NCS2553 ONSEMI | Alldatasheet
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Technical content
© Semiconductor Components Industries, LLC, 2008 December, 2008 − Rev. 4
1 Publication Order Number:
Description
The NCS2553 is a 3 −channel high speed video amplifier with 6th order butterworth standard definition reconstruction filter. All three channels can accommodate either all component and RGB video signals or composite and S −Video signals. All channels can accept DC or AC coupled signals. If AC coupled, the internal clamps are employed. The outputs can drive both AC and DC coupled 150 /C0087 loads. It is designed to be compatible with most digital −to−analog converters (DAC) embedded in most video processors. Feature
- Three 6th Order Standard Definition 8 MHz Filters
- Internally Fixed Gain = 6 dB
- AC− or DC− Coupled Inputs
- AC− or DC− Coupled Outputs
- Integrated Level Shifter
- Operating V oltage +5 V
- Available in a SOIC−8 Package
- These are Pb−Free Devices
Applications
- Digital Set−Top Box
- DVD / Video Players and Related
- SD−TV
- Video On Demand (VOD)
- Video Recorders MARKING DIAGRAM http://onsemi.com Device Package Shipping †
ORDERING INFORMATION
SOIC−8 SD IN2 SD IN3 SD OUT2 SD OUT1 SOIC−8 (Pb−Free)
98 Units / Rail
NCS2553DR2G SOIC −8 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. N2553 ALYW /C0071 A = Assembly Location L = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package SOIC−8 NB D SUFFIX CASE 751
Figure 1. Block Diagram
8 MHz, 6th Order
4 VCC Power Device Power Supply Voltage: +5 V
5 GND GND Connected to Ground
6 OUT3 Output SD Video Output 3 − Channel 3
7 OUT2 Output SD Video Output 2 − Channel 2
8 OUT1 Output SD Video Output 1 − Channel 1
- For additional information, see Application Note AND8003/D.
- Power dissipation must be considered to ensure maximum junction temperature (T J) is not exceeded.
limited by the associated rise in junction temperature. important to observe the de−rating curves. Figure 2. Power Dissipation vs Temperature
http://onsemi.com DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, TA = 25°C, 0.1 /C0109F AC coupled inputs, Rsource = 37.5 /C0087, 220 /C0109F AC coupled outputs into 150 /C0087 load, referenced to 400 kHz, unless otherwise specified) Symbol Characteristics Conditions Min Typ Max Unit VCC Supply Voltage Range 4.75 5.0 5.25 V ICC Power Supply Current No Load 23 30 mA VIN Input Common Mode Voltage Range Referenced to GND if DC−Coupled GND 1.4 PSRR Power Supply Rejection DC (All Channels) −50 dB NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. AC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, TA = 25°C, 0.1 /C0109F AC coupled inputs, Rsource = 37.5 /C0087,220 /C0109F AC coupled outputs into 150 /C0087 load, referenced to 400 kHz, unless otherwise specified) Symbol Characteristics Conditions Min Typ Max Unit AVOL Voltage Gain (Note 5) VIN = 1 V (All Channels) 5.8 6.0 6.2 dB BW Low Pass Filter Bandwidth −1 dB (Note 6) 5.5 7.2 MHz −3 dB 9.0 MHz AR Stop−Band Attenuation (Rejection) at 27 MHz 45 dB dG Differential Gain 0.3 % d/C0113 Differential Phase 0.6 /C0095 THD Total Harmonic Distortion VOUT = 1.8 VPP @ 1 MHz 0.4 % Xtalk Channel−to−Channel Crosstalk VOUT = 1.8 VPP @ 1 MHz −60 dB SNR Signal−to−Noise Ratio NTSC−7, 100 kHz to 4.2 MHz (Note 7) 75 dB Tpd Propagation Delay Input−to−Output, 4.5 MHz 60 nsec /C0068GD Group Delay Variation from 100 kHz to
8 MHz
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. 100% of tested IC fit to the bandwidth tolerance. 6. Guaranteed by design and characterization. 7. SNR = 20 x log (714 mV/RMS Noise)
Figure 3. Frequency Response
7.2 MHz,
9.0 MHz,
27 MHz Stop−band Rejection
Figure 4. Channel−to−Channel Crosstalk
6.7 MHz,
Figure 5. Group Delay
1 MHz,
Figure 6. Propagation Delay Figure 7. PSRR vs Frequency Figure 8. PSRR vs. Frequency
Figure 9. Gain Flatness
3.8 MHz,
5.5 MHz,
Figure 10. Differential Gain (NTSC 5 Steps Figure 11. Differential Phase (NTSC 5 Steps Figure 12. Normalized Frequency Response and Group Delay vs. Frequency
Figure 14. Typical Application Circuit
http://onsemi.com PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AJ SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 NCS2553/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative