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3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION P ART NO. : MT5470-BL 5.2×4.6mm OV AL LED LAMP OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES ATTENTION

MT5470-BL 5.2×4.6mm OV AL LED LAMP VER.: 01 Date: 2007/03/22 Page: 1/5

Description

This blue lamp is made with InGaN/Sapphire chip and blue diffused epoxy resin. AK 1.5 TYP. 2.54±0.1 4.6 5.2 7.824.0 MIN. 0.5 MAX. Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Part No. Material Emitting Color Lens Color MT5470-BL InGaN/Sapphire Blue Blue diffused

MT5470-BL 5.2×4.6mm OV AL LED LAMP VER.: 01 Date: 2007/03/22 Page: 2/5 Absolute Maximum Ratings at Ta=25Ċ Parameter Symbol Rating Unit Power Dissipation PD 100 mW Reverse V oltage VR 5 V D.C. Forward Current If 25 mA Reverse (Leakage) Current Ir 50 DŽA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA Operating Temperature Range Topr. -40 to +95 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Soldering Temperature(1.6mm from body) Tsol. Dip Soldering : 260 for Ċ 5 sec. Hand Soldering : 350 for 3 sec.Ċ Electrostatic discharge ESD. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 550 950 mcd Forward V oltage Vf If=20Ma 3.2 4.0 V Dominant Wavelength λd 465 470 475 nm Reverse (Leakage) Current Ir Vr=5V 50 µA Vertical 2ǀ1/2 If=20Ma 35 ViewingAngle Horizontal 2ǀ1/2 If=20Ma 55 deg Spectrum Line Halfwidth ∆λ If=20Ma 26 nm Notes: The datas tested by IS tester. 2. Customer’s special requirements are also welcome. If=20mA If=20mA If=20mA If=20mA If=20mA

MT5470-BL 5.2×4.6mm OV AL LED LAMP VER.: 01 Date: 2007/03/22 Page: 3/5 Typical Electrical / Optical Characteristics Curves : Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGEForward Current IF(mA) Forward Current (Ma) FORWARD CURRENT VS. LUMINOUS INTENSITY Temperature ( )Ċ FORWARD CURRENT VS. AMBIENT TEMPERATURE 02 0 4 0 6 0 1 0 0 80 Forward Current IF(mA)10 3KQJO R j-a=490 Ċ/W RADIATION DIAGRAM 80° 90° 60° 70° 50° 30° 40° 0.10.5 0.7 0.8 0.3 1.0 0.9 0.40.2 0.6 0° 10° 20° HORIZONTAL VERTICAL 0.0 10.0 20.0 30.0 300 600 900 1200 1500 Relative Luminous Intensity(mcd)

MT5470-BL 5.2×4.6mm OV AL LED LAMP VER.: 01 Date: 2007/03/22 Page: 4/5 Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. R 550 770 S 770 1100 T 1100 1520 Specifications for Vf Group: Vf(V) Group MIN. MAX. V6 2.6 2.8 V7 2.8 3.0 V8 3.0 3.2 V9 3.2 3.4 V10 3.4 3.6 V11 3.6 3.8 V12 3.8 4.0 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: ǃD(nm) @20mA Group MIN . MAX. X4 465 470 X5 470 475

MT5470-BL 5.2×4.6mm OV AL LED LAMP VER.: 01 Date: 2007/03/22 Page: 5/5 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 Ċ. At a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at nor mal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. ( 2 ) S o l d e r d i p : P r e h e a t : 9 0Ċ max. (Backside of PCB), Within 60 seconds S o l d e r b a t h : 2 6 0Ô5Ċ (Solder temperature), Within 5 seconds (3) Soldering iron : 350 Ċ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesi ve baking, please perform the soldering after cooling down the LED to normal temperature.