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Technical content

Features

 International standard package  High Surge Capability  Glass passivated chip  Simple Mounting  Heat transfer through aluminum oxide DBC ceramic isolated metal baseplate  UL recognized applied for file no. E360040 TYPE VRRM/VDRM VRSM MT60CB08T1 MT60CB12T1 MT60CB16T1 MT60CB18T1 800V 1200V 1600V 1800V 900V 1300V 1700V 1900V

Applications

 Power Converters  Lighting Control  DC Motor Control and Drives  Heat and temperature control Circuit 1 32 Symbol Item Conditions Values Units Min. Typ. Max. VFM Forward Voltage Drop, max. T=25℃ IF =200A 1.65 V IRRM Repetitive Peak Reverse Current, max. Tvj =25℃ VRD=VRRM Tvj =125℃ VRD=VRRM ≤0.5 mA mA S-M047 www.21yangjie.com Rev.2.0, 27-May-17 1

◆Thyristor Maximum Ratings Thermal Characteristics Symbol Item Conditions Values Units Rth(j-c) Thermal Impedance, max. Junction to Case 0.57 ℃/W Rth(c-s) Thermal Impedance, max. Case to Heatsink 0.20 ℃/W

Electrical Characteristics

Symbol Item Conditions Values Units ITAV Average On-State Current Sine 180o;Tc=85℃ 60 A ITSM Surge On-State Current TVJ =45℃ t=10ms, sine TVJ =125℃ t=10ms, sine 1500 1250 A i2t Circuit Fusing Consideration TVJ =45℃ t=10ms, sine TVJ =125℃ t=10ms, sine 11000

8000 A2s

Tvj Operating Junction Temperature -40 to +125 ℃ Tstg Storage Temperature -40 to +125 ℃ Mt Mounting Torque To terminals(M5) 3±15% Nm Ms To heatsink(M6) 5±15% Nm di/dt Critical Rate of Rise of On-State Current TVJ= TVJM , 2/3VDRM ,IG =500mA Tr<0.5us,tp>6us 150 A/us dv/dt Critical Rate of Rise of Off-State Voltage, min. TJ=TVJM ,2/3VDRM linear voltage rise 1000 V/us a Maximum allowable acceleration 50 m/s2 Symbol Item Conditions Values Units Min. Typ. Max. VTM Peak On-State Voltage, max. T=25℃ IT =200A 1.65 V IRRM/IDRM Repetitive Peak Reverse Current, max. / Repetitive Peak O ff-State Current, max. TVJ=TVJM ,VR=VRRM ,VD= VDRM 15 mA VTO On state threshold voltage For power-loss calculations only (TVJ =125℃) 0.9 V rT Value of on-state slope resistance. max TVJ =TVJM 3.5 mΩ VGT Gate Trigger Voltage, max. TVJ =25℃ , VD =6V 3.0 V IGT Gate Trigger Current, max. TVJ =25℃ , VD =6V 150 mA VGD Non-triggering gate voltage, max. TVJ=125℃,VD =2/3VDRM 0.25 V IGD Non-triggering gate current, max. TVJ =125℃, VD =2/3VDRM 6 mA IL Latching current, max. TVJ =25℃ , RG = 33 Ω 300 600 mA IH Holding current, max. TVJ =25℃ , VD =6V 150 250 mA tgd Gate controlled delay time TVJ=25℃, IG=1A, diG/dt=1A/us 1 us tq Circuit commutated turn-off time TVJ =TVJM 80 us S-M047 www.21yangjie.com Rev.2.0, 27-May-17 2

Fig1. Power dissipation Fig2.Forward Current Derating Curve

0 I TAV 25 25 A 75

W PTAV rec.30 rec.60 rec.120 sin.180 DC Fig3. Transient thermal impedance Fig4. Max Non-Repetitive Forward Surge Current Fig5. Forward Characteristics 0.001 t 0.01 0.1 1 10 S 100 1.0 ℃/ W 0.5 Zth(j-C) Zth(j-S) 10 100 ms 1000 50HZ 2000 A 1000 250 A 200 150 100 IT max. Typ. DC sin.180 rec.120 rec.60 rec.30 ITAVM A

0 Tc 50 100 ℃ 130

25℃ - - -125℃ S-M047 www.21yangjie.com Rev.2.0, 27-May-17 3

Package Outline Information CASE: T1 Dimensions in mm Fig6. Gate trigger Characteristics 1/2·MT60CB18T1 VGD125℃ IGD125℃ IGT VGT 20V;20Ω 150 W(0.1ms )100W(0.5ms) 50W(8ms) PG(tp) 0.001 I G 0.01 0.1 1 10 A 100 100 V VG 0.1 -40℃ 25℃ 125℃ Tvj YJ S-M047 www.21yangjie.com Rev.2.0, 27-May-17 4