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Technical content

Features

  • Soft Recovery with Low Reverse Recovery Charge (QRR) and Peak Reverse Recovery Current (IRRM)
  • Epoxy meets UL 94 V−0 @ 0.125 in
  • Low Forward V oltage
  • Low Leakage Current
  • High Temperature Glass Passivated Junction
  • These are Pb−Free Devices Mechanical Characteristics:
  • Case: Epoxy, Molded
  • Weight: 1.9 Grams (Approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable
  • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current (At Rated VR, TC = 125°C) IO 15 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz,TC = 125°C) IFRM 30 A Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 100 A Operating Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C THERMAL CHARACTERISTICS Parameter Symbol Value Unit MSR1560G: Thermal Resistance Junction−to−Case Junction−to−Ambient R/C0113JC R/C0113JA 1.6 72.8 °C/W MSRF1560G: Thermal Resistance Junction−to−Case Junction−to−Ambient R/C0113JC R/C0113JA 4.25 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. SOFT RECOVERY POWER RECTIFIER

15 AMPERES, 600 VOLTS

ORDERING INFORMATION

MSR1560G TO −220AC (Pb−Free)

50 Units/Rail

http://onsemi.com TO−220AC CASE 221B STYLE 1 MARKING DIAGRAMS A = Assembly Location Y = Year WW = Work Week G = Pb −Free Package KA = Diode Polarity AY WWG MSR1560 KA TO−220 FULLPAK CASE 221AG STYLE 1 MSRF1560G TO −220FP (Pb−Free)

Figure 16. Thermal Response, (MSRF1560) Junction−to−Ambient (R/C0113JA)

MSR1560G, MSRF1560G http://onsemi.com PACKAGE DIMENSIONS TO−220 TWO−LEAD CASE 221B−04 ISSUE F STYLE 1: PIN 1. CATHODE 2. N/A 3. ANODE 4. CATHODE B R J D G L H Q T U A K C S DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.620 15.11 15.75 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.82 D 0.025 0.039 0.64 1.00 F 0.142 0.161 3.61 4.09 G 0.190 0.210 4.83 5.33 H 0.110 0.130 2.79 3.30 J 0.014 0.025 0.36 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.14 1.52 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.14 1.39 T 0.235 0.255 5.97 6.48 U 0.000 0.050 0.000 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.F TO−220 FULLPAK, 2−LEAD CASE 221AG ISSUE A STYLE 1: PIN 1. CATHODE 2. N/A 3. ANODE DIM MIN MAX MILLIMETERS D 14.22 15.88 E 9.65 10.67 A 4.30 4.70 b 0.54 0.84 P 3.00 3.40 e L1 --- 2.80 c 0.49 0.79 L 12.70 14.73 b2 1.10 1.40 Q 2.80 3.20 A2 2.50 2.90 A1 2.50 2.90 H1 5.97 6.48 E Q e D L P 12 3 b SEATING PLANE A A1H1 c NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR UNCONTROLLED IN THIS AREA. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY. 5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.

2.54 BSC

M0.14 MA A B C E/2 M0.25 MAB C3X B NOTE 3 e1 5.08 BSCe1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MSR1560/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative