STN83003 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 2.2 Test circuits
- 3 Package mechanical data
- 4 Revision history
Part Number Marking Package Packing STN83003 N83003 SOT-223 Tape & reel STN83003 High voltage fast-switching NPN power transistor General features ■ Medium voltage capability ■ Low spread of dynamic parameters ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed ■ SOT-223 plastic package for surface mounting circuits ■ Tape and reel packing
Applications
■ Electronics ballasts for fluorescent lighting ■ Switch mode power supplies
Description
The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and medium voltage capability. It uses a Cellular Emitter structure with planar edge termination to enhance switching speeds while maintaining the wide RBSOA. The STN83003 is expressly designed for a new solution to be used in compact fluorescent lamps, where it is coupled with the STN93003, its complementary PNP transistor. Internal schematic diagrams SOT-223
1 Electrical ratings
Table 2. Thermal data Table 1. Absolute maximum rating
- Device mounted on PCB area of 1 cm 2.
2 Electrical characteristics
Table 3. Electrical characteristics
- Pulsed duration = 300 µs, duty cycle ≤1.5%
2.1 Electrical characteristics (curves)
Figure 1. Safe operating area Figure 2. DC Current Gain Figure 3. DC Current Gain Figure 4. Collector-emitter saturation Figure 5. Base-emitter saturation Figure 6. Resistive load storage time
2.2 Test circuits
Figure 10. Inductive load switching test circuit Figure 11. Resistive load switching test circuit
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
DIM. mm inch A 1.80 0.071 e 2.30 0.090 e1 4.60 0.181 V1 0 o 10o A1 0.02 P008B SOT-223 MECHANICAL DATA
4 Revision history
Table 4. Revision history 09-May-2006 1 Initial release. 17-Jan-2007 2 The device’s safe operating area curve has been added on page 5.