MTS62C19A MICROCHIP | Alldatasheet

Document overview

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Technical content

Features

  • 750 mA Continuous Output Current
  • Load Voltage Supply: 10V to 40V
  • Full Bipolar Stepper Motor Drive Capability
  • Bidirectional DC Motor Capability
  • Internal Fixed T OFF Time PWM Current Control
  • Internal Protection Diodes
  • Internal Thermal Shutdown
  • Under Voltage Lockout
  • LS-TTL Compatible Logic Inputs with Pull-Up Resistors
  • L o w R ON Output Resistance
  • Low Quiescent Current
  • Operating Temperature Range: -40°C to +105°C
  • Pin Compatible with Allegro 6219

Applications

  • Stepper Motor Actuators
  • DC Motor Actuators
  • Automotive HVAC Ventilation
  • Automotive Power Seats

Description

The MTS62C19A motor driver is a CMOS device capa- ble of driving both windings of a bipolar stepper motor or bidirectionally control two DC motors. Each of the two independent H-bridge outputs is capable of sus- taining 40V and delivering up to 750 mA of continuous current. The output current level is controlled by an internal pulse-width modulation (PWM) circuit that is configured using two logic inputs, a current sense resistor, and a selectable reference voltage. The H-bridge outputs have been optimized to provide a low output saturation voltage drop. Full, half and micro-stepping operations are possible with the PWM current control and logic inputs. The maximum output current is set by a sensing resistor and a user-selectable reference voltage. The output current limit is selected using two logic level inputs. The selectable output current limits are 0%, 33%, 67% or 100% of the maximum output current. Each bridge has a PHASE input signal which is used to control the direction of current flow through the H-bridge and the load. The H-bridge power stage is controlled by non-overlap- ping signals which prevent current cross conduction when switching the direction of the current flow. Internal clamp diodes protect against inductive transients. Thermal protection circuitry disables the outputs when the junction temperature exceeds the safe operating limit. No special power-up sequencing is required. Undervoltage Lockout circuitry prevents the chip from operating when the load supply is applied prior to the logic supply. The device is supplied in a 24-pin SOP Package. Package Types Note: The MTS62C19A device is formerly a product of Advanced Silicon. GND I01 VLOADOUT1A OUT2A SENSE2 COMPIN2 OUT2B GND 169 VREF1 I11 PHASE1 GNDGND I02 SENSE1 1510 I12 PHASE2 OUT1B COMPIN1 MTS62C19A SOP-24 VREF2 RC2 RC1 VLOGIC Dual Full-Bridge Motor Driver MTS62C19A

DS22260C-page 2  2010-2013 Microchip Technology Inc. Functional Block Diagram VLOGIC Logic Shift Drivers Power Bridge Power Bridge Shift Drivers Thermal Shutdown One-shot Logic Current Sense Comparator Current Sense Comparator One-shot Under-V Lockout COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 OUT2B OUT2A OUT1B OUT1A VLOAD VREF1 VREF2 PHASE1 PHASE2 I01 I11 I02 I12

 2010-2013 Microchip Technology Inc. DS22260C-page 3 MTS62C19A Typical Application VLOGIC VLOAD 10 to 30V VREF1 VREF2 100 nF PHASE1 PHASE2 I01 I11 I02 I12 100 nF 100 µF Logic Logic Current Sense Comparator Current Sense Comparator M One-shot One-shot Under-V Lockout Thermal Shutdown Shift Drivers Shift Drivers OUT1A OUT1B OUT2A OUT2B COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 RSRS Ct RtRt RC RC Ct CC CC Logic/µP Power Bridge Power Bridge

DS22260C-page 4  2010-2013 Microchip Technology Inc.

1.0 ELECTRICAL

Absolute Maximum Ratings † Junction Temperature (T † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all limits are established for VLOGIC = 4.5V to 5.5V, VLOAD =3 0 V , VREF =5 V , TA = +25°C Parameters Sym Min Typ Max Units Conditions DC Characteristics Logic Supply Voltage V LOGIC 4.5 5.0 5.5 V Load Supply Voltage V LOAD 10 30 40 V Logic Supply Current I VLOGIC —0 . 81 . 0 m A VREF Voltage Range V REF 1.5 5.0 7.0 V Driver Supply Current I VLOAD_ON — 0.55 1.0 mA Both Bridges ON, No Load IVLOAD_OFF — 0.55 1.0 mA Both Bridges Off Control Logic Input Current (VIN = 0V) IIN — — -70 µA I01, I11, I02, I12, PHASE1, PHASE2, (Note 1) Logic-Low Input Voltage VIL — — 0.8 V I01, I11, I02, I12, PHASE1, PHASE2 Logic-High Input Voltage VIH 2.4 — — V I01, I11, I02, I12, PHASE1, PHASE2 Current Limit Threshold Ratio (VREF ÷ VSENSE) VREF_VSENSE 9.5 10 10.5 — I0 = L, I1 = L 13.5 15 16.5 — I0 = H, I1 = L 25.5 30 34.5 — I0 = L, I1 = H Driver Output Satura- tion Voltage VCE(SAT) VONN (Low Side) — 0.55 0.65 V (Sink) I OUT = +500 mA — 0.90 1.00 V (Sink) I OUT = +750 mA VONP (High Side) — 1.05 1.40 V (Source) I OUT = -500 mA — 1.85 2.10 V (Source) I OUT = -750 mA Clamp Diode Forward Voltage (Note 2) VF_NDIODE —0 . 9 5 1 . 3 0V I F = 750 mA VF_PDIODE —1 . 0 0 1 . 3 0V I F = 750 mA Driver Output Leakage Current ILEAK —— - 5 0 µ A V OUT = 0V ——5 0 µ A V OUT = VLOAD Thermal Shutdown Temperature TJ_SHDN —1 7 0—° C AC Characteristics Cut-off Time (one-shot pulse) TOFF —5 05 8 µ s R s =1 , RC =1k , CC =8 2 0p F , Rt =5 6k , Ct =8 2 0p F Turn-off Delay T D —1 . 51 0µ s Note 1: VIN = 5.0V input current given by internal pull-up to Logic Supply. 2: Clamp/Freewheel diode is the intrinsic body-drain diode of the NMOS and PMOS transistors.

 2010-2013 Microchip Technology Inc. DS22260C-page 5 MTS62C19A TEMPERATURE SPECIFICATIONS Parameters Sym Min Typ Max Units Conditions Recommended Temperature Ranges Junction Temperature Range T J -40 +125 °C Operating Temperature Range T A -40 +105 °C Thermal Package Resistance Thermal Resistance, SOP-24 JA — 76 — °C/W EIA/JEDEC JESD51-10 Thermal Resistance, SOP-24 JC — 16 — °C/W EIA/JEDEC JESD51-10

DS22260C-page 6  2010-2013 Microchip Technology Inc.

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1. TABLE 2-1: MTS62C19A PIN FUNCTION TABLE Pin No. SOP-24 Type Name Function

1 Output OUT1A Output 1 ‘A’ Side of Motor Winding

2 Output OUT2A Output 2 ‘A’ Side of Motor Winding

3 Input SENSE2 Current Sense for Output 2

4 Input COMPIN2 Current Sense Comparator Input for Output 2

5 Output OUT2B Output 2 ‘B’ Side of Motor Winding

6 Power GND Negative Logic Supply (Ground)

7 Power GND Negative Logic Supply (Ground)

8 Input I02 Output 2 Current Selection Bit 0

9 Input I12 Output 2 Current Selection Bit 1

10 Input PHASE2 Output 2 Phase

11 Input V

REF2 Output 2 Current Reference

12 Input RC2 Output 2 RC Time Constant

13 Power V

LOGIC Positive Logic Supply Voltage

14 Input RC1 Output 1 RC Time Constant

15 Input V REF1 Output 1 Current Reference

16 Input PHASE1 Output 1 Phase

17 Input I11 Output 1 Current Selection Bit 1

18 Power GND Negative Logic Supply (Ground)

19 Power GND Negative Logic Supply (Ground)

20 Input I01 Output 1 Current Selection Bit 0

21 Output OUT1B Output 1 ‘B’ Side of Motor Winding

22 Input COMPIN1 Current Sense Comparator Input for Output 1

23 Input SENSE1 Current Sense for Output 1

24 Power V

LOAD Positive Load Supply Voltage

 2010-2013 Microchip Technology Inc. DS22260C-page 7 MTS62C19A

2.1 Output Stage (OUT1A, OUT2A,

OUT1B, OUT2B) Output connection to “A” side and “B” side of motor windings.

2.2 Current Sense Input (SENSE1,

SENSE2) Connection to lower sources of output stage for insertion of current sense resistor.

2.3 Current Sense Comparator Input

(COMPIN1, COMPIN2) Current sense comparator input.

2.4 Ground Terminal (GND)

Logic supply ground. Only the driver current flows out of this pin; there is no high current. Minimize voltage drops between this pin and the logic inputs.

2.5 Current Detection Selection

(I01, I02, I11, I12) Comparator input for current threshold detection. The voltage across the sense resistor is fed back to this input through the low-pass filter R cCc. The power tran- sistors are disabled when the sense voltage exceeds the reference voltage of the selected comparator. When this occurs, the current decays for a time set by R tCt (TOFF = 1.1 RtCt).

2.6 Current Flow Direction Selection

(PHASE1, PHASE2) Logic input to select the direction of the current flow through the load. A “HIGH” logic signal level causes load current to flow from OUTxA to OUTxB. A “LOW” logic level causes load current to flow from OUTxB to OUTxA.

2.7 Current Sense Reference

(VREF1, VREF2) Reference voltage for current sense comparator. Determines the level of output current detection together with sensing resistor and inputs I0x, I1x.

2.8 Output Stage OFF Time

(RC1, RC2) A parallel RtCt network connected to this pin sets the OFF time of the power transistors. The monostable pulse generator is triggered by the output of the current sense comparator.

2.9 Logic Supply Voltage (V LOGIC)

Connect VLOGIC to the logic source voltage. Decouple the supply with a 0.1 µF ceramic capacitor mounted close to the V LOGIC and GND terminals.

2.10 Load Supply Voltage (V LOAD)

Connect V LOAD to the motor positive voltage supply. The motor current is supplied through this pin and the selected output transistors.

DS22260C-page 8  2010-2013 Microchip Technology Inc.

3.0 FUNCTIONAL DESCRIPTION

The circuit is designed to drive the two windings of a bipolar stepper motor, and can be divided in two identi- cal channels (channel 1 and channel 2) and protection circuitry for overtemperature and undervoltage. The functionality of a channel and protection circuitry is presented in the following sections.

3.1 Power Bridge Operation

Each motor winding is driven by an H-type bridge consisting of two N and two P transistors that allow the current to flow in both winding directions depending on the value of the PHASE signal ( Table 3-1). The H-bridge can be set in five configurations that are related to the digital inputs PHASE, I0 and I1 and to the current sensed. These configurations are shown in Table 3-2. FIGURE 3-1: Power Bridge Control (PHASE = H/forward). Legend: a) Bridge ON, b) Source OFF, c) All OFF/Coasting Note: For PHASE = L/Reverse, invert A and B in drawings. VLOAD PbPa H HL L NbNa SENSE OUTA OUTB VLOAD PbPa H HL L NbNa SENSE OUTA OUTB VLOAD PbPa H HL L NbNa SENSE OUTA OUTB RS RS RS a) b) c) TABLE 3-1: CURRENT DI RECTION CONTROL Phase Output Current L Current flows from OUTxB to OUTxA H Current flows from OUTxA to OUTxB TABLE 3-2: POWER BRIDGE GA TE CONTROL TRUTH TABLE I0I1 PHASE Overi T OFF Case/Mode gna gpa gnb gpb 00/01/10 1 0 0 Forward ON L LH H 00/01/10 1 x 1 Forward OFF L H H H 00/01/10 0 0 0 Reverse ON H HL L 00/01/10 0 x 1 Reverse OFF H HLH 11 x x x No Current/ Coasting LHLH Legend: Bold = Active MOS Transistors, Overi = Overcurrent flag, TOFF = Channel TOFF State Flag

 2010-2013 Microchip Technology Inc. DS22260C-page 9 MTS62C19A

3.2 PWM Current Control

The current level in each motor winding is controlled by a PWM circuit with a fixed TOFF time. The load current flowing in the winding is sensed through an external sensing resistor R S, connected between the power bridge's source pin SENSE (sources of transistors Na and Nb) and GND. FIGURE 3-2: PWM Current Control Circuit Principle (Channel 1 Shown). The voltage across RS is compared to a fraction of the reference voltage VREF, chosen with the logic input bits I0 and I1 ( Table 3-3). The power bridge, and thus the load current, can also be switched off completely when both logic inputs are high. Note that any logic input left unconnected will be treated as a high level (pull-up resistor). The maximum trip current for regulation, given for I0 I1 = 00 is calculated in Equation 3-1. EQUATION 3-1: VLOAD SENSE VREF I1 COMPIN CC RC Ct Rt RS RC ÷10 One-Shot Source Disable Power Bridge Pa Pb Na Nb OUTA OUTB IMAX VREF TABLE 3-3: CURRENT LEVEL CONTROL TRUTH TABLE I0 I1 Comp. Trip Voltage Output Current

00 V TRIP = 1/10 x VREF IMAX = VREF/10RS

10 V TRIP = 1/15 x VREF 2/3 x IMAX = VREF/15RS

01 V TRIP = 1/30 x VREF 1/3 x IMAX = VREF/30RS

1 1 x 0 (no current)

DS22260C-page 10  2010-2013 Microchip Technology Inc. When the maximum allowed current is reached, the bridge source is turned off during a fixed period T OFF (typically 50 µs) given by a non-retriggerable pulse generator and the external timing components R t (20k – 100 k range) and C t (100 pF – 1000 pF range): EQUATION 3-2: During TOFF the winding current decreases. When the driver is re-enabled, the winding current increases again until it reaches the threshold, and the cycle repeats itself, maintaining the load current at the desired level. FIGURE 3-3: PWM Output Current Waveform.

3.3 Circuit Protection

A thermal protection circuitry turns off all drivers when the junction temperature exceeds a safe operating limit of +170°C (typical). This protects the devices from failure due to excessive heating. Despite this thermal protection, output short circuits are not permitted. The output drivers are re-enabled once junction temperature has dropped below +145°C (typical).FIGURE 3-4: Thermal Shutdown Output vs. Temperature Showing Hysteresis. An undervoltage lockout circuit protects the MTS62C19A from potential shoot-through currents when the load supply voltage is applied prior to the logic supply voltage. The power bridge and all outputs are disabled if V LOGIC is smaller than 4V. With this protection feature, the circuit will withstand any order of turn-on or turn-off of the supply voltages VLOGIC and VLOAD. Normal dV/dt values are assumed. TOFF 1.1 R t Ct= PHASE IOUT IOUT tofftdton +170°C+145°C thshtd_en

 2010-2013 Microchip Technology Inc. DS22260C-page 11 MTS62C19A

4.0 APPLICATION CIRCUITS AND

4.1 Typical Application

The MTS62C19A circuit, with external components for a typical application, is shown in Figure 4-1. Typical passive component values are: R S = 1 , RC = 1 k , CC = 820 pF, Rt = 56 k and Ct = 820 pF. FIGURE 4-1: Typical Application Circuit. During PWM operation, when the output stage is turned-on, large voltage peaks might appear across RS, which can wrongly trigger the input comparator. To avoid an unstable current control, an external RCCC fil- ter should be used that delays the comparator action. Depending on load type, many applications will not require this filter (SENSE connected to COMPIN). VLOGIC VLOAD 10 to 30V VREF1 VREF2 100 nF PHASE1 PHASE2 I01 I11 I02 I12 100 nF 100 µF Logic Logic Current Sense Comparator Current Sense Comparator M One-shot One-shot Under-V Lockout Thermal Shutdown Shift Drivers Shift Drivers OUT1A OUT1B OUT2A OUT2B COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 RSRS Ct RtRt RC RC Ct CC CC Logic/µP Power Bridge Power Bridge

DS22260C-page 12  2010-2013 Microchip Technology Inc.

4.2 Stepping Examples

The MTS62C19A control modes are full-step, half- step, modified half-step and microstepping control of the motor, as shown in Figure 4-2. FIGURE 4-2: Examples of Stepping Modes Achievable with Typical Application Circuit.

4.3 PCB Design Guidelines

Unused inputs should be connected to fixed voltage levels in order to get the highest noise immunity. Typi- cal PCB layout guidelines for power applications should be followed. These include separate power ground planes, supply decoupling capacitors close to the IC, short connections and use of maximized copper areas to improve thermal dissipation. Motor Current in Phase 1 Motor Current in Phase 2 I01 I11 PHASE1 I02 I12 PHASE2 Full-Step 12 34 Half-Step 123 45678 Modified Half-Step 123 45678 +500 mA -500 mA +500 mA -500 mA +333 mA -333 mA +167 mA -167 mA Micro-Stepping (1/8th) VREF1 VREF2 5V 5V

 2010-2013 Microchip Technology Inc. DS22260C-page 13 MTS62C19A

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 24-Lead SOP Example YYWWNNN MTS62C19A HS105 ^^ 1248256

DS22260C-page 14  2010-2013 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 11 2 1324 0.016 typ 0.05 typ D L GAUGE PLANE SEATING PLANE Symbol Minimum Typical Maximum Unit J 048° Note 1: JEDEC outline: M0-119 AA 2: Dimensions “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs should not exceed 0.25mm (0.010inch) per side. 3: Dimensions “E” does not include inter-lead flash, or protrusions. Inter-lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. Note: The package drawing dimensions are expressed in inches.

 2010-2013 Microchip Technology Inc. DS22260C-page 15 MTS62C19A APPENDIX A: REVISION HISTORY Revision C (March 2013) The following is the list of modifications: 1. Corrected one dimension in the package drawing. Added a note mentioning the unit type used in the drawing. 2. Minor editorial changes. Revision B (December 2012) The following is the list of modifications: 1. Updated Operating Temperature Range throughout the document. 2. Corrected Typical Application diagram. 3. Added Section 5.1, Package Marking Information. 4. Added Product Identification System section. Revision A (September 2010)

  • Original Release of this Document.

DS22260C-page 16  2010-2013 Microchip Technology Inc. NOTES:

 2010-2013 Microchip Technology Inc. DS22260C-page 17 MTS62C19A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Device: MTS62C19A: Dual Full-Bridge Motor Driver Packing Type: H= T u b e L = Tape and Reel Package: S* = 24-Lead Plastic Small Outline (SOP) * These devices are formerly products of Advanced Silicon PART NO. -X XXX Fixed Tube/Tape and Reel Device X Package Examples: a) MTS62C19A-HS105 Tube, b) MTS62C19A-LS105 Tape and Reel, Characters

DS22260C-page 18  2010-2013 Microchip Technology Inc. NOTES:

 2010-2013 Microchip Technology Inc. DS22260C-page 19 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2010-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-053-5 Note the following details of the code protection feature on Microchip devices:

  • Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
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  • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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  • Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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