NP2600SA1 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- /C0259High Surge Current Capability: 50 A, 80 A & 100 A, 10 x 1000 /C0109sec, for Controlled Temperature Environments
- /C0259The NP2600Sx is used to help equipment meet various regulatory requirements including: Bellcore 1089, ITU K.20 & K.21, IEC 950, UL 1459 & 1950 and FCC Part 68.
- /C0259Bidirectional Protection in a Single Device
- /C0259Little Change of V oltage Limit with Transient Amplitude or Rate
- /C0259Freedom from Wearout Mechanisms Present in Non-Semiconductor Devices
- /C0259Fail-Safe, Shorts When Overstressed, Preventing Continued Unprotected Operation
- /C0259Surface Mount Technology
- /C0259 Indicates UL Registered - File #E210057
- /C0259This is a Pb-Free Device MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Value Unit Off-State Voltage - Maximum /C0034220 V NP2600Sx1 x = Series Ratings A B C Maximum Pulse Surge Short Circuit Current Non-Repetitive Double Exponential Decay Waveform (Notes 1 and 2) 2 x 10 /C0109s 10 x 160 /C0109s 10 x 560 /C0109s 5 x 310 /C0109s 10 x 1000 /C0109s 150 250 150 100 100 500 200 150 200 100 A(pk) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Allow cooling before testing second polarity. 2. Measured under pulse conditions to reduce heating. 3. Haefely test method. This document contains information on a new product. Specifications and information herein are subject to change without notice. BIDIRECTIONAL TSPD 50, 80, AND 100 AMP SURGE
260 VOLTS
Preferred devices are recommended choices for future use and best overall value. Device Package Shipping †
ORDERING INFORMATION
(No Polarity) (JEDEC DO-214AA) CASE 403C 261x = Device Code x = A, B or C A = Assembly Location Y = Year WW = Work Week /C0071 = Pb-Free Package MARKING DIAGRAM AYWW 261x/C0071 /C0071 http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NP2600SA1T3G SMB (Pb-Free) 2500/Tape & Reel (Note: Microdot may be in either location) NP2600SB1T3G SMB (Pb-Free) 2500/Tape & Reel NP2600SC1T3G SMB (Pb-Free) 2500/Tape & Reel
NP2600SA1, NP2600SB1, NP2600SC1 http://onsemi.com PACKAGE DIMENSIONS A S D B JPK C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.160 0.180 4.06 4.57 B 0.130 0.150 3.30 3.81 C 0.075 0.095 1.90 2.41 D 0.077 0.083 1.96 2.11 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30 K 0.030 0.050 0.76 1.27 P 0.020 REF 0.51 REF S 0.205 0.220 5.21 5.59 SMB CASE 403C-01 ISSUE A *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* /C0466mm inches/C0467SCALE 8:1 2.743 0.108 2.159 0.085 2.261 0.089 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 NP2600S/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca l Sales Representative