MTE1122 MICROCHIP | Alldatasheet

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DS21112B-page 2 Preliminary  1995 Microchip Technology Inc. FUNCTIONAL DESCRIPTION Single-phase induction motors run most efficiently at full load. As the applied load lessens, a greater portion of the energy consumed by the motor is wasted, mostly as heat. It is estimated by the EPA that 50% of the energy pro- duced in the US is consumed by small electric motors, and that 20% of this energy does no useful work. There are perhaps three major reasons for this: 1. Over-specification -- sometimes its easier or costs no more to specify a larger motor than determine actual loads. 2. Worst case design -- pumps, conveyers, fans, and the like must be able to operate properly with clogged filters, maximum heads, or speci- fied loads. If filters are clean, or loads are lower, the motor will be running only partly loaded. 3. Idle time -- many times, systems can’t be shut down conveniently when not in use. Number 1 above can be corrected by proper design. For example, in modern refrigerators, the compressor systems have been optimized quite effectively. Num- bers 2 and 3 can not be improved using traditional approaches. This is where the MTE1122 provides a new, cost-effective solution. The MTE1122 calculates the amount of load on a motor connected to it, and adjusts the motor’s supply voltage to match that load. For example, if the load is lower than the motor’s rated load, the voltage to the motor can be reduced, thus decreasing the energy used by the motor. A 1/3 HP motor will typically see 85 VAC at no load when powered through the MTE1122, for an energy savings of as much as 58%. A system block diagram is shown in Figure 1. A graph of energy savings vs. motor load is shown in Figure 2. A graph of motor efficiency with and without an MTE1122-based energy management controller (EMC) is shown in Figure 3. The data for the graphs are shown in T able 1. These figures are based on a 1/3 HP induction motor coupled to a dynamometer. Actual savings may vary based on motor size, motor load and motor construction. PINOUT DESCRIPTIONS P-Sense - analog input that is used by the device to measure the load voltage. Gate Enable - analog input that monitors the voltage across the triac. It is used as a current feedback mech- anism. IND - TTL-compatible output that indicates that the sys- tem is operating normally. It is intended to control an LED or another indicator device. ZC-Sense - TTL-compatible input that is used to deter- mine the zero crossing point of the AC voltage wave- form. TTRIG - TTL-compatible output that is used to drive the triac. RESET - TTL-compatible input used to reset the device by holding this pin low. OSC1, OSC2 - Oscillator crystal or resonator connec- tions. FIGURE 3: MOTOR EFFICIENCY 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 0 1 02 03 04 05 06 07 08 09 0 1 0 0 Efficiency Percent Load With E.M.C. Without E.M.C.

 1995 Microchip Technology Inc. Preliminary DS21112B-page 3 MTE1122 TABLE 1: OPERATING PARAMTER COMPARISONS 1/3 HP Motor without E.M.C. Load (%) Load (Nm) Vrms Irms (A) Power Factor Power In (W) RPM Power Out (W) Power Out (HP) Efficiency (%) 1/3 HP Motor with E.M.C. Load (%) Load (Nm) Vrms Irms (A) Power Factor Power In (W) RPM Power Out (W) Power Out (HP) Efficiency (%)

DS21112B-page 4 Preliminary  1995 Microchip Technology Inc.

ELECTRICAL CHARACTERISTICS

Absolute Maximum Rating † Voltage on any pin with respect to V Max. Current out of V Note 1:Voltage spikes below V SS at the RESET pin, inducing currents greater than 80mA, may cause latch-up. Thus, a series resistor of 50-100Ω should be used when applying a "low' level to the RESET pin rather than pulling this pin directly to VSS . Note 2:T otal power dissipation should not exceed 800 mW for the package. Power dissipation is calculated as fol- lows: P DIS = VDD x {IDD - ∑ IOH } + ∑ {(VDD -VOH ) x IOH } + ∑ (VOL x IOL ) TABLE 2: DC CHARACTERISTICS POWER SUPPLY PINS †NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or compliance to AC and DC parametric specifications at those or any other conditions above those indicated in the operation listings of this specification is not implied. Expo- sure to maximum rating conditions for extended periods may affect device reliability. Power Supply Pins Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ T A ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Characteristic Sym Min Typ (Note 1) Max Units Conditions Supply Voltage V DD 4.0 6.0 V VDD start voltage to guarantee power on reset VPOR Vss V VDD rise rate to guarantee Power-On Reset (Note 2) SVDD 0.05 V/ms Supply Current (Note 3) I DD 1.8 3.3 mA F OSC = 4 MHz, VDD = 5.5V Note 1: Data in the column labeled “Typical” is based on characterization results at 25°C. This data is for design guidance only and is not tested for, or guaranteed by Microchip Technology. 2: This parameter is characterized but not tested. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con- sumption.

 1995 Microchip Technology Inc. Preliminary DS21112B-page 5 MTE1122 TABLE 3: DC CHARACTERISTICS: ALL PINS EXCEPT POWER SUPPLY TABLE 4: AC CHARACTERISTICS All Pins Except Power Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Characteristic Sym Min Typ Max Units Conditions Input Low Voltage: All Input Pins (Except OSC1) RESET OSC1 VIL VIH VSS VSS

0.2 VDD

0.3 VDD

V V Input High Voltage: All Input Pins (Except RESET, OSC1) RESET OSC1 VIH VIH VIH

0.36 VDD

0.85 VDD

0.7 VDD

V V V 4.5V ≤ V DD ≤ 5.5V Input Leakage Current: (Notes 1,2) IND, TTRIG, AC-Sense P-Sense, Gate Input RESET OSC1 IIL ±1 µA µA µA µA VSS ≤ VPIN ≤ VDD , Pin at hi-impedance V SS ≤ VPIN ≤ VDD , Pin at hi-impedance VSS ≤ VPIN ≤ VDD VSS ≤ VPIN ≤ VDD Output Low Voltage: All Output Pins V OL 0.6 VI OL = 8.5mA, VDD = 4.5V, -40°C to +85°C Output High Voltage: All Output Pins (Note 2) V OH 0.7 VDD VI OH 83.mA, VDD = 4.5V, -40°C to +85°C Note 1: The leakage current on the RESET pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 2: Negative current is defined as current coming out of the pin. AC Characteristics Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Characteristic Sym Min Typ Max Units Conditions Oscillator Frequency F OSC 44 M H z Clock in (OSC1) High or Low Time TCKHLXT 50 ns Note 1 Clock in (OSC1) Rise or Fall TimeTCKRFXT 25 ns Note 1 RESET Pulse Width (low) T MCL 200 ns Note 1

DS21112B-page 6 Preliminary  1995 Microchip Technology Inc. PACKAGING INFORMATION Package Type: 18-Lead Plastic Dual In-Line (300 mil) Package Group: Plastic Dual In-Line (PLA) Symbol Millimeters Inches Min Max Notes Min Max Notes α 0° 10° 0° 10° A — 4.064 — 0.160 A1 0.381 - 0.015 — A2 3.048 3.810 0.120 0.150 B 0.3556 0.5588 0.014 0.022 B1 1.524 1.524 Reference 0.060 0.060 Reference C 0.203 0.381 Typical 0.008 0.015 Typical D 22.479 23.495 0.885 0.925 D 1 20.320 20.320 Reference 0.800 0.800 Reference E 7.620 8.255 0.300 0.325 E1 6.096 7.112 0.240 0.280 e1 2.4892 2.5908 Typical 0.098 0.102 Typical eA 7.620 7.620 Reference 0.300 0.300 Reference eB 7.874 9.906 0.310 0.390 L 3.048 3.556 0.120 0.140 N 1 81 8 1 81 8 S 0.889 — 0.035 — S1 0.508 — 0.005 — Pin No. 1 Indicator Area Seating Plane Base Plane B S D EE1 N L AA1 A2 α C eA eB AA AA AA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA A AA AAAAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA A A A A A A A A A A A A A A A A A AA AAAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AA AA AAAAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA

 1995 Microchip Technology Inc. Preliminary DS21112B-page 7 MTE1122 Package Type: 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) Package Group: Plastic SOIC (SO) Symbol Millimeters Inches Min Max Notes Min Max Notes α 0° 8° 0° 8° A 2.3622 2.6416 0.093 0.104 A1 0.1016 0.29972 0.004 0.0118 B 0.3556 0.4826 0.014 0.019 C 0.2413 0.3175 0.0095 0.0125 D 11.3538 11.7348 0.447 0.462 E 7.4168 7.5946 0.292 0.299 e 1.270 1.270 Reference 0.050 0.050 Reference H 10.0076 10.6426 0.394 0.419 h 0.381 0.762 0.015 0.030 L 0.4064 1.143 0.016 0.045 N 1 81 8 1 81 8 CP — 0.1016 — 0.004 B HE α C N Chamfer h x 45° Index Area e 1 2 3 Seating Plane Base PlaneCP A1 A D h x 45° L

DS21112B-page 8 Preliminary  1995 Microchip Technology Inc. MTE1122 Product Identification System To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices. PART NO. X /XX Package: P = Plastic Dual In-line SO = Plastic SOIC Temperature - = 0°C to +70°C Range: I = –40°C to +85°C Device: MTE1122 AMERICAS (continued) San Jose Microchip Technology Inc.

2107 North First Street, Suite 590

San Jose, CA 95131 Tel: 408 436-7950 Fax: 408 436-7955 ASIA/PACIFIC Hong Kong Microchip Technology Unit No. 3002-3004, Tower 1 Metroplaza

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#10-03 Prime Centre Singapore 188980 Tel: 65 334 8870 Fax: 65 334 8850 Taiwan Microchip Technology 10F-1C 207 Tung Hua North Road Taipei, T aiwan, ROC Tel: 886 2 717 7175 Fax: 886 2 545 0139 EUROPE United Kingdom Arizona Microchip Technology Ltd. Unit 6, The Courtyard Meadow Bank, Furlong Road Bourne End, Buckinghamshire SL8 5AJ T el: 44 0 1628 851077 Fax: 44 0 1628 850259 France Arizona Microchip Technology SARL

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Atlanta, GA 30350 Tel: 770 640-0034 Fax: 770 640-0307 Boston Microchip Technology Inc.

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Itasca, IL 60143 Tel: 708 285-0071 Fax: 708 285-0075 Dallas Microchip Technology Inc.

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Dallas, TX 75240-8809 Tel: 214 991-7177 Fax: 214 991-8588 Dayton Microchip Technology Inc.

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Englewood, OH 45322 Tel: 513 832-2543 Fax: 513 832-2841 Los Angeles Microchip Technology Inc.

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Hauppauge, NY 11788 Tel: 516 273-5305 Fax: 516 273-5335 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre- sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not autho- rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip T echnology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. All rights reserved.  1995, Microchip Technology Inc.,USA.