K3420B1EB1S MICROSEMI | Alldatasheet

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Silicon Power Rectifier Assemblies Plate Heatsink e Complete bridge with heatsinks — no assembly required e Available in many circuit configurations e Rated for convection or forced air cooling e Available with bracket or stud mounting @ Designs include: DO—4, DO-5, DO-8 and DO-9 rectifiers e Blocking voltages to 1600V Peak Number of Number of Size of Type of Reverse Type of Diodes Type of Type of Diodes Special Heat Sink Diode Voltage Circuit in Series Finish Mounting in Parallel Feature E-2"x2" Single Phase Per leg E-Commercial B-Stud with Per leg Surge K-3"x3" 2 H-Half Wave brackets Suppressor CSS 20-200 C-Center Top or insulating N-Tx Positive board with

34 N-Center Tap mounting

7 Negative bracket

43 D-Doubler N-Stud with

100-1 — oo 100 Bee se 120-1200 Q-Half Wave. DC Negative 160-1600 W-Double WYE V-Open Bridge a COLORADO _ 800 Hoyt Street Broomfield, CO. 80020 3-20-01 Rev. 1 jcrosemi 2% FAX: (303) 466-3775 www.microsemi.com

Series 21, 34 & 37 s | oo H tH P17 H ele | ect tty yt ae pe (et OO} | db a> |t | | oo i M K M H R Notes: 1. Current ratings shown are for natural convection cooling 3. For single phase battery, capacitive, or motor loads: the resistive or inductive loads for single phase circuits and all output current shown below should be derated to 80% of loads for three phase circuits the values shown. 2. Use 2.0 times the listed current ratings for forced convec— 4. Assemblies with heat sink sizes other than those shown tion cooling at 1000LFM below are available on request for special applications. Series 21 Series 34 & 37 Circuit Size Dim. Inches Milimeters pin, Ma, Min Max. | Pin Mx, Min Max. | Ratings — Average Circuit Output Current — Amperes DIODE HEAT SINK |FSM AMBIENT 1—PHASE 1—PHASE 1—PHASE (3—PHASE (3—PHASE (3—PHASE (3—PHASE ‘SERIES ‘SIZE (inches) AMPS: TEMP. °C 1/2 WAVE CTR. TAP BRIDGE 1/2 WAVE BRIDGE CTR. TAP OBL.—WYE 2 2x2x1/16 250 100 43 86 86 12.9 12.9 21.0 25.8 Ratings — Average Circuit Output Current — Amperes DIODE HEAT SINK |FSM AMBIENT 1—PHASE 1—PHASE 1—PHASE ‘3—PHASE (3—PHASE (3—PHASE ‘3—PHASE ‘SERIES: SIZE (inches) ‘AMPS: TEMP. °C 1/2 WAVE CTR. TAP BRIDGE 1/2 WAVE BRIDGE CTR. TAP DBL.—WYE 3-20-01 Rev. 1

H | | +1 j Su | | | SS TIE PE I pe \\ +} | +4 ' PoE H +1 H SPLIT Ty TI LT H +} _ — _ — a LJ M K M /#-—— Rr Notes: 1. Current ratings shown are for natural convection cooling 3. For single phase battery, capacitive, or motor loads: the resistive or inductive loads for single phase circuits and all output current shown below should be derated to 80% of loads for three phase circuits the values shown. 2. Use 2.0 times the listed current ratings for forced convec— 4. Assemblies with heat sink sizes other than those shown tion cooling at 1000LFM below are available on request for special applications. Series 43 Series 504 Circuit Size Dim. Inches Millimeters Circuit Size Dim. Inches Millimeters circuits H 0.98 100281 25.6 circuits H 0.98 1.00 248 254 Ratings — Average Circuit Output Current — Amperes DIODE HEAT SINK |FSM AMBIENT 1—PHASE 1—PHASE 1—PHASE 3-PHASE (3-PHASE (3-PHASE (3—PHASE ‘SERIES ‘SIZE (inches) AMPS: TEMP. °C 1/2 WAVE CTR. TAP BRIDGE 1/2 WAVE BRIDGE CTR. TAP DBL.-WYE Ratings - Average Circuit Output Current — Amperes DIODE HEAT SINK 'FSM AMBIENT 1—PHASE 1—PHASE. 1—PHASE 3-PHASE 3—PHASE 3—PHASE 3-PHASE ‘SERIES: ‘SIZE (inches) ‘AMPS: TEMP. °C 1/2 WAVE CTR. TAP BRIDGE 1/2 WAVE BRIDGE CTR. TAP DBL.—WYE 3-20-01 Rev. 1