NP383-18010-N YAMAICHI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 1

Technical content

Features

Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Ω1,000M min. at 100V DC Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Beryllium Copper (BeCu) Gold over Nickel Materials and Finish µ Open top type socket for CSP packages with 0.50mm pitch µ Self contacting structure without upper pressing force (ZIF) µ Fan-out Terminal type, designed to reduce ball damage Contact Force: Grid Size: Pin Count: 11gf per pin approx. 35 x 35 264 pins Series No. Series No. No. of Contact Pins No. of Contact Pins Design Number Design Number Positioning Pin: N = Without P = With Positioning Pin: N = Without P = With NP284 NP383264 ***09 09* *- - Outline Socket Dimensions Contact Details (Section C - C) Detail 'B' Recommended PC Board Layout Top View from Socket Matching IC Dimensions 'B' 50.00 50.00 8.50±0.1 8.50 Pos. pin C C 8.50±0.1 8.50±0.1 41.00±0.1 0.50±0.1 8.50±0.1 ∅6.00 ∅3.20 Thru hole ∅2.60 1.50 42.25±0.05 38.25±0.05 34.25±0.05 27.25±0.05 23.25±0.05 19.25±0.05 40.00±0.05 8.50±0.05 8.50±0.05 0.25 0.6418.00 0.50 0.50 8.50±0.05 0.50x34=17.00 0.50x34=17.00 0.50±0.05 for pos. pin Thru hole Thru hole +0.1 +0.1 0 +0.1 4 - ∅2.70 ∅3.20 264 - ∅0.45 264 - ∅0.30 0.30 0.15 0.15 0.50 0.85 46.00 46.00 22.00 22.00 18.15 18.15 +0.1 +0.1 28.60 15.65 17.35 -0.1 +0.1 20.15 20.15 0.50±0.1 0.50±0.1 0.5x34=17.00±0.15 0.5x34=17.00±0.15 NP383 Series (Open Top) Chip Scale Package -TH (CSP, 0.50mm Pitch) D-64 Specifications Part Number (Details) Part Number (Details) 100V AC for 1 minute Ω100m max. at 10mA/20mV max. –40°C to +150°C Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Ω1,000M min. at 100V DC Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Beryllium Copper (BeCu) Gold over Nickel Materials and Finish µ Open top socket for BGA µ Through hole 0.5mm pitch µ 2-point Tweezer Contacts Contact Force: Operating Force: 10gf per pin approx. 2.2kg ±0.5 Example Socket Dimensions Specifications Part Number Body size Socket Dimensions Centre Grid sizeGrid Size NP383-18010-* 10x18 11.0x12.5 19.5x26.0 no grid centre NP383-28804-* 18x18 10.0x10.0 36.0x36.0 6x6 NP383-84107-* 29x29 15.0x15.0 33.0x33 7x7