STN888 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
■ VERY LOW COLLECTOR TO EMITTER SATURATION VOLTAGE ■ D.C. CURRENT GAING, h FE > 100 ■ 5 A CONTINUOUS COLLECTOR CURRENT ■ SOT-223 PLASTIC PACKAGE FOR SURFACE MOUNTING CIRCUITS ■ AVAILABLE IN TAPE & REEL PACKING ■ IN COMPLIANCE WITH THE 2002/93/EC EUROPEAN DIRECTIVE
Applications
■ POWER MANAGEMENT IN PORTABLE EQUIPMENT ■ VOLTAGE REGULATION IN BIAS SUPPLY CIRCUITS ■ SWITCHING REGULATOR IN BATTERY CHARGER APPLICATIONS ■ HEAVY LOAD DRIVER
Description
The device is manufactured in low voltage PNP Planar Technology by using a “Base Island” layout. The resulting transistor shows exceptional high gain performance coupled with very low saturation voltage. Order Codes Internal Schematic Diagram SOT-223 Part Number Marking Package Packing STN888 N888 SOT-223 Tape & Reel STN888 HIGH CURRENT, HIGH PERFORMANCE, LOW VOLTAGE PNP TRANSISTOR rev.2
1 Absolute Maximum Ratings STN888
1 Absolute Maximum Ratings
Table 1. Absolute Maximum Rating Table 2. Thermal Data
2 Electrical Characteristics
Table 3. Electrical Characteristics Note: 1 Pulsed duration = 300 μs, duty cycle ≤1.5%.
2 Electrical Characteristics STN888
2.1 Typical Characteristics
Figure 1. DC Current Gain Figure 2. DC Current Gain Figure 3. Collector-Emitter Saturation Voltage Figure 4. Base-Emitter Saturation Voltage Figure 5. Switching Times Resistive Load Figure 6. Switching Times Resistive Load
3 Test Circuits
Figure 7. Resistive Load Switching Test Circuit
4 Package Mechanical Data STN888
4 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
DIM. mm inch A 1.80 0.071 e 2.30 0.090 e1 4.60 0.181 V1 0 o 10o A1 0.02 P008B SOT-223 MECHANICAL DATA
5 Revision History STN888
5 Revision History
03-Aug-2005 1 Initial release.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the con sequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicatio n are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics produ cts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron ics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America