MT5150-UYS MARKTECH | Alldatasheet
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3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION P ART NO. : MT5150-UYS 5.0mm ROUND LED LAMP OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES ATTENTION
MT5150-UYS 5.0 mm ROUND LED LAMP VER.: 01 Date: 2007/03/22 Page: 1/5
Description
This yellow lamp is made with AlGaInP/Si chip and water clear epoxy resin. A K 5.98.724.0 MIN. 1.5 TYP. 0.5 MAX. 4.2 1.2 1.0 Notes: 1. All dimensions are in mm. 2. Tolerance isÔ0.25mm unless otherwise noted. Part No. Material Emitting Color Lens Color MT5150-UYS AlGaInP/Si Yellow Water clear
MT5150-UYS 5.0 mm ROUND LED LAMP VER.: 01 Date: 2007/03/22 Page: 2/5 Absolute Maximum Ratings at Ta=25Ċ Parameter Symbol Rating Unit Power Dissipation PD 130 mW Reverse V oltage VR 5 V D.C. Forward Current If 50 mA Reverse (Leakage) Current Ir 100 DŽA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 200 mA Operating Temperature Range Topr. -40 to +95 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Soldering Temperature(1.6mm from body) Tsol. Dip Soldering : 260 for Ċ 5 sec. Hand Soldering : 350 for 3 Ċ sec. Electrostatic discharge ESD. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 5860 9000 mcd Forward V oltage Vf If=20mA 2.1 2.6 V Peak Wavelength λp If=20mA 591 nm Dominant Wavelength λd If=20mA 584 589 596 nm Reverse (Leakage) Current Ir Vr=5V 100 µA Viewing Angle 2ǀ1/2 If=20mA 15 deg Spectrum Line Halfwidth ∆λ If=20mA 15 nm Notes: The datas tested by IS tester. 2. Customer’s special requirements are also welcome.
MT5150-UYS 5.0 mm ROUND LED LAMP VER.: 01 Date: 2007/03/22 Page: 3/5 Typical Electrical / Optical Characteristics Curves : Forward Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE Forward Current IF(mA) Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY Temperature ( )Ċ FORWARD CURRENT VS. AMBIENT TEMPERATURE 0 20 40 60 100 80 Forward Current IF(mA)20 100 3KQJO R j-a=500 Ċ/W RADIATION DIAGRAM 80° 90° 60° 70° 50° 30° 40° 0.10.5 0.7 0.8 0.3 1.0 0.9 0.40.2 0.6 0° 10° 20° 0.0 10.0 20.0 30.0 3000 6000 9000 12000 15000Relative Luminous Intensity(mcd)
MT5150-UYS 5.0 mm ROUND LED LAMP VER.: 01 Date: 2007/03/22 Page: 4/5 Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. Y 5860 8200 Z 8200 12000 Z1 12000 16800 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 V5 2.4 2.6 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: ǃD(nm) @20mA Group MIN . MAX. X2 584 587 X3 587 590 X4 590 593 X5 593 596
MT5150-UYS 5.0 mm ROUND LED LAMP VER.: 01 Date: 2007/03/22 Page: 5/5 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 Ċ. At a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at nor mal temperature and the resin is softened. If external force or stress is applie d at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90Ċ max. (Backside of PCB), Within 60 seconds. S o l d e r b a t h : 2 6 0Ô5Ċ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350 Ċ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp in sertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesi ve baking, please perform the soldering after cooling down the LED to normal temperature.