coefficient -60 -50 -40 -30 -20 -10 -70 -80 Δ c/c (%) +20 +40 DC Bias Voltage Capacitance Change vs. DC Bias Voltage -60 -40 -20 -100 -80 20 40 60 80 100 Impedance (Ω) 1,000 10,000 Frequency (MHz) 0.22 μF - 0805 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000 Impedance (Ω) 10,000 1,000 10,000 Frequency (MHz) 0.1 μF - 0603 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000 TN-196 R12 1/25/07 9:45 AM Page 10

  1. Tape and Reel Quantities All tape and reel specifications are in compliance with RS481. Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 3 3640) consult EIA RS-481 latest revision. 15. Reel Dimensions 0402 0603 0805 1206 1210 TE = 7" (178) Plastic N/A N/A *2,000/4,000 2,000 *2,000/4,000 B = 13" (330) Plastic N/A N/A 10,000 10,000 10,000 T = 7" (178) Paper 15,000 4,000 4,000 4,000 4,000 D = 13" (330) Paper N/A 10,000 10,000 10,000 10,000 * Z5U 0805 50V≥ 104pf = 2k, 1206 50V≥ 184pf = 2k, 1210 50V≥ 274pf = 2k; Y5V 0805 50V≥ 124pf = 2k, 25V≥ 394pf = 2k, 16V≥ 474pf = 2k, 1206 25V≥ 564pf = 2k, 16V≥ 824pf = 2k, 1210 50V≥ 334pf = 2k, 25V≥ 105pf = 2k; X7R 0805 100V≥ 123pf = 2k, 50V≥ 101pf = 2k, 16V≥ 154pf = 2k, 1206 100V≥ 393pf = 2k, 25V≥ 124pf = 2k, 16V≥ 394pf = 2k; NPO 0805 100V≥ 391pf = 2k, 50V≥ 561pf = 2k, 1206 100V≥ 152pf = 2k, 50V≥ 152pf = 2k, 1210 100V≥ 182pf = 2k, 50V≥ 272pf = 2k

0805 Y5VCTE 225 Z , 1206 Y5VCTE 335 Z, 1210 Y5VETE 475 Z = 3k

  • Drive spokes optional. If used, asterisked dimensions apply. C Full radius* W1 (Measured at hub). N (Hub dia.)A Tape slot in core for tape start. 0.98 (2.5) min. width, .394 (10) min. depth. 1.575 (40) min. Access hole at slot location. (Arbor hole dia.) W2 (Measured at hub). W3 (Includes flange distortion at outer edge). .311 (10.9 Max.) .469 (15.4 Max.) Dimensions in inches (mm) Dimensions in inches (mm) ± .050 - 0.0 ± 1.0 - 0.0 ± .078 - 0.0 ± 2.0 - 0.0 KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 11 OF 13 TN-196 R12 1/25/07 9:45 AM Page 11

KOA SPEER ELECTRONICS, INC. TN-196 R12 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 12 OF 13 16. Carrier Tape Specifications Embossed plastic 8 & 12mm Notes: 1. A 0, B0 and K0 are determined by the max. dimensions to the ends of the terminals extending from the components body and/or the body of the component. The clearance between the end of the terminals of the body of the components to the sides and depth of the cavity (A0, B0 and K0) cavity of not more than 20 degrees (see examples A & B). 2. Tape with components shall pass around radius "R" without damage. The minimum trailer length (Note 2 Fig. 3) may require addi tional length to provide R min. for .472" (12)mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G 1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G 2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 6. B 1 dimension is a reference dimension for tape feeder clearance only. 17. Dimensions For tape feeder reference only including draft concentric around B T Deformation between embossments Top cover tape D0 P2 10 pitches cumulative tolerance on tape ±0.008 (±0.2) Embossment Center lines of cavity User direction of feed Maximum cavity size, see note 1 D1 for components and larger G1E F W See note 3 See note 4 Tape Size Constant D0 EP 0 P2 T Max. T 1 G1 G2 12mm Max. Min. Min. See note 3 See note 4 Tape Size B 1 D1 R Variable Max. Min. Min. See note 6 See note 5 FP 1 See note 2 T2 WA 0B0K0 Dimensions in inches (mm) ± .004 - 0.0 ± 0.10 - 0.0 ± .012 - .004 ± 0.3 - 0.1 Maximum Component Rotation Side or Front Sectional View Example "A" 20° Top View Example "B" 20° Maximum Component Rotation Typical component cavity center line Typical component center line BO AO TN-196 R12 1/25/07 9:45 AM Page 12

Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. PAGE 13 OF 13 TN-196 R12 18. Carrier Tape Specifications Punched paper tape 8 & 12mm Notes: 1. A 0, B0 and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the components to the sides and depth of the cavity (A0, B0 within the cavity of not more than 20 degrees (see examples C & D). 2. Tape with components shall pass around radius "R" without damage. for non-paper base compositions. 19. Dimensions Bottom cover tape T Top cover tape D0 P2 10 pitches cumulative tolerance on tape ±0.008 (±0.2) Center lines of cavityUser direction of feed Cavity size, see note 1 E F W G2T1 Tape Size Constant D0 EP 0 P2 T1 G1 G2 R MIN 12mm Max. Min. Min. See note 2 Tape Size Variable P1 FW A 0B0 T See note 1 See note 2 Dimensions in inches (mm) ±. 0 0 4 - .000 ± 0.1 - 0.0 ± .012 - .004 ± 0.3 - 0.1 Top View Example "D" 20° Maximum Component Rotation Typical component cavity center line Typical component center line BO AO Maximum Component Rotation Side or Front Sectional View Example "C" 20° T 20. Recommended Land Pattern Dimensions Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is:

  • Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this.
  • Pad overlap 0.5mm beneath component
  • Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering Case Size A* B* C* D* 0402 0.50 1.70 0.60 0.50 0603 0.75 2.30 0.80 0.70 0805 1.25 3.00 1.00 1.00 1206 1.60 4.00 1.00 2.00 1210 2.50 4.00 1.00 2.00 Case Size A* B* C* D* 0805 1.25 4.00 1.50 1.00 1206 1.60 5.00 1.50 2.00 1210 2.50 5.00 1.50 2.00 A B C C D 22-1 Reflow Soldering 22-2 Wave Soldering * All dimensions are in millimeters unless otherwise specified. KOA SPEER ELECTRONICS, INC. TN-196 R12 1/25/07 9:45 AM Page 13