MSQA6V1W5T2 ONSEMI | Alldatasheet

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Technical content

 Semiconductor Components Industries, LLC, 2003 November, 2003 − Rev. 3

1 Publication Order Number:

This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features

  • SC88A Package Allows Four Separate Unidirectional Configurations
  • Low Leakage < 1 A @ 3 V olt
  • Breakdown V oltage: 6.1 V olt − 7.2 V olt @ 1 mA
  • Low Capacitance (90 pF typical)
  • ESD Protection Meeting IEC1000−4−2 Mechanical Characteristics
  • V oid Free, Transfer−Molded, Thermosetting Plastic Case
  • Corrosion Resistant Finish, Easily Solderable
  • Package Designed for Optimal Automated Board Assembly
  • Small Package Size for High Density Applications SC−88A/SOT−323 CASE 419A Device Package Shipping †

ORDERING INFORMATION

MSQA6V1W5T2 SC−88A 3000/Tape & Reel 61 = Device Marking D = One Digit Date Code D MARKING DIAGRAM 13 2 NOTE: T2 Suffix Devices are Packaged with Pin 1 NOTE: Opposing Sprocket Hole. http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

http://onsemi.com MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 20 s @TA ≤ 25°C (Note 1) Ppk 150 W Steady State Power − 1 Diode (Note 2) PD 385 mW Thermal Resistance Junction to Ambient Above 25°C, Derate R JA 325 3.1 °C/W mW/ °C Maximum Junction Temperature TJmax 150 °C Operating Junction and Storage Temperature Range TJ Tstg −55 to +150 °C ESD Discharge MIL STD 883C − Method 3015−6 IEC1000−4−2, Air Discharge IEC1000−4−2, Contact Discharge VPP 16 kV Lead Solder Temperature (10 seconds duration) TL 260 °C

ELECTRICAL CHARACTERISTICS

VBR @ 1 mA (Volts) Leakage Current IRM @V RWM =3V Capacitance @ 0 V Bias Max VF @I F = 200 mA Device Min Nom Max IRM @ VRWM = 3 V (A) @ 0 V Bias (pF) VF @ IF = 200 mA (V) 1. Non−repetitive current per Figure 1. Derate per Figure 2. 2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR−4 board with min pad. Figure 1. Pulse Width Figure 2. 8 × 20 s Pulse Waveform 1000, PEAK SURGE POWER (WATTS)pk NOTE: Non−Repetitive Surge.

Figure 3. Pulse Derating Curve Figure 4. Capacitance Figure 5. Forward Voltage Figure 6. Clamping Voltage versus Peak

1 MHz FREQUENCY

Figure 7. Clamping Voltage versus Peak

http://onsemi.com PACKAGE DIMENSIONS SC−88A/SOT−323 5−LEAD PACKAGE CASE 419A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 B0.2 (0.008) MM 12 3 A G S D 5 PL H C N J K −B− ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 MSQA6V1W5T2/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.