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P ART NO. : MT7-*-A OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES ATTENTION 3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com

VER.: 01 Date: 2007/03/16 Page: 1/5

Description

This green lamp is made with GaP/GaP chip and green diffused epoxy resin. 5.224.0 MIN. 426"3&9 A 0.8 4.0 K 2.8 2.0 1.5TYP Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Part No. Material Emitting Color Lens Color 0T27-*$ 2.0×4.0mm RECTANG ULAR LED LAMP

VER.: 01 Date: 2007/03/16 Page: 2/ Absolute Maximum Ratings at Ta=25Ċ Parameter Symbol Rating Unit Power Dissipation PD 78 mW Reverse V oltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 100 DŽA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Soldering Temperature(1.6mm from body) Tsol Dip Soldering : 260 Ċ for 5 sec. Hand Soldering : 350Ċ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 6.0 10.0 mcd Forward V oltage Vf If=20mA 2.1 2.6 V Peak Wavelength λp If=20mA 576 nm Dominant Wavelength λd If=20mA 572 nm Reverse (Leakage) Current Ir Vr=5V 100 µA Viewing Angle 2ǀ1/2 If=20mA 120 deg Spectrum Line Halfwidth ∆λ If=20mA 30 nm Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. 0T27-*$ 2.0×4.0mm RECTANG ULAR LED LAMP

VER.: 01 Date: 2007/03/16 Page: 3/ Typical Electrical / Optical Characteristics Curves : Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGEForward Current IF(mA) 20.0 Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITYRelative Luminous Intensity 10.00 5.0 10.0 20.0 15.0 25.0 30.00.0 Temperature(fC) FORWARD CURRENT VS. AMBIENT TEMPERATURE 02 0 4 0 6 0 1 0 0 80 Forward Current IF(mA)10 RADIATION DIAGRAM 80° 90° 60° 70° 50° 30° 40° 0.10.5 0.7 0.8 0.3 1.0 0.9 0.40.2 0.6 0° 10° 20° 0T27-*$ 2.0×4.0mm RECTANG ULAR LED LAMP

VER.: 01 Date: 2007/03/16 Page: 4/ Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 Ċ. At a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at nor mal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90Ċ max. (Backside of PCB), Within 60 seconds. S o l d e r b a t h : 2 6 0Ô5Ċ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350 Ċ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesi ve baking, please perform the soldering after cooling down the LED to normal temperature. 0T27-*$ 2.0×4.0mm RECTANG ULAR LED LAMP