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P ART NO. : MT4P025-WN-A HIGH POWER LED OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES ATTENTION 3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com

VER.: 03 Date: 2010/06/22 Page: 1 /4 Package Dimensions 4.3 0.4Ô0.2 5.08Ô0.3 2.5 7.6Ô0.5 + +1 2 3 7.6Ô0.5 5.08Ô0.3 4.9±0.2 5.0±0.2 1 3 4 LL 1.2Ô0.1 2.4+0.4 -0.2 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted.

Description

Part No. Material Emitting Color Lens Color MT4P025-WN-A HIGH POWER LED 073:1$ ,Q*D16DSSKLUH 1HXWUDO:KLWH :DWHU&OHDU

VER.: 03 Date: 2010/06/22 Page: 2 /4 Absolute Maximum Ratings at Ta=25 Ċ Parameter Symbol Rating Unit Power Dissipation º PD 108 mW Reverse V oltage º VR 5 V D.C. Forward Currentº If 30 mA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)º If(Peak) 100 mA Operating Temperature Range Topr. -40 to +100 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Soldering Temperature (1.6mm from body) Tsld. Dip Soldering: 260 for 5 sec.Ċ Hand Soldering: 350 for 3 sec.Ċ Electric Static Discharge Threshold (HBM)º ESD 6000 V º The value are based on 1 die performance. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Flux º2 Ƶv If=20mA º1 8.0 10.0 lm Forward V oltageº1 Vf If=20mA º1 3.2 3.6 V 36 3650 - 3750 37 3750 - 3850 38 3850 - 4000 40 4000 - 4150 Correlated Colour Temperatureº2 CCT If=20mA º1 4150 - 4300 oK Reverse Current º1 Ir Vr=5Vº1 50 µA Color Rendering Index(Ra) CRI If=20mA º1 70 Viewing Angleº2 2ǀ1/2 If=20mA º1 25 deg Notes: 1.The datas tested by IS tester. 2 . C u s t o m e r ’ s s p ecial requirements are also welcome. 3.º1 For each die 4.º2 When all LED dies are operated simultaneously.. MT4P025-WN-A HIGH POWER LED

VER.: 03 Date: 2010/06/22 Page: 3 /4 Typical Electrical/Optical Characteristic Curves (25 Ambient Temperature Unless Otherwise NotedĊ ) Wavelength (nm) Relative Response 300 600 400 500 700 800 0.6 0.2 0.4 0.8 1.2 1.0 Fig.1 WHITE LED Spectrum VS. WAVELENGTH Applied Voltage (V) Forward Current IF(mA) Forward Current (mA) 10.00 2.0 4.0 30.00.0 6.0 8.0 10.0 12.0 Luminous Flux(lm) 40.0 Forward Current VS. Applied V oltage Forward Current VS. Luminous Intensity Ambient Temperature Ta ( )Ċ 0 20 40 60 100 80 Forward Current IF(mA)10 120 10° 0.2 0.8 0.7 0.30.5 0.1 0.9 1.0 80° 70° 90° 0.4 0.6 40° 60° 50° 30° 20° Ambient Temperature VS. Forward Current Radiation Diagram MT4P025-WN-A HIGH POWER LED

VER.: 03 Date: 2010/06/22 Page: 4 /4 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130Ċ. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90Ċ max. (Backside of PCB), Within 60 seconds. S o l d e r b a t h : 2 6 0Ô5Ċ (Solder temperature), Within 5 seconds. ( 3 ) H a n d S o l d e r i n g : 3 5 0Ċ max. (Temperature of solderin g iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED re sin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. MT4P025-WN-A HIGH POWER LED