ISL9N302AP3 FAIRCHILD | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

  • Fast switching DS(ON) = 0.0019 Ω (Typ), V GS = 10V DS(ON) = 0.0027 Ω (Typ), V GS = 4.5V g (Typ) = 110nC, V GS = 5V gd (Typ) = 31nC ISS (Typ) = 11000pF MOSFET Maximum Ratings T A = 25°C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units V DSS Drain to Source Voltage 30 V V GS Gate to Source Voltage 20 V I D Drain Current

75 AContinuous (T

C = 25 o C, V GS = 10V) Continuous (T C = 100 o C, V GS = 4.5V) 75 A Pulsed Figure 4 A P D Power dissipation Derate above 25 o C 345 2.3 W o C T J , T STG Operating and Storage Temperature -55 to 175 o C R θ JC Thermal Resistance Junction to Case TO-220 0.43 o C/W R θ JA Thermal Resistance Junction to Ambient TO-220 62 o C/W Device Marking Device Package Reel Size Tape Width Quantity N302AP ISL9N302AP3 TO-220AB Tube N/A 50 D G S TO-220AB DRAIN (FLANGE) DRAIN SOURCE GATE

©2002 Fairchild Semiconductor Corporation Rev. B January 2002 ISL9N302AP3

Electrical Characteristics

T A = 25°C unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics GS = 4.5V) Switching Characteristics GS = 10V) Unclamped Inductive Switching Drain-Source Diode Characteristics Symbol Parameter Test Conditions Min Typ Max Units B VDSS Drain to Source Breakdown Voltage I D = 250 µ A, V GS = 0V 30 - - V I DSS Zero Gate Voltage Drain Current V DS = 25V - - 1 µ AV GS = 0V T C = 150 o - - 250 I GSS Gate to Source Leakage Current V GS 20V - - 100 nA V GS(TH) Gate to Source Threshold Voltage V GS = V DS , I D = 250 µ A1 - 3 V r DS(ON) Drain to Source On Resistance I D = 75A, V GS = 10V - 0.0019 0.0025 Ω I D = 75A, V GS = 4.5V - 0.0027 0.0033 C ISS Input Capacitance V DS = 15V, V GS = 0V, f = 1MHz - 11000 - pF C OSS Output Capacitance - 2000 - pF C RSS Reverse Transfer Capacitance - 900 - pF Q g(TOT) Total Gate Charge at 10V V GS = 0V to 10V V DD = 15V I D = 75A I g = 1.0mA 200 300 nC Q g(5) Total Gate Charge at 5V V GS = 0V to 5V - 110 165 nC Q g(TH) Threshold Gate Charge V GS = 0V to 1V - 12 18 nC Q gs Gate to Source Gate Charge - 25 - nC Q gd Gate to Drain “Miller” Charge - 31 - nC t ON Turn-On Time V DD = 15V, I D = 28A V GS = 4.5V, R GS = 1.5 Ω - - 224 ns t d(ON) Turn-On Delay Time - 29 - ns t r Rise Time - 120 - ns t d(OFF) Turn-Off Delay Time - 45 - ns t f Fall Time - 34 - ns t OFF Turn-Off Time - - 119 ns t ON Turn-On Time V DD = 15V, I D = 28A V GS = 10V, R GS = 1.5 Ω - - 204 ns t d(ON) Turn-On Delay Time - 16 - ns t r Rise Time - 120 - ns t d(OFF) Turn-Off Delay Time - 70 - ns t f Fall Time - 30 - ns t OFF Turn-Off Time - - 150 ns t AV Avalanche Time I D µ s V SD Source to Drain Diode Voltage I SD = 75A - - 1.25 V I SD = 40A - - 1.0 V t rr Reverse Recovery Time I SD = 75A, dI SD /dt = 100A/ µ s- - 4 2 n s Q RR Reverse Recovered Charge I SD = 75A, dI SD /dt = 100A/ µ s- - 3 4 n C

©2002 Fairchild Semiconductor Corporation Rev. B January 2002 ISL9N302AP3 SUBCKT ISL9N302AP3 2 1 3 ; rev Nov 2001 CA 12 8 9e-9 Cb 15 14 5.5e-9 Cin 6 8 1e-8 Dbody 7 5 DbodyMOD Dbreak 5 11 DbreakMOD Dplcap 10 5 DplcapMOD Ebreak 11 7 17 18 30.4 Eds 14 8 5 8 1 Egs 13 8 6 8 1 Esg 6 10 6 8 1 Evthres 6 21 19 8 1 Evtemp 20 6 18 22 1 It 8 17 1 Lgate 1 9 5.618e-9 Ldrain 2 5 1e-9 Lsource 3 7 1.98e-9 RLgate 1 9 56.1 RLdrain 2 5 15 RLsource 3 7 19.8 Mmed 16 6 8 8 MmedMOD Mstro 16 6 8 8 MstroMOD Mweak 16 21 8 8 MweakMOD Rbreak 17 18 RbreakMOD 1 Rdrain 50 16 RdrainMOD 4e-4 Rgate 9 20 5.93e-1 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 Rsource 8 7 RsourceMOD 1.3e-3 Rvthres 22 8 RvthresMOD 1 Rvtemp 18 19 RvtempMOD 1 S1a 6 12 13 8 S1AMOD S1b 13 12 13 8 S1BMOD S2a 6 15 14 13 S2AMOD S2b 13 15 14 13 S2BMOD Vbat 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*500),3))} .MODEL DbreakMOD D (RS=2.5e-1 TRS1=1e-3 TRS2=-8.9e-6) .MODEL DplcapMOD D (CJO=3.5e-9 IS=1e-30 N=10 M=4.7e-1) .MODEL MstroMOD NMOS (VTO=2.1 KP=550 IS=1e-25 N=10 TOX=1 L=1u W=1u) .MODEL MmedMOD NMOS (VTO=1.6 KP=30 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=5.93e-1) .MODEL MweakMOD NMOS (VTO=1.22 KP=1e-1 IS=1e-40 N=10 TOX=1 L=1u W=1u RG=5.93 RS=1e-1) .MODEL RbreakMOD RES (TC1=1e-3 TC2=-7e-7) .MODEL RdrainMOD RES (TC1=1.2e-2 TC2=2.5e-5) .MODEL RSLCMOD RES (TC1=3.5e-9 TC2=5e-6) .MODEL RsourceMOD RES (TC1=1e-3 TC2=1e-6) .MODEL RvthresMOD RES (TC1=-2.9e-3 TC2=-9e-6) .MODEL RvtempMOD RES (TC1=-1.8e-3 TC2=1e-6) .MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-3.5 VOFF=-1.5) .MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-1.5 VOFF=-3.5) .MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-0.4 VOFF=0.1) .MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=0.1 VOFF=-0.4) .ENDS NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley. + - + - 8 + RBREAK RVTEMP VBAT RVTHRES IT 17 18 S1A S1B S2A S2B CA CB EGS EDS MWEAK EBREAK DBODY RSOURCE SOURCE 7 3 LSOURCE RLSOURCE CIN RDRAIN EVTHRES 1621 MMED MSTRO DRAIN LDRAIN RLDRAIN DBREAK DPLCAP ESLC RSLC1 RSLC2 GATE RGATE EVTEMP ESG LGATE RLGATE

©2002 Fairchild Semiconductor Corporation Rev. B January 2002 ISL9N302AP3 REV Nov 2001 template ISL9N302AP3 n2,n1,n3 electrical n2,n1,n3 var i iscl dp..model dbreakmod = (rs=2.5e-1,trs1=1e-3,trs2=-8.9e-6) dp..model dplcapmod = (cjo=3.5e-9,isl=10e-30,nl=10,m=4.7e-1) m..model mstrongmod = (type=_n,vto=2.1,kp=550,is=1e-25, tox=1) m..model mmedmod = (type=_n,vto=1.6,kp=30,is=1e-30, tox=1) m..model mweakmod = (type=_n,vto=1.22,kp=1e-1,is=1e-40, tox=1,rs=1e-1) c.ca n12 n8 = 5e-9 c.cb n15 n14 = 5.5e-9 c.cin n6 n8 = 1e-8 dp.dbody n7 n5 = model=dbodymod dp.dbreak n5 n11 = model=dbreakmod dp.dplcap n10 n5 = model=dplcapmod spe.ebreak n11 n7 n17 n18 = 30.4 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evthres n6 n21 n19 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 i.it n8 n17 = 1 l.lgate n1 n9 = 5.618e-9 l.ldrain n2 n5 = 1e-9 l.lsource n3 n7 = 1.98e-9 res.rlgate n1 n9 = 56.1 res.rldrain n2 n5 = 15 res.rlsource n3 n7 = 19.8 m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u res.rbreak n17 n18 = 1, tc1=1e-3,tc2=-7e-7 res.rdrain n50 n16 = 4e-4, tc1=1.2e-2,tc2=2.5e-5 res.rgate n9 n20 = 5.93e-1 res.rslc1 n5 n51 = 1e-6, tc1=3.5e-9,tc2=5e-6 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 1.3e-3, tc1=1e-3,tc2=1e-6 res.rvthres n22 n8 = 1, tc1=-2.9e-3,tc2=-9e-6 res.rvtemp n18 n19 = 1, tc1=-1.8e-3,tc2=1e-6 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc=1 equations { i (n51->n50) +=iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/500))** 3)) + - + - 8 + RBREAK RVTEMP VBAT RVTHRES IT 17 18 S1A S1B S2A S2B CA CB EGS EDS MWEAK EBREAK DBODY RSOURCE SOURCE 7 3 LSOURCE RLSOURCE CIN RDRAIN EVTHRES 1621 MMED MSTRO DRAIN LDRAIN RLDRAIN DBREAK DPLCAP ISCL RSLC1 RSLC2 GATE RGATE EVTEMP ESG LGATE RLGATE

©2002 Fairchild Semiconductor Corporation Rev. B January 2002 ISL9N302AP3 SPICE Thermal Model REV May 2001 TISL9N302AP3 CTHERM1 th 6 4.5e-3 CTHERM2 6 5 2e-2 CTHERM3 5 4 1.5e-2 CTHERM4 4 3 2.5e-2 CTHERM5 3 2 7e-2 CTHERM6 2 tl 2.5e-1 RTHERM1 th 6 2e-3 RTHERM2 6 5 8.5e-3 RTHERM3 5 4 6e-2 RTHERM4 4 3 8e-2 RTHERM5 3 2 9e-2 RTHERM6 2 tl 1e-1 SABER Thermal Model SABER thermal model TISL9N302AP3 template thermal_model th tl thermal_c th, tl ctherm.ctherm1 th 6 = 4.5e-3 ctherm.ctherm2 6 5 = 2e-2 ctherm.ctherm3 5 4 = 1.5e-2 ctherm.ctherm4 4 3 = 2.5e-2 ctherm.ctherm5 3 2 = 7e-2 ctherm.ctherm6 2 tl = 2.5e-1 rtherm.rtherm1 th 6 =2e-3 rtherm.rtherm2 6 5 = 8.5e-3 rtherm.rtherm3 5 4 = 6e-2 rtherm.rtherm4 4 3 = 8e-2 rtherm.rtherm5 3 2 = 9e-2 rtherm.rtherm6 2 tl = 1e-1 RTHERM4 RTHERM6 RTHERM5 RTHERM3 RTHERM2 RTHERM1 CTHERM4 CTHERM6 CTHERM5 CTHERM3 CTHERM2 CTHERM1 tl th JUNCTION CASE

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ Rev. H4 ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET STAR*POWER is used under license VCX™