MT1303A-UR-A MARKTECH | Alldatasheet
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3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION P ART NO. : MT1303A-UR-A 3.0mm ROUND LED LAMP OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES ATTENTION
MT1303A-UR-A 3.0mm ROUND LED LAMP VER.: 01 Date: 2007/10/22 Page: 1/5
Description
This ultrabright red lamp is made with AlGaInP/GaP chip and water clear epoxy resin. Ô AK Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Part No. Material Emitting Color Lens Color MT1303A-UR-A AlGaInP/GaP Ultrabright red Water clear
MT1303A-UR-A 3.0mm ROUND LED LAMP VER.: 01 Date: 2007/10/22 Page: 2/5 Absolute Maximum Ratings at Ta=25Ċ Parameter Symbol Rating Unit Power Dissipation PD 78 mW Reverse V oltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 100 DŽA Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA Operating Temperature Range Topr. -40 to +95 Ċ Storage Temperature Range Tstg. -40 to +100 Ċ Soldering Temperature(1.6mm from body) Tsol Dip Soldering : 260 Ċ for 5 sec. Hand Soldering : 350Ċ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 550 1200 2130 mcd Forward V oltage Vf If=20mA 2.2 2.6 V Peak Wavelength λp If=20mA 642 nm Dominant Wavelength λd If=20mA 630 nm Reverse (Leakage) Current Ir Vr=5V 100 µA Viewing Angle 2ǀ1/2 If=20mA 40 deg Spectrum Line Halfwidth ∆λ If=20mA 20 nm Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome.
MT1303A-UR-A 3.0mm ROUND LED LAMP VER.: 01 Date: 2007/10/22 Page: 3/5 Typical Electrical / Optical Characteristics Curves : Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE Forward Current IF(mA) 20.0 Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITYRelative Luminous Intensity 10.00 400 800 1600 1200 2000 30.00.0 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0 2 04 06 0 1 0 0 80 Forward Current IF(mA)10 Temperature ( )Ċ RADIATION DIAGRAM 80° 90° 60° 70° 50° 30° 40° 0.10.5 0.7 0.8 0.3 1.0 0.9 0.40.2 0.6 0° 10° 20°
MT1303A-UR-A 3.0mm ROUND LED LAMP VER.: 01 Date: 2007/10/22 Page: 4/5 Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. R 550 770 S 770 1100 T 1100 1520 U 1520 2130 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 V5 2.4 2.6 *Majority VF bins are highlighted in Yellow.
MT1303A-UR-A 3.0mm ROUND LED LAMP VER.: 01 Date: 2007/10/22 Page: 5/5 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130Ċ. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Solder dip: Preheat: 90 Ċ max. (Backside of PCB), Within 60 seconds S o l d e r b a t h : 2 6 0Ô5Ċ (Solder temperature), Within 5 seconds (3) Soldering iron : 350 Ċ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED re sin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 Ċ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.