NP284-26409N YAMAICHI | Alldatasheet
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Technical content
Features
Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000M min. at 100V DCW Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Beryllium Copper (BeCu) Gold over Nickel Materials and Finish Self contacting structure without upper pressing force (ZIF) /c237Open top type socket for CSP packages with 0.50mm pitch /c237 /c237Fan-out Terminal type, designed to reduce ball damage Contact Force: Grid Size: Pin Count 11gf per pin approx. 35 x 35 264 pins Series No. No. of Contact Pins Design Number Positioning Pin: N = Without P = With NP284 264 09 *- Outline Socket Dimensions Contact Details (Section C - C) Detail 'B' Recommended PC Board Layout Top View from Socket Matching IC Dimensions 'B' 50.00 50.00 8.50±0.1 8.50 Pos. pin CC 8.50±0.1 8.50±0.1 41.00±0.1 0.50±0.1 8.50±0.1 Æ6.00 Æ3.20 Thru hole Æ2.60 1.50 42.25±0.05 38.25±0.05 34.25±0.05 27.25±0.05 23.25±0.05 19.25±0.05 40.00±0.05 8.50±0.05 8.50±0.05 0.25 0.6418.00 0.50 0.50 8.50±0.05 0.50x34=17.00 0.50x34=17.00 0.50±0.05 for pos. pin Thru hole Thru hole +0.1 +0.1 0 +0.1 4 - 2.70Æ Æ3.20 264 - 0.45Æ 264 - 0.30Æ 0.30 0.15 0.15 0.50 0.85 46.00 46.00 22.00 22.00 18.15 18.15 +0.1 +0.1 28.60 15.65 17.35 -0.1 +0.1 20.15 20.15 0.50±0.1 0.50±0.1 0.5x34=17.00±0.15 0.5x34=17.00±0.15 Specifications Part Number(Details)