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Document overview

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Technical content

Features

  • Fast Soft Switching for Reduced EMI and Higher Efficiency
  • Low Profile − Maximum Height of 1.1 mm
  • Small Footprint − Footprint Area of 8.45 mm2
  • Supplied in 12 mm Tape and Reel
  • Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
  • NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics:
  • POWERMITE is JEDEC Registered as D0−216AA
  • Case: Molded Epoxy
  • Epoxy Meets UL 94 V−0 @ 0.125 in
  • Weight: 16.3 mg (Approximately)
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds
  • MSL 1

Applications

  • Automotive LED Lighting
  • Engine Control
  • Freewheeling Diode Where Space is at a Premium
  • Flat Panel Display

ORDERING INFORMATION

1.0 AMPERE, 200 VOLTS

http://onsemi.com Device Package Shipping † NHPM120T3G POWERMITE (Pb−Free) 12000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. POWERMITE CASE 457 CATHODE ANODE MARKING DIAGRAM M = Date Code P12 = Device Code /C0071 = Pb−Free Package M P12/C007112 NRVHPM120T3G POWERMITE (Pb−Free) 12000 / Tape & Reel

NHPM120, NRVHPM120 http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (TL = 165°C) IO 1.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz) TL = 165°C IFRM 2.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 30 A Storage and Operating Junction Temperature Range (Note 1) Tstg, TJ −65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R/C0113JA. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction−to−Lead (Note 2) /C0089JCL 12 °C/W Thermal Resistance, Junction−to−Ambient (Note 2) R/C0113JA 75 °C/W Thermal Resistance, Junction−to−Ambient (Note 3) R/C0113JA 260 °C/W

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 4) (IF = 1.0 A, TJ = 25°C) (IF = 2.0 A, TJ = 25°C) (IF = 1.0 A, TJ = 125°C) (IF = 2.0 A, TJ = 125°C) VF 1.0 1.1 0.85 0.95 V Maximum Instantaneous Reverse Current (Note 4) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 125°C) IR 0.5 /C0109A Reverse Recovery Time IF = 1.0 A, VR = 30 V, dl/dt = 50 A//C0109s, TJ = 25°C trr 25 ns Reverse Recovery Time IF = 1.0 A, VR = 30 V, dl/dt = 50 A//C0109s, TJ = 50°C trr 50 ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Mounted with 700 mm 2 copper pad size (Approximately 1 in2) 1 oz FR4 Board. 3. Mounted with pad size approximately 20 mm 2 copper, 1 oz FR4 Board. 4. Pulse Test: Pulse Width ≤ 380 /C0109s, Duty Cycle ≤ 2.0%.

NHPM120, NRVHPM120 http://onsemi.com PACKAGE DIMENSIONS POWERMITE CASE 457−04 ISSUE F DIM MIN MAX MIN MAX INCHESMILLIMETERS A 1.75 2.05 0.069 0.081 B 1.75 2.18 0.069 0.086 C 0.85 1.15 0.033 0.045 D 0.40 0.69 0.016 0.027 F 0.70 1.00 0.028 0.039 J 0.10 0.25 0.004 0.010 K 3.60 3.90 0.142 0.154 L 0.50 0.80 0.020 0.031 R 1.20 1.50 0.047 0.059 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. SBM0.08 (0.003) C ST −A− −B− S J K −T− H L J C D SBM0.08 (0.003) C ST F PIN 1 PIN 2 R 0.50 REF 0.019 REF 2.54 0.100 0.635 0.025 1.27 0.050 2.67 0.105 0.762 0.030 /C0466mm inches/C0467SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 NHPM120/D POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative