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Technical content
Features
International standard package High Surge Capability Glass passivated chip Simple Mounting Heat transfer through aluminum oxide DBCceramic isolated metal baseplate UL recognized applied for file no. E360040 TYPE VRRM/VDRM VRSM MT110CB08T1 MT110CB12T1 MT110CB16T1 MT110CB18T1 800V 1200V 1600V 1800V 900V 1300V 1700V 1900V Circuit 1 32
Applications
Power Converters Lighting Control DC Motor Control and Drives Heat and temperature control Symbol Item Conditions Values Units Min. Typ. Max. VFM Forward Voltage Drop, max. T=25℃ IF =300A 1.65 V IRRM Repetitive Peak Reverse Current, max. Tvj =25℃ VRD=VRRM Tvj =125℃ VRD=VRRM ≤0.5 mA mA S-M049 www.21yangjie.com Rev.2.0, 27-May-17 1
◆Thyristor Maximum Ratings Thermal Characteristics Symbol Item Conditions Values Units Rth(j-c) Thermal Impedance, max. Junction to Case 0.28 ℃/W Rth(c-s) Thermal Impedance, max. Case to Heatsink 0.20 ℃/W
Electrical Characteristics
Symbol Item Conditions Values Units ITAV Average On-State Current Sine 180o;Tc=85℃ 110 A ITSM Surge On-State Current TVJ =45℃ t=10ms, sine TVJ =125℃ t=10ms, sine 2250 1900 A i2t Circuit Fusing Consideration TVJ =45℃ t=10ms, sine TVJ =125℃ t=10ms, sine 25000
18000 A2s
Tvj Operating Junction Temperature -40 to +130 ℃ Tstg Storage Temperature -40 to +125 ℃ Mt Mounting Torque To terminals(M5) 3±15% Nm Ms To heatsink(M6) 5±15% Nm di/dt Critical Rate of Rise of On-State Current TVJ= TVJM , 2/3VDRM ,IG =500mA Tr<0.5us,tp>6us 150 A/us dv/dt Critical Rate of Rise of Off-State Voltage, min. TJ=TVJM ,2/3VDRM linear voltage rise 1000 V/us a Maximum allowable acceleration 50 m/s2 Symbol Item Conditions Values Units Min. Typ. Max. VTM Peak On-State Voltage, max. T=25℃ IT =300A 1.65 V IRRM/IDRM Repetitive Peak Reverse Current, max. / Repetitive Peak O ff-State Current, max. TVJ=TVJM ,VR=VRRM ,VD= VDRM 20 mA VTO On state threshold voltage For power-loss calculations only (TVJ =125℃) 0.9 V rT Value of on-state slope resistance. max TVJ =TVJM 2 mΩ VGT Gate Trigger Voltage, max. TVJ =25℃ , VD =6V 3 V IGT Gate Trigger Current, max. TVJ =25℃ , VD =6V 150 mA VGD Non-triggering gate voltage, max. TVJ=125℃,VD =2/3VDRM 0.25 V IGD Non-triggering gate current, max. TVJ =125℃, VD =2/3VDRM 6 mA IL Latching current, max. TVJ =25℃ , RG = 33 Ω 300 600 mA IH Holding current, max. TVJ =25℃ , VD =6V 150 250 mA tgd Gate controlled delay time TVJ=25℃, IG=1A, diG/dt=1A/us 1 us tq Circuit commutated turn-off time TVJ =TVJM 100 us S-M049 www.21yangjie.com Rev.2.0, 27-May-17 2
Fig1. Power dissipation Fig2.Forward Current Derating Curve
0 I TAV 50 100 A 150
W 150 100 PTAV rec.30 rec.60 rec.120 sin.180 DC Fig3. Transient thermal impedance Fig4. Max Non-Repetitive Forward Surge Current Fig5. Forward Characteristics 0.001 t 0.01 0.1 1 10 S 100 0.50 ℃/ W 0.25 Zth(j-C) Zth(j-S) 10 100 ms 1000 50HZ 2500 A 1250 0 V TM 0.5 1.0 1.5 V 2.0 300 A 200 100 I T max. Typ. DC sin.180 rec.120 rec.60 rec.30 ITAVM 200 A 160 120
0 Tc 50 100 ℃ 130
25℃ - - -125℃ S-M049 www.21yangjie.com Rev.2.0, 27-May-17 3
Package Outline Information CASE: T1 Dimensions in mm Fig6. Gate trigger Characteristics 1/2·MT110CB18T1 VGD125℃ IGD125℃ IGT VGT 20V;20Ω 150 W(0.1ms )100W(0. 5ms)50W(8ms) PG(tp) 0.001 I G 0.01 0.1 1 10 A 100 100 V V G 0.1 -40℃ 25℃ 125℃ Tvj YJ S-M049 www.21yangjie.com Rev.2.0, 27-May-17 4