MT240-G-A MARKTECH | Alldatasheet

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Technical content

P ART NO. : MT240-G-A 3.0mm ROUND LED LAMP 3 Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com

REV.: 01 Date: 2005/07/26 Page: 1/5

Description

This green lamp is made wi th GaP/GaP super red chip and green diffused epoxy resin. AK Package Dimensions 24.0 MIN. 1.5TYP. 1.3 4.8 2.54 1.0 MAX. Notes: 1. ALL DIMENSIONS ARE IN mm. 2. TOLERANCE IS ±0.25mm UNLESS OTHERWISE NOTED. Part No. Material Emitting Color Lens Color MT240-G-A GaP/GaP Green Green diffused MT240-G-A 3.0mm ROUND LED LAMP

REV.: 01 Date: 2005/07/26 Page: 2/5 Absolute Maximum Ratings at Ta=25Ċ Parameter Symbol Rating Unit Power Dissipation PD 78 mW Reverse V oltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 100 DŽA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Lead Soldering Temp.(1.6mm from body) for 5 seconds 260 Ċ Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 6.22 16.0 mcd Forward V oltage Vf If=20mA 2.1 2.6 V Peak Wavelength λP If=20mA 567 nm Dominant Wavelength λD If=20mA 572 nm Reverse (Leakage) Current Ir Vr=5V 100 µA Viewing Angle 2ǀ1/2 If=20mA 60 deg Spectrum Line Halfwidth ∆λ If=20mA 30 nm NOTE: THE DATAS TESTED BY IS TESTER MT240-G-A 3.0mm ROUND LED LAMP

REV.: 01 Date: 2005/07/26 Page: 3/5 Typical Electrical / Optical Characteristics Curves : Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGEForward Current IF(mA) 20.0 Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY Relative Luminous Intensity 10.00 30.00.0 5.0 10.0 15.0 20.0 25.0 Temperature(fC) FORWARD CURRENT VS. AMBIENT TEMPERATURE 02 0 4 0 6 0 1 0 0 80 Forward Current IF(mA)10 RADIATION DIAGRAM 80Ę 90Ę 60Ę 70Ę 50Ę 30Ę 40Ę 0.10.5 0.7 0.8 0.3 1.0 0.9 0.40.2 0.6 0Ę 10Ę 20Ę MT240-G-A 3.0mm ROUND LED LAMP

REV.: 01 Date: 2005/07/26 Page: 4/5 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 Ċ. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. ( 2 ) S o l d e r d i p : P r e h e a t : 9 0Ċ max. (Backside of PCB), Within 120 seconds S o l d e r b a t h : 2 5 0Ċ max. (Solder temperature), Within 5 seconds ( 3 ) S o l d e r i n g i r o n : 2 5 0Ċ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. MT240-G-A 3.0mm ROUND LED LAMP