MSRD620CT_V01 ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 7

Technical content

Features

  • Soft Ultrafast Recovery (35 ns typ)
  • Highly Stable Oxide Passivated Junction
  • Matched Dual Die Construction − May Be Paralleled for High Current Output
  • Short Heat Sink Tab Manufactured − Not Sheared
  • Epoxy Meets UL 94 V−0 @ 0.125 in.
  • NRVSRD and SSRD8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant* Mechanical Characteristics
  • Case: Epoxy, Molded
  • Weight: 0.4 Grams (Approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
  • ESD Ratings: ♦ Machine Model = C ♦ Human Body Model = 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOFT ULTRAFAST RECTIFIER

6.0 AMPERES, 200 VOLTS

2, 4 DPAK CASE 369C MARKING DIAGRAM A = Assembly Location Y = Year WW = Work Week G = Pb −Free Package AYWW S 620TG Device Package Shipping †

ORDERING INFORMATION

(Pb−Free) 2,500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MSRD620CTG DPAK (Pb−Free)

75 Units/Rail

www.onsemi.com NRVSRD620VCTT4G DPAK (Pb−Free) 2,500 / Tape & Reel SSRD8620CTT4G DPAK (Pb−Free) 2,500 / Tape & Reel

MSRD620CT, NRVSRD620VCT, SSRD8620CT Series www.onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (TC = 137°C) Per Leg Per Package IO 3.0 6.0 A Peak Repetitive Forward Current (Square Wave, Duty = 0.5, TC = 138°C) Per Leg IFRM 6.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Per Package IFSM A Storage / Operating Case Temperature Tstg, Tc −55 to +175 °C Operating Junction Temperature TJ −55 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance − Junction−to−Case Per Leg R/C0113JC 9.0 °C/W Thermal Resistance − Junction−to−Ambient Per Leg R/C0113JA °C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2) Per Leg VF TJ = 25°C TJ = 150°C V (IF = 3.0 A) (IF = 6.0 A) 1.15 1.35 1.05 1.30 Maximum Instantaneous Reverse Current (See Figure 4) Per Leg IR TJ = 25°C TJ = 150°C /C0109A (VR = 200 V) (VR = 100 V) 5.0 2.0 200 100 Maximum Reverse Recovery Time (Note 2) Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A//C0109s) (VR = 30 V, IF = 3.0 A, di/dt = 50 A//C0109s) trr ns Maximum Peak Reverse Recovery Current Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A//C0109s) (VR = 30 V, IF = 3.0 A, di/dt = 50 A//C0109s) IRM 2.0 3.0 A 1. Pulse Test: Pulse Width ≤ 250 /C0109s, Duty Cycle ≤ 2%. 2. t rr measured projecting from 25% of IRM to ground.

Figure 1. Typical Forward Voltage, Per Leg Figure 2. Maximum Forward Voltage, Per Leg Figure 3. Typical Reverse Current, Per Leg Figure 4. Maximum Reverse Current, Per Leg Figure 5. Current Derating, Case (Per Leg) Figure 6. Current Derating, Ambient (Per Leg)

4.5 RATED VOLTAGE APPLIED

Figure 9. Transient Thermal Response (R/C0113JC)

DPAK (SINGLE GAUGE) CASE 369C ISSUE F DATE 21 JUL 2015 SCALE 1:1 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2 STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 1 2 STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE STYLE 9: PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE STYLE 10: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE b D E M0.005 (0.13) C A c C Z DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY . 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. 12 3 XXXXXX = Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb −Free Package AYWW XXX XXXXXG XXXXXXG ALYWW DiscreteIC 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 /C0466mm inches/C0467SCALE 3:1 GENERIC MARKING DIAGRAM* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC HDETAIL A SEATING PLANE A B C L H L2 GAUGE PLANE DETAIL A ROTATED 90 CW/C0053 e BOTTOM VIEW Z BOTTOM VIEW SIDE VIEW TOP VIEW ALTERNATE CONSTRUCTIONS NOTE 7 Z *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON10527DDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1DPAK (SINGLE GAUGE) onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com

onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative