MTH966

MTH966 DFI | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 3

Technical content

8 PCIe x1, 2 PCIe x4,

1 PCIe x8, 1 I2C,

1 SMBus, 1 LPC/eSPI,

2 UART

1 VGA, 1 LVDS/eDP ,

3 DDI

1 Intel 2.5GbE, 2 USB 4.0, 3 USB 3.2, 8 USB 2.0, 2 SATA 3.0 Intel Core™ Ultra processors COM Express CompactMTH966 Bottom View Front View Intel Core™ Ultra processors LPDDR5 COMING SOON COMING SOON

www.dfi.com MECHANICAL DRAWING BLOCK DIAGRAM (Option) DDI A DDI B HSIO Lane 6-9PCIe_LANE 0~3 PTN3460LVDS/48bit eDP Channel A eDP CH7517AVGA LVDS eDP VGA HSIO Lane 10GLAN I226IT/LM MDI PCIE 4.0 Lane 9GLAN1 PCIE 4.0 Lane 5-8 HSIO Lane 5PCIe_LANE 4 PCIe_LANE 5 PCIE 4.0 Lane 4 HSIO Lane 4PCIE 4.0 Lane 3 HSIO Lane 3SATA 1 SATA 3.0_Port 1 HSIO Lane 2SATA 0 SATA 3.0_Port 0 SPI BUS USB2.0 Port 1-8USB P0~7 USB2.0_Port 1-8 HDAHDA HDA SPI BUSSPI SPI TPM 2.0 (Option) SPI Flash BIOS (256M bit) eSPI to LPC F85227N eSPI BUS eSPILPC BUSLPC Embedded Controller IT8528VG-I Serial Port 1/2 GPIO 8bit Serial Port 1,2 ESPI 2 load circuit option SLP/LID I2C_SMB PCIE 4.0 Lane 2 (Option) SMBUSSMBUS 8bit DIO WDT Fan PWM/TACH_IN IMVP9.2 LPDDR5x x32(32Gb/64Gb) Channel B LPDDR5x x32(32Gb/64Gb) PCIE x4 NVME SSD PCIe_LANE 6 PCIe_LANE 7 DDI/USB4_P1TCP0 DDI_P1/USB4_1 DDI/USB4_P2TCP1 DDI_P2/USB4_2 DDI Port 3TCP2 DDI_P3 TCP3 USBSS P2 USBSS P0~1HSIO Lane 0-1 USB3.2 Gen2 P1-2 USB3.2 Gen2 P3 PEG_LANE 0-3CPU_PCIE Gen4 HSIO 14-17 PCIE Gen4 PCIE4_L13~L16 PCIE 4x only PEG_LANE 8-15CPU_PCIE Gen5 HSIO 22-29 (H Line only) PCIE Gen5 PCIE5_L21~L28 PCIE 8x PEG_LANE 4-7CPU_PCIE Gen4 HSIO 18-21 PCIE Gen4 PCIE4_L17~L20 PCIE 4x only Co lay Intel Meteor Lake-H(6P+8E) Intel Meteor Lake-U(2P+8E) TDP 28W/15W COM Express Row A/B (Type6) COM Express Row C/D (Type6) CMOS Backup EEPROM I2C BUS SMBUS I2C BUS S/W S/W PCIE 4.0 Lane 1 (Option) COMING SOON

www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © July 31, 2024 DFI Inc. SPECIFICATION SYSTEM Processor Intel Core™ Ultra Processor (Meteor Lake: U/H-series) Intel Core™ Ultra 7 165H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W) Intel Core™ Ultra 7 155H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W) Intel Core™ Ultra 5 135H (4 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 18 MB cache, 28W) Intel Core™ Ultra 5 125H (4 P-Cores x 1.2 GHz, 8 E-Cores x 0.7 GHz, 18 MB cache, 28W) Intel Core™ Ultra 7 165U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W) Intel Core™ Ultra 7 155U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W) Intel Core™ Ultra 5 135U (2 P-Cores x 1.6 GHz, 8 E-Cores x 1.1 GHz, 12 MB cache, 15W) Intel Core™ Ultra 5 125U (2 P-Cores x 1.3 GHz, 8 E-Cores x 0.8 GHz, 12 MB cache, 15W) Memory Dual Channel LPDDR5 memory down up to 64GByte BIOS AMI BIOS GRAPHICS Controller Intel Iris Xe graphics Feature DX12, Open GL 4.6, Vulkan 1.2 (Windows) Mesa 3D, Open GL 4.6, Vulkan 1.2 (Linux) HW Decode : 4K60 8b 4:2:0 AVC HW Encode : 4K60 10b 4:4:4 HEVC/VP9/SCC 4K60 8b 4:2:0 AVC Display 1 x VGA 1 x LVDS/eDP (eDP available upon request) 3 x DDI (2 DDI option with USB4) VGA: resolution up to 1920x1200 @ 60Hz LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 4096x2304 @ 60Hz HDMI: resolution up to 4096x2160 @ 30Hz DP++: resolution up to 4096x2304 @ 60Hz Multiple Displays VGA + LVDS + 3 DDI VGA + LVDS + 3 DDI (available upon request) EXPANSION Interface 8 x PCIe x1 (Gen4, Lanes 6/7 by option) 1 x PCIe x8 (Gen 5, H-Line only) 2 x PCIe x4 (Gen4, PEG_LANE4-7 option with NVMe SSD) 1 x I2C 1 x SMBUS 1 x LPC/eSPI 2 x UART AUDIO Interface HD Audio ETHERNET Controller 1 x Intel I226 series (10/100/1000Mbps/2.5G), co-lay PCIe x1 (available upon request) I/O USB 2 x USB 4.0 (BOM option with DDI) 3 x USB 3.2 Gen 2 8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s), co-lay PCIe x1 (available upon request) NVMe SSD 1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request) DIO 1 x 8-bit DIO WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds SECURITY TPM Available Upon Request POWER Type 8.5~20V, 5VSB, VCC_RTC (ATX mode) 8.5~12V, VCC_RTC (AT mode) Consumption TBD OS SUPPORT Microsoft Windows 10 IoT Enterprise 64-bit Windows 11 Linux Linux ENVIRONMENT Temperature Operating: 0°C~60°C (For H-Series Processor) -40°C~85°C (For U-Series Processor) Storage: -40°C~85°C Humidity Operating: 10%~90% RH Storage: 10%~90% RH MTBF TBD MECHANICAL Dimensions COM Express Compact 95mm (3.74") x 95mm (3.74") Compliance PICMG COM Express R3.1, Type 6 STANDARDS AND CERTIFICATIONS Certification CE, FCC, RoHS