MSP-TS430DA38

Texas Instruments

MSP430 Hardware Tools User Guide

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PDF pages: 138

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Datasheet sections

1.1 FlashEmulationTool(FET)Overview
1.2 KitContents,MSP-FET430PIF
1.3 KitContents,eZ430-F2013
1.4 KitContents,eZ430-T2012
1.5 KitContents,eZ430-RF2500
1.6 KitContents,eZ430-RF2500T
1.7 KitContents,eZ430-RF2500-SEH
1.8 KitContents,eZ430-Chronos-xxx
1.9 KitContents,MSP-FET430UIF
1.10 KitContents,MSP-FET430xx
1.11 KitContents,FET430Fx137RF900
1.12 KitContents,MSP-TS430xx
1.13 KitContents,EM430Fx137RF900
1.14 Hardware Installation,MSP-FET430PIF
1.15 Hardware Installation,MSP-FET430UIF
1.16 Hardware Installation,eZ430-F2013,eZ430-RF2500,eZ430-Chronos
1.17 Hardware Installation,MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900, EM430Fx137RF900
1.18 ImportantMSP430 Documents on theCD-ROM and Web
2 Design ConsiderationsforIn-CircuitProgramming
2.1 SignalConnectionsforIn-SystemProgramming and Debugging
2.2 ExternalPower
2.3 BootstrapLoader(BSL)

User's Guide LiteratureNumber: SLAU278F May 2009–RevisedDecember 2010

2 SLAU278F –May 2009–RevisedDecember 2010

www.ti.com

4 Contents SLAU278F –May 2009–RevisedDecember 2010

www.ti.com

6 ListofFigures SLAU278F –May 2009–RevisedDecember 2010

8 ListofTables SLAU278F –May 2009–RevisedDecember 2010

SLAU278F –May 2009–RevisedDecember 2010 Read ThisFirst About ThisManual Thismanual describesthehardwareoftheTexas InstrumentsMSP-FET430 FlashEmulationTool(FET). The FET istheprogramdevelopmenttoolfortheMSP430 ultra-low-powermicrocontroller.Bothavailable interfacetypes,theparallelportinterfaceand theUSB interface,aredescribed. How toUse ThisManual Read and followtheinstructionsinChapter1.ThischapterliststhecontentsoftheFET, provides instructionson installingthehardwareand accordingsoftwaredrivers.Afteryou see how quickand easy it istouse thedevelopmenttools,TIrecommends thatyou readallofthismanual. Thismanual describesthesetupand operationoftheFET butdoes notfullydescribetheMSP430 ™ microcontrollersorthedevelopmentsoftwaresystems.Fordetailsoftheseitems,see theappropriateTI documents listedinSection1.18. Thismanual appliestothefollowingtools(anddevices):

MSP-FET430PIF (debuginterfacewithparallelportconnection,forallMSP430 flash-baseddevices)
MSP-FET430UIF (debuginterfacewithUSB connection,forallMSP430 flash-baseddevices)
eZ430-F2013 (USB stickformfactorinterfacewithattachedMSP430F2013 target,forall MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices)
eZ430-T2012 (threeMSP430F2012 based targetboards)
eZ430-RF2500 (USB stickformfactorinterfacewithattachedMSP430F2274/CC2500 target,forall MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices)
eZ430-RF2500T (oneMSP430F2274/CC2500 targetboardincludingbatterypack)
eZ430-RF2500-SEH (USB stickformfactorinterfacewithattachedMSP430F2274/CC2500 targetand solarenergyharvestingmodule)
eZ430-Chronos-xxx(USB stickformfactorinterfacewithCC430F6137 based developmentsystem containedina watch.Includes<1 GHz RF USB accesspoint) 9SLAU278F –May 2009–RevisedDecember 2010 Read ThisFirst SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

How toUse ThisManual www.ti.com The followingtoolscontaintheUSB debug interface(MSP-FET430UIF) and therespectivetargetsocket module:

MSP-FET430U14 (forMSP430F20xx, MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devicesin14-pinPW packages)
MSP-FET430U092 (forMSP430FL092 devicesin14-pinPW packages)
MSP-FET430U24 (forMSP430AFE2xx devicesin24-pinPW packages)
MSP-FET430U28 (forMSP430F11xx(A) devicesin20-and 28-pinDW orPW packages)
MSP-FET430U28A (forMSP430F20xx and MSP430G2xxx devicesin14-,20-,and 28-pinPW)
MSP-FET430U38 (forMSP430F22x2 and MSP430F22x4 devicesin38-pinDA packages)
MSP-FET430U23x0 (forMSP430F23x0 devicesin40-pinRHA packages)
MSP-FET430U40 (forMSP430F51x1, MSP430F51x2 devicesin40-pinRSB packages)
MSP-FET430U40A (forMSP430FR572x, MSP430FR573x devicesin40-pinRHA packages)
MSP-FET430U48 (forMSP430F22x2 and MSP430F22x4 devicesin48-pinDL packages)
MSP-FET430U48B (forMSP430F534x devicesin48-pinRGZ packages)
MSP-FET430U64 (forMSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devicesin64-pinPM packages)
MSP-FET430U64A (forMSP430F41x2 devicesin64-pinPM packages)
MSP-FET430U64B (forMSP430F530x devicesin64-pinRGC packages)
MSP-FET430U64USB (forMSP430F550x, MSP430F551x, MSP430552x, devicesin64-pinRGC packages
MSP-FET430U80 (forMSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devicesin80-pinPN packages)
MSP-FET430U80A (forMSP430F532x devicesin80-pinPN packages)
MSP-FET430U80USB (forMSP430F552x deviceswithUSB peripheralin80-pinPN packages)
MSP-FET430U100 (forMSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devicesin100-pinPZ packages)
MSP-FET430U100A (forMSP430F471xx devicesin100-pinPZ packages-redPCB)
MSP-FET430U5x100 (forMSP430F54xx(A) devicesand theMSP430BT5190 in100-pinPZ packages)
MSP-FET430U100USB (forMSP430F663x and MSP430F563x devicesin100-pinPZ packages)
FET430F5137RF900 (forCC430F513x devicesin48-pinRGZ packages)
FET430F6137RF900 (forCC430F612x and CC430F613x devicesin64-pinRGC packages) Stand-alonetarget-socketmodules (withoutdebug interface):
MSP-TS430PW14 (forMSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devicesin14-pinPW packages)
MSP-TS430L092 (forMSP430FL092 devicesin14-pinPW packages)
MSP-TS430PW24 (forMSP430AFE2xx devicesin24-pinPW packages)
MSP-TS430DW28 (forMSP430F11xx(A) devicesin28-inDW packages)
MSP-TS430PW28 (forMSP430F11xx(A) devicesin28-inPW packages)
MSP-TS430PW28A (forMSP430F20xx and MSP430G2xxx devicesin14,20 and 28-pinPW)
MSP-TS430DA38 (forMSP430F22x2 and MSP430F22x4 devicesin38-pinDA packages)
MSP-TS430QFN23x0 (forMSP430F23x0 devicesin40-pinRHA packages)
MSP-TS430RSB40 (forMSP430F51x1, MSP430F51x2 devicesin40-pinRSB packages)
MSP-TS430RHA40A ((forMSP430FR572x, MSP430FR573x devicesin40-pinRHA packages)
MSP-TS430DL48 (forMSP430F22x2 and MSP430F22x4 devicesin48-pinDL packages)
MSP-TS430RGZ48B (forMSP430F534x devicesin48-pinRGZ packages)
MSP-TS430PM64 (forMSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1), MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A), MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devicesin64-pinPM packages)
MSP-TS430PM64A (forMSP430F41x2 devicesin64-pinPM packages)

10 Read ThisFirst SLAU278F –May 2009–RevisedDecember 2010

www.ti.com InformationAboutCautionsand Warnings

MSP-TS430RGC64B (forMSP430F530x devicesin64-pinRGC packages)
MSP-TS430RGC64USB (forMSP430F550x, MSP430F551x, MSP430552x, devicesin64-pinRGC packages)
MSP-TS430PN80 (forMSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x, MSP430F47x, and MSP430FG47x devicesin80-pinPN packages)
MSP-TS430PN80A (forMSP430F532x devicesin80-pinPN packages)
MSP-TS430PN80USB (forMSP430F552x deviceswithUSB peripheralin80-pinPN packages)
MSP-TS430PZ100 (forMSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and MSP430F47xx devicesin100-pinPZ packages)
MSP-TS430PZ100A (forMSP430F471xx devicesin100-pinPZ packages— redPCB)
MSP-TS430PZ5x100 (forMSP430F54xx(A) and theMSP430BT5190 devicesin100-pinPZ packages)
MSP-TS430PZ100USB (forMSP430F663x and MSP430F563x devicesin100-pinPZ packages)
EM430F5137RF900 (withintegratedCC430F5137 IC ina 48-pinRGZ package)
EM430F6137RF900 (withintegratedCC430F6137 IC ina 64-pinRGC package) These toolscontainthemost up-to-datematerialsavailableatthetimeofpackaging.Forthelatest materials(datasheets,user'sguides,software,applicationinformation,etc.),visittheTIMSP430 web site atwww.ti.com/msp430orcontactyourlocalTIsalesoffice. InformationAbout Cautionsand Warnings Thisdocument may containcautionsand warnings. CAUTION Thisisan example ofa cautionstatement. A cautionstatementdescribesa situationthatcouldpotentiallydamage your softwareorequipment. WARNING Thisisan example ofa warning statement. A warning statement describes a situationthatcould potentially cause harm toyou. The informationina cautionora warningisprovidedforyourprotection.Read each cautionand warning carefully. 11SLAU278F –May 2009–RevisedDecember 2010 Read ThisFirst SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

RelatedDocumentationFrom Texas Instruments www.ti.com RelatedDocumentation From Texas Instruments MSP430 development toolsdocumentation: CCS forMSP430 User'sGuide,literaturenumber SLAU157 Code Composer Studiov4.xCore Edition,CCS Mediawiki IAR forMSP430 User'sGuide,literaturenumber SLAU138 IAR Embedded Workbench KickStart,SLAC050 eZ430-F2013 DevelopmentToolUser'sGuide,literaturenumber SLAU176 eZ430-RF2480 User'sGuide,literaturenumber SWRA176 eZ430-RF2500 DevelopmentToolUser'sGuide,literaturenumber SLAU227 eZ430-RF2500-SEH DevelopmentToolUser'sGuide,literaturenumber SLAU273 eZ430-ChronosDevelopmentToolUser'sGuide,literaturenumber SLAU292 MSP430xxxx deviceuser'sguides: MSP430x1xx FamilyUser'sGuide,literaturenumber SLAU049 MSP430x2xx FamilyUser'sGuide,literaturenumber SLAU144 MSP430x3xx FamilyUser'sGuide,literaturenumber SLAU012 MSP430x4xx FamilyUser'sGuide,literaturenumber SLAU056 MSP430x5xx FamilyUser'sGuide,literaturenumber SLAU208 CC430 FamilyUser'sGuide,literaturenumber SLAU259 IfYou Need Assistance SupportfortheMSP430 devicesand theFET developmenttoolsisprovidedby theTexas Instruments ProductInformationCenter(PIC).ContactinformationforthePIC can be foundon theTIweb siteat www.ti.com/support.The Texas InstrumentsE2E Community supportforumsfortheMSP430 provide open interactionwithpeerengineers,TIengineers,and otherexperts.Additionaldevice-specific informationcan be foundon theMSP430 web site. FCC Warning Thisequipmentisintendedforuse ina laboratorytestenvironmentonly.Itgenerates,uses,and can radiateradiofrequencyenergyand has notbeen testedforcompliancewiththelimitsofcomputing devicespursuanttosubpartJ ofpart15 ofFCC rules,whicharedesignedtoprovidereasonable protectionagainstradio-frequencyinterference.Operationofthisequipmentinotherenvironmentsmay cause interferencewithradiocommunications,inwhichcase,theuserisrequiredtotakewhatever measures may be requiredtocorrectthisinterferenceathisown expense.

12 Read ThisFirst SLAU278F –May 2009–RevisedDecember 2010

SLAU278F –May 2009–RevisedDecember 2010 Get StartedNow! ThischapterliststhecontentsoftheFET and providesinstructionon installingthehardware.

1.17 Hardware Installation,MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900,

FlashEmulationTool(FET)Overview www.ti.com

1.1 FlashEmulationTool (FET)Overview

TIoffersseveralflashemulationtoolsaccordingtodifferentrequirements. Table1-1.FlashEmulationTool (FET)Features MSP-eZ430-F2013 eZ430-RF2500 eZ430-Chronos MSP-FET430PIFFET430UIF Supports allMSP430 and CC430 flash-baseddevices('F1xx,'F2xx, X X 'F4xx,'F5xx,'F6xx,'G2xx, 'L092) Supports only'F20xx,'G2x01, X'G2x11, 'G2x21, 'G2x31 Supports onlyMSP430F20xx, 'F21x2,'F22xx,'G2x01, 'G2x11, X 'G2x21, 'G2x31 Supports only CC430F51xx, 'F61xx, XMSP430F20xx, 'F21x2,'F22xx, 'F41x2,'F54xx,'F54xxA, 'F55xx Allows fuseblow X Adjustabletargetsupply voltage X Fixed2.8-Vtargetsupply voltage X Fixed3.6-Vtargetsupply voltage X X X 4-wireJTAG X X 2-wireJTAG (1) X X X X ApplicationUART X X Supported by CCE X X X X Supported by CCS X X X X X (2) Supported by IAR X X X X X (1) The 2-wireJTAG debug interfaceisalsoreferredtoas Spy-Bi-Wire(SBW) interface. (2) Not supportedby default.Driverinstallationneeds tobe selectedmanuallyduringtheCCS installationprocess.

1.2 KitContents,MSP-FET430PIF

One READ ME FIRST document
One MSP430 CD-ROM
One MSP-FET430PIF interfacemodule
One 25-conductorcable
One 14-conductorcable

1.3 KitContents,eZ430-F2013

One QUICK START GUIDE document
One eZ430-F2013 CD-ROM
One eZ430-F2013 developmenttoolincludingone MSP430F2013 targetboard

1.4 KitContents,eZ430-T2012

ThreeMSP430F2012-based targetboards 14 Get StartedNow! SLAU278F –May 2009–RevisedDecember 2010 SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

www.ti.com KitContents,eZ430-RF2500

1.5 KitContents,eZ430-RF2500

One QUICK START GUIDE document
One eZ430-RF2500 CD-ROM
One eZ430-RF2500 developmenttoolincludingone MSP430F2274/CC2500 targetboard
One eZ430-RF2500T targetboard
One AAA batterypack withexpansionboard(batteriesincluded)

1.6 KitContents,eZ430-RF2500T

One eZ430-RF2500T targetboard
One AAA batterypack withexpansionboard(batteriesincluded)

1.7 KitContents,eZ430-RF2500-SEH

One MSP430 developmenttoolCD containingdocumentationand developmentsoftware
One eZ430-RF USB debugginginterface
Two eZ430-RF2500T wirelesstargetboards
One SEH-01 solarenergyharvesterboard
One AAA batterypack withexpansionboard(batteriesincluded)

1.8 KitContents,eZ430-Chronos-xxx

'433,'868,'915

One QUICK START GUIDE document
One eZ430-ChronosCD-ROM
One ez430-Chronosemulator
One screwdriver
Two sparescrews eZ430-Chronos-433: – One 433-MHz eZ430-Chronoswatch(batteryincluded) – One 433-MHz eZ430-Chronosaccesspoint eZ430-Chronos-868: – One 868-MHz eZ430-Chronoswatch(batteryincluded) – One 868-MHz eZ430-Chronosaccesspoint eZ430-Chronos-915: – One 915-MHz eZ430-Chronoswatch(batteryincluded) – One 915-MHz eZ430-Chronosaccesspoint

1.9 KitContents,MSP-FET430UIF

One READ ME FIRST document
One MSP430 CD-ROM
One MSP-FET430UIF interfacemodule
One USB cable
One 14-conductorcable 15SLAU278F –May 2009–RevisedDecember 2010 Get StartedNow! SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

KitContents,MSP-FET430xx www.ti.com

1.10 KitContents,MSP-FET430xx

'U14,'U092,'U24,'U28,'U28A,'U38,'U23x0,'U40,'U40A,'U48,'U48B,'U64,'U64A,'U64USB, 'U80, 'U80USB, 'U100,'U100A,'U100B,'U5x100,'U100USB

One READ ME FIRST document
One MSP430 CD-ROM
One MSP-FET430UIF USB interfacemodule.Thisistheunitthathas a USB B-connectoron one end ofthecase,and a 2×7-pinmale connectoron theotherend ofthecase.
One USB cable
One 32.768-kHzcrystalfromMicroCrystal(exceptMSP-FET430U24)
A 2×7-pinmale JTAG connectorisalsopresenton thePCB (seedifferentsetupforL092)
One 14-PinJTAG conductorcable
One smallbox containingtwo MSP430 devicesamples(See tableforSample Type)
One targetsocketmodule.To checkthedevicesused foreach boardand a summary oftheboard, see Table1-2.MSP-TS430xx belowisthetargetsocketmodule foreach MSP-FET430Uxx kit. MSP-FET430U14: One MSP-TS430PW14 targetsocketmodule. MSP-FET430U092: One MSP-TS430L092 targetsocketmodule withActiveCable. MSP-FET430U24: One MSP-TS430PW24 targetsocketmodule. MSP-FET430U28: One MSP-TS430PW28 targetsocketmodule. MSP-FET430U28A: One MSP-TS430PW28A targetsocketmodule. MSP-FET430U38: One MSP-TS430DA38 targetsocketmodule.. MSP-FET430U23x0: One MSP-TS430QFN23x0 (formername MSP-TS430QFN40) targetsocket module. MSP-FET430U40: One MSP-TS430RSB40 targetsocketmodule. MSP-FET430U48: One MSP-TS430DL48 targetsocketmodule. MSP-FET430U48B: One MSP-TS430RGZ48B targetsocketmodule. MSP-FET430U64: One MSP-TS430PM64 targetsocketmodule. MSP-FET430U64A: One MSP-TS430PM64A targetsocketmodule. MSP-FET430U64B: One MSP-TS430RGC64B targetsocketmodule. MSP-FET430U64USB: One MSP-TS430RGC64USB targetsocketmodule. MSP-FET430U80: One MSP-TS430PN80 targetsocketmodule. MSP-FET430U80A: One MSP-TS430PN80A targetsocketmodule. MSP-FET430U80USB: One MSP-TS430PN80USB targetsocketmodule. MSP-FET430U100: One MSP-TS430PZ100 targetsocketmodule. MSP-FET430U100A: One MSP-TS430PZ100A targetsocketmodule MSP-FET430U100B: One MSP-TS430PZ100B targetsocketmodule MSP-FET430U5x100: One MSP-TS430PZ5x100 targetsocketmodule. MSP-FET430U100USB: One MSP-TS430PZ100USB targetsocketmodule. Consultthedevicedatasheetsfordevicespecifications.Deviceerratacan be foundintherespective deviceproductfolderon theweb providedas a PDF document.Dependingon thedevice,erratamay also be foundinthedevicebug databaseatwww.ti.com/sc/cgi-bin/buglist.cgi. 16 Get StartedNow! SLAU278F –May 2009–RevisedDecember 2010 SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

www.ti.com KitContents,FET430Fx137RF900

1.11 KitContents,FET430Fx137RF900

One READ ME FIRST document
One legalnotice
One MSP430 CD-ROM
One MSP-FET430UIF interfacemodule
Two targetsocketmodule MSP-FET430F5137RF900: Two EM430F5137RF900 targetsocketmodules.ThisisthePCB on which issoldereda CC430F5137 deviceina 48-pinRGZ package.A 2×7-pinmale connectorisalsopresent on thePCB MSP-FET430F6137RF900: Two EM430F6137RF900 targetsocketmodules.ThisisthePCB on which issoldereda CC430F6137 deviceina 64-pinRGC package.A 2×7-pinmale connectorisalsopresent on thePCB
Two CC430EM batterypacks
FourAAA batteries
Two 868-/915-MHzantennas
Two 32.768-kHzcrystals
18 PCB 2x4-pinheaders
One USB cable
One 14-PinJTAG conductorcable

1.12 KitContents,MSP-TS430xx

'PW14, 'L092,'PW24, 'DW28, 'PW28, 'PW28A, 'DA38,'QFN32x0, 'RSB40, 'DL48,'RGZ48B, 'PM64, 'PM64A, 'RGC64B, 'RGC64USB, 'PN80,'PN80A, 'PN80USB, 'PZ100,'PZ100A,'PZ100B,'PZ5x100, 'PZ100USB

One READ ME FIRST document
One MSP430 CD-ROM
One 32.768-kHzcrystalfromMicroCrystal(exceptMSP-TS430PW24)
One targetsocketmodule
A 2×7-pinmale JTAG connectorisalsopresenton thePCB (seedifferentsetupforL092)
One smallbox containingtwo MSP430 devicesamples(See tableforSample Type) 17SLAU278F –May 2009–RevisedDecember 2010 Get StartedNow! SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

KitContents,MSP-TS430xx www.ti.com Table1-2.IndividualKitContents,MSP-TS430xx TargetSocket Socket Type Supported Devices IncludedDevices Headers /CommentModule 14-pinPW MSP430F20xx, 'G2x01, FourPCB 1×7-pinheaders(twoMSP-TS430PW14 2 x MSP430F2013IPW(TSSOP ZIF) 'G2x11, 'G2x21, 'G2x31 male and two female FourPCB 1×7-pinheaders(two male and two female).A "Micro-MaTch"10-pinfemale 14-pinPW connectorisalsopresenton theMSP-TS430L092 MSP-TS430L092 2 x MSP430L092IPW(TSSOP ZIF) PCB whichconnectsthekitwithan 'ActiveCable'PCB, this'Active Cable'PCB isconnectedby 14 Pin JTAG cablewiththeFET430UIF 24-pinPW FourPCB 1×12-pinheaders(twoMSP-TS430PW24 MSP430AFE2xx 2 x MSP430AFE253IPW(TSSOP ZIF) male and two female MSP430F11x1, 'F11x2, 28-pinDW 'F12x 'F12x2 'F21xx. FourPCB 1×12-pinheaders(twoMSP-TS430DW28 2 x MSP430F123IDW(SSOP ZIF) Supportsdevicesin20- male and two female and 28-pinDA packages 28-pinPW MSP430F11x1, 'F11x2, FourPCB 1×12-pinheaders(twoMSP-TS430PW28 2 x MSP430F2132IPW(TSSOP ZIF) 'F12x,'F12x2,'F21xx male and two female MSP430F20xx, 28-pinPW MSP430G2xxx in14-, 2 x FourPCB 1×12-pinheaders(twoMSP-TS430PW28A (TSSOP ZIF) 20-,and 28-pinPW MSP430G2452IPW28 male and two female packages 38-pinDA FourPCB 1×19-pinheaders(twoMSP-TS430DA38 MSP430F22xx 2 x MSP430F2274IDA(TSSOP ZIF) male and two female MSP- 40-pinRHA EightPCB 1×10-pinheaders(fourMSP430F23x0 2 x MSP430F2370IRHATS430QFN23x0 (QFN ZIF) male and fourfemale 40-pinRSB EightPCB 1×10-pinheaders(fourMSP-TS430RSB40 MSP430F51x1, 'F51x2 2 x MSP430F5172IRSB(QFN ZIF) male and fourfemale 40-pinRHA MSP430FR572x, 2 x EightPCB 1×10-pinheaders(fourMSP-TS430RHA40A (QFN ZIF) 'FR573x MSP430FR5739IRHA male and fourfemale 48-pinDL FourPCB 2×12-pinheaders(twoMSP-TS430DL48 MSP430F42x0 2 x MSP430F4270IDL(TSSOP ZIF) male and two female 48-pinRGZ EightPCB 1×12-pinheaders(fourMSP-TS430RGZ48B MSP430F534x 2 x MSP430F5342IRGZ(QFN ZIF) male and fourfemale MSP430F13x, 'F14x, TS Kit:2 x'F14x1,'F15x,'F16x(1), MSP430F2618IPM;64-pinPM 'F23x,'F24x,'F24xx, EightPCB 1×16-pinheaders(fourMSP-TS430PM64 FET Kit:2 x(QFP ZIF) 'F261x,'F41x,'F42x(A), male and fourfemaleMSP430F417IPM and 2'FE42x(A),'FE42x2, x MSP430F169IPM'FW42x 64-pinPM EightPCB 1×16-pinheaders(fourMSP-TS430PM64A MSP430F41x2 2 x MSP430F4152IPM(QFP ZIF) male and fourfemale MSP- 64-pinRGC EightPCB 1×16-pinheaders(fourMSP430F530x 2 x MSP430F5310IRGCTS430RGC64B (QFN ZIF) male and fourfemale 2 x MSP430F5510IRGCMSP- 64-pinRGC MSP430F550x, 'F551x, EightPCB 1×16-pinheaders(fourand/or2 xTS430RGC64USB (QFN ZIF) 'F552x male and fourfemaleMSP430F5528IRGC MSP430F241x, 'F261x,80-pinPN EightPCB 1×20-pinheaders(fourMSP-TS430PN80 'F43x,'F43x1,'FG43x, 2 x MSP430FG439IPN(QFP ZIF) male and fourfemale'F47x,'FG47x 80-pinPN EightPCB 1×20-pinheaders(fourMSP-TS430PN80A MSP430F532x 2 x MSP430F5329IPN(QFP ZIF) male and fourfemale MSP- 80-pinPN EightPCB 1×20-pinheaders(fourMSP430F552x, 'F551x 2 x MSP430F5529IPNTS430PN80USB (QFP ZIF) male and fourfemale 100-pinPZ MSP430F43x, 'F43x1, EightPCB 1×25-pinheaders(fourMSP-TS430PZ100 2 x MSP430FG4619IPZ(QFP ZIF) 'F44x,'FG461x, 'F47xx male and fourfemale 100-pinPZ EightPCB 1×25-pinheaders(fourMSP-TS430PZ100A MSP430F471xx 2 x MSP430F47197IPZ(QFP ZIF) male and fourfemale 18 Get StartedNow! SLAU278F –May 2009–RevisedDecember 2010 SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

www.ti.com KitContents,EM430Fx137RF900 Table1-2.IndividualKitContents,MSP-TS430xx (continued) TargetSocket Socket Type Supported Devices IncludedDevices Headers /CommentModule 100-pinPZ EightPCB 1×25-pinheaders(fourMSP-TS430PZ100B MSP430F67xx 2 x MSP430F6733IPZ(QFP ZIF) male and fourfemale MSP- 100-pinPZ MSP430F543x,MSP430 EightPCB 1×25-pinheaders(four2 x MSP430F5438IPZTS430PZ5x100 (QFP ZIF) BT5190IPZ male and fourfemale MSP- 100-pinPZ EightPCB 1×25-pinheaders(fourMSP430F663x, 'F563x 2 x MSP430F6638IPZTS430PZ100USB (QFP ZIF) male and fourfemale See thedevicedatasheetsfordevicespecifications.Deviceerratacan be foundintherespectivedevice productfolderon theweb providedas a PDF document.Dependingon thedevice,erratamay alsobe foundinthedevicebug databaseatwww.ti.com/sc/cgi-bin/buglist.cgi.

1.13 KitContents,EM430Fx137RF900

One READ ME FIRST document
One legalnotice
One MSP430 CD-ROM
Two targetsocketmodule MSP-EM430F5137RF900: Two EM430F5137RF900 targetsocketmodules.ThisisthePCB on which issoldereda CC430F5137 deviceina 48-pinRGZ package.A 2×7-pinmale connectorisalsopresent on thePCB MSP-EM430F6137RF900: Two EM430F6137RF900 targetsocketmodules.ThisisthePCB on which issoldereda CC430F6137 deviceina 64-pinRGC package.A 2×7-pinmale connectorisalsopresent on thePCB
Two CC430EM batterypacks
FourAAA batteries
Two 868-/915-MHzantennas
Two 32.768-kHzcrystals
18 PCB 2×4-pinheaders

1.14 Hardware Installation,MSP-FET430PIF

FollowthesestepstoinstallthehardwarefortheMSP-FET430PIF tools: 1. Use the25-conductorcabletoconnecttheFET interfacemodule totheparallelportofthePC. The necessarydriverforaccessingthePC parallelportisinstalledautomaticallyduringCCE/CCS orIAR Embedded Workbench installation.Note thata restartisrequiredaftertheCCE/CCS orIAR Embedded Workbench installationforthedrivertobecome active. 2. Use the14-conductorcabletoconnecttheparallel-portdebug interfacemodule toa targetboard,such as an MSP-TS430xxx targetsocketmodule.Module schematicsand PCBs areshown inAppendixB. 19SLAU278F –May 2009–RevisedDecember 2010 Get StartedNow! SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Hardware Installation,MSP-FET430UIF www.ti.com

1.15 Hardware Installation,MSP-FET430UIF

FollowthesestepstoinstallthehardwarefortheMSP-FET430UIF tool: 1. Use theUSB cabletoconnecttheUSB-FET interfacemodule toa USB porton thePC. The USB FET shouldbe recognized,as theUSB devicedrivershouldhave been installedwiththeIDE (Code Composer Essentials/StudioorIAR Embedded Workbench)..Iftheinstallwizardstarts,followthe promptsand pointthewizardtothedriverfiles. The defaultlocationforCCE isC:\\ProgramFiles\\TexasInstruments\\MSP430_USB_DRIVERS_v3\\. The defaultlocationforCCS isC:\\ProgramFiles\\TexasInstruments\\ccs4\\emulation\\drivers\\msp430\\. The defaultlocationforIAR Embedded Workbench is<InstallationRoot>\\Embedded Workbench x.x\\ 430\\bin\\WinXP. Detaileddriverinstallationinstructionscan be foundinAppendixC . 2. Afterconnectingtoa PC, theUSB FET performsa self-testduringwhichtheredLED flashesfor approximatelytwo seconds.Iftheself-testpassessuccessfully,thegreenLED stayson. 3. Use the14-conductorcabletoconnecttheUSB-FET interfacemodule toa targetboard,such as an MSP-TS430xxx targetsocketmodule. 4. EnsurethattheMSP430 deviceissecurelyseatedinthesocket,and thatitspin1 (indicatedwitha circularindentationon thetopsurface)alignswiththe"1"mark on thePCB. 5. Compared totheparallel-portdebug interface,theUSB FET has additionalfeaturesincludingJTAG securityfuseblowand adjustabletargetVCC (1.8V to3.6V).Supplythemodule withup to100 mA.

1.16 Hardware Installation,eZ430-F2013,eZ430-RF2500,eZ430-Chronos

FollowthesestepstoinstallthehardwarefortheeZ430-F2013 and eZ430-RF2500 tools: 1. ConnecttheeZ430-F2013,eZ430-RF2500 and eZ430-Chronostoa USB portofthePC. 2. The USB FET shouldbe recognizedby thePC. The USB devicedrivershouldhave been installedwith theIDE (Code Composer StudioorIAR Embedded Workbench -Code Composer Essentialsonly supportseZ430-F2013 and eZ430-RF2500).Iftheinstallwizardstarts,followthepromptsand point thewizardtothedriverfiles. The defaultlocationforCCE isC:\\ProgramFiles\\TexasInstruments\\MSP430_USB_DRIVERS_v3\\. The defaultlocationforCCS isC:\\ProgramFiles\\TexasInstruments\\ccs4\\emulation\\drivers\\msp430\\. The defaultlocationforIAR Embedded Workbench is<InstallationRoot>\\Embedded Workbench x.x\\ 430\\bin\\WinXP. Detaileddriverinstallationinstructionscan be foundinAppendixC . MSP-FET430Uxx – 'U14,'U092,,U24,'U28,'U28A,'U38,'U23x0,'U40,'U40A,'U48,'U48B,'U64, 'U64A,'U64USB, 'U80,'U80USB, 'U100,'U100A,'U100B,'U5x100,'U100USB TS430xxx – 'PW14, 'L092,'PW24, 'DW28, 'PW28, 'PW28A, 'DA38,'QFN32x0, 'RSB40, 'DL48, 'RGZ48B, 'PM64,'PM64A, 'RGC64B, 'RGC64USB, 'PN80,'PN80A, 'PN80USB, 'PZ100,'PZ100A, 'PZ100B,'PZ5x100,'PZ100USB FollowthesestepstoinstallthehardwarefortheMSP-FET430Uxx and MSP-TS430xxx tools: 1. ConnecttheMSP-FET430PIF orMSP-FET430UIF debug interfacetotheappropriateportofthePC. Use the14-conductorcabletoconnecttheFET interfacemodule tothesuppliedtargetsocketmodule. 2. EnsurethattheMSP430 deviceissecurelyseatedinthesocketand thatitspin1 (indicatedwitha circularindentationon thetopsurface)alignswiththe"1"mark on thePCB. 3. Ensurethatthetwo jumpers(LED and VCC) nearthe2×7-pinmale connectorareinplace.Illustrations ofthetargetsocketmodules and theirpartsarefoundinAppendixB. NOTE: Regarding'U38,see FAQ Hardware #2 inAppendixA. 20 Get StartedNow! SLAU278F –May 2009–RevisedDecember 2010 SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

www.ti.com ImportantMSP430 Documents on theCD-ROM and Web

1.18 ImportantMSP430 Documents on theCD-ROM and Web

The primarysourcesofMSP430 informationarethedevice-specificdatasheetand user'sguide.The most up-to-dateversionsofthesedocuments thatareavailableatthetimeofproductionareprovidedon the CD-ROM includedwiththistool.The MSP430 web site(www.ti.com/msp430)containsthemost recent versionofthesedocuments. PDF documents describingtheCCS tools(CCS IDE,theassembler,theC compiler,thelinker,and the librarian)areinthemsp430\\documentationfolder.A Code Composer StudiospecificWikipage (FAQ) is available,and theTexas InstrumentsE2E Community supportforumsfortheMSP430 and Code Composer Studiov4 provideadditionalhelpbesidestheproducthelpand Welcome page. PDF documents describingtheIAR tools(Workbench/C-SPY,theassembler,theC compiler,thelinker, and thelibrarian)areinthecommon\\doc and 430\\docfolders.Supplementstothedocuments (i.e.,the latestinformation)areavailableinHTML formatinthesame directories.430\\doc\\readme_start.htm providesa convenientstartingpointfornavigatingtheIAR documentation. 21SLAU278F –May 2009–RevisedDecember 2010 Get StartedNow! SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

SLAU278F –May 2009–RevisedDecember 2010 Design ConsiderationsforIn-CircuitProgramming Thischapterpresentssignalrequirementsforin-circuitprogrammingoftheMSP430. 23SLAU278F –May 2009–RevisedDecember 2010 DesignConsiderationsforIn-CircuitProgramming SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

SignalConnectionsforIn-SystemProgramming and Debugging www.ti.com

2.1 SignalConnections forIn-SystemProgramming and Debugging

MSP-FET430PIF, MSP-FET430UIF, MSP-GANG430, MSP-PRGS430 Withtheproperconnections,thedebuggerand an FET hardwareJTAG interface(suchas the MSP-FET430PIF and MSP-FET430UIF) can be used toprogramand debug code on thetargetboard.In addition,theconnectionsalsosupporttheMSP-GANG430 orMSP-PRGS430 productionprogrammers, thusprovidingan easy way toprogramprototypeboards,ifdesired. Figure2-1shows theconnectionsbetween the14-pinFET interfacemodule connectorand thetarget devicerequiredtosupportin-systemprogrammingand debuggingfor4-wireJTAG communication. Figure2-2shows theconnectionsfor2-wireJTAG mode (Spy-Bi-Wire).While4-wireJTAG mode is supportedon allMSP430 devices,2-wireJTAG mode isavailableon selecteddevicesonly.See theCCS User'sGuide forMSP430 (SLAU157 )orIAR forMSP430 User'sGuide (SLAU138 )forinformationon whichinterfacemethod can be used on whichdevice. The connectionsfortheFET interfacemodule and theMSP-GANG430 orMSP-PRGS430 areidentical. BoththeFET interfacemodule and MSP-GANG430 can supplyVCC tothetargetboard(viapin2).In addition,theFET interfacemodule and MSP-GANG430 have a VCC -sensefeaturethat,ifused,requires an alternateconnection(pin4 insteadofpin2).The VCC -sensefeaturesensesthelocalVCC presenton the targetboard(i.e.,a batteryorotherlocalpower supply)and adjuststheoutputsignalsaccordingly.Ifthe targetboardistobe powered by a localVCC ,thentheconnectiontopin4 on theJTAG shouldbe made, and nottheconnectiontopin2.ThisutilizestheVCC -sensefeatureand preventsany contentionthatmight occurifthelocalon-boardVCC were connectedtotheVCC suppliedfromtheFET interfacemodule orthe MSP-GANG430. IftheVCC -sensefeatureisnotnecessary(i.e.,thetargetboardistobe powered fromthe FET interfacemodule ortheGANG430) theVCC connectionismade topin2 on theJTAG headerand no connectionismade topin4.Figure2-1and Figure2-2show a jumperblockthatsupportsbothscenarios ofsupplyingVCC tothetargetboard.Ifthisflexibilityisnotrequired,thedesiredVCC connectionsmay be hard-wiredeliminatingthejumperblock.Pins2 and 4 must notbe connectedsimultaneously. Note thatin4-wireJTAG communicationmode (seeFigure2-1),theconnectionofthetargetRST signal totheJTAG connectorisoptionalwhen usingdevicesthatsupportonly4-wireJTAG communication mode. However,when usingdevicesthatsupport2-wireJTAG communicationmode in4-wireJTAG mode, theRST connectionmust be made. The MSP430 developmenttoolsand deviceprogrammers performa targetresetby issuinga JTAG command togaincontroloverthedevice.However,ifthisis unsuccessful,theRST signaloftheJTAG connectormay be used by thedevelopmenttoolordevice programmer as an additionalway toasserta devicereset.

24 DesignConsiderationsforIn-CircuitProgramming SLAU278F –May 2009–RevisedDecember 2010

J1 (see Note A) J2 (see Note A) VCC 47 k (see Note B) /c87 10 µF 0.1 µF V /AV /DV CCCC CC RST/NMI TDO/TDI TDI/VPP TMS TCK TEST/VPP (see Note C) V /AV /DVSS SS SS MSP430Fxxx 10 nF/2.2 nF (see Notes B and E) RST (see Note D) www.ti.com SignalConnectionsforIn-SystemProgramming and Debugging A Make eitherconnectionJ1 incase a localtargetpower supplyisused orconnectionJ2 topower targetfromthe debug/programmingadapter. B The RST/NMI pinR1/C1 configurationisdevicefamilydependent.See therespectiveMSP430 familyuser'sguidefor therecommended configuration. C The TEST pinisavailableonlyon MSP430 familymembers withmultiplexedJTAG pins.See thedevice-specificdata sheettodetermineifthispinisavailable. D The connectiontotheJTAG connectorRST pinisoptionalwhen using4-wireJTAG communicationmode capable-onlydevicesand notrequiredfordeviceprogrammingordebugging.However,thisconnectionisrequired when using2-wireJTAG communicationmode capabledevicesin4-wireJTAG mode. E When using2-wireJTAG communicationcapabledevicesin4-wireJTAG mode, theupperlimitforC1 shouldnot exceed 2.2nF.ThisappliestobothTIFET interfacemodules (LPT/USB FET). Figure2-1.SignalConnections for4-WireJTAG Communication 25SLAU278F –May 2009–RevisedDecember 2010 DesignConsiderationsforIn-CircuitProgramming SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

J2 (see Note A) VCC 47 k (see Note B) /c87 10 µF 0.1 µF V /AV /DV CCCC CC RST/NMI/SBWTDIO MSP430Fxxx 2.2 nF (see Note B) TEST/SBWTCK V /AV /DVSS SS SS J1 (see Note A) JTAG TDO/TDI1 330 (see Note C) /c87 SignalConnectionsforIn-SystemProgramming and Debugging www.ti.com A Make eitherconnectionJ1 incase a localtargetpower supplyisused orconnectionJ2 topower targetfromthe debug/programmingadapter. B The deviceRST/NMI/SBWTDIO pinisused in2-wiremode forbidirectionalcommunicationwiththedeviceduring JTAG accessand thatany capacitanceattachedtothissignalmay affecttheabilitytoestablisha connectionwiththe device.The upperlimitforC1 is2.2nF when usingcurrentTIFET interfacemodules (USB FET). C R2 protectstheJTAG debug interfaceTCK signalfromtheJTAG securityfuseblowvoltagethatissuppliedby the TEST/VPP pinduringthefuseblowprocess.Iffuseblowfunctionalityisnotneeded,R2 isnotrequired(populate 0 ?),and do notconnectTEST/VPP toTEST/SBWTCK. Figure2-2.SignalConnections for2-WireJTAG Communication (Spy-Bi-Wire)

26 DesignConsiderationsforIn-CircuitProgramming SLAU278F –May 2009–RevisedDecember 2010

www.ti.com ExternalPower

2.2 ExternalPower

The PC parallelportcan sourcea limitedamount ofcurrent.Because oftheultra-low-powerrequirement oftheMSP430, a standaloneFET does notexceed theavailablecurrent.However,ifadditionalcircuitryis added tothetool,thiscurrentlimitcouldbe exceeded.Inthiscase,externalpower can be suppliedtothe toolviaconnectionsprovidedon thetargetsocketmodules.See theschematicsand pictorialsofthe targetsocketmodules inAppendixB tolocatetheexternalpower connectors. The MSP-FET430UIF can supplytargetswithup to100 mA throughpin2 ofthe14-pinconnector.VCC for thetargetcan be selectedbetween 1.8V and 5 V instepsof0.1V.Alternatively,thetargetcan be suppliedexternally.Inthiscase,theexternalvoltageshouldbe connectedtopin4 ofthe14-pinconnector. The MSP-FET430UIF thenadjuststheleveloftheJTAG signalstoexternalVCC automatically.Onlypin2 (MSP-FET430UIF suppliestarget)orpin4 (targetisexternallysupplied)must be connected;notbothat thesame time. When a targetsocketmodule ispowered froman externalsupply,theexternalsupplypowers thedevice on thetargetsocketmodule and any usercircuitryconnectedtothetargetsocketmodule,and theFET interfacemodule continuestobe powered fromthePC viatheparallelport.Iftheexternallysupplied voltagediffersfromthatoftheFET interfacemodule,thetargetsocketmodule must be modifiedso that theexternallysuppliedvoltageisroutedtotheFET interfacemodule (sothatitmay adjustitsoutput voltagelevelsaccordingly).See thetargetsocketmodule schematicsinAppendixB.

2.3 BootstrapLoader (BSL)

The JTAG pinsprovideaccesstotheflashmemory oftheMSP430Fxxx devices.On some devices,these pinsaresharedwiththedeviceportpins,and thissharingofpinscan complicatea design(orsharingmay notbe possible).As an alternativetousingtheJTAG pins,most MSP430Fxxx devicescontaina program (a"bootstraploader")thatpermitstheflashmemory tobe erasedand programmed usinga reducedsetof signals.The MSP430 Programming ViatheBootstrapLoaderUser'sGuide (SLAU319 )describesthis interface.TIdoes notproducea BSL tool.However,customerscan easilydeveloptheirown BSL tools usingtheinformationintheapplicationreports,orBSL toolscan be purchasedfromthirdparties.See the MSP430 web sitefortheapplicationreportsand a listofMSP430 third-partytooldevelopers. TIsuggeststhatMSP430Fxxx customersdesigntheircircuitswiththeBSL inmind (i.e.,TIsuggests providingaccesstothesesignalsvia,forexample,a header). See FAQ Hardware #11 fora second alternativetosharingtheJTAG and portpins. 27SLAU278F –May 2009–RevisedDecember 2010 DesignConsiderationsforIn-CircuitProgramming SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

28 DesignConsiderationsforIn-CircuitProgramming SLAU278F –May 2009–RevisedDecember 2010

SLAU278F –May 2009–RevisedDecember 2010 FrequentlyAsked Questions and Known Issues Thisappendixpresentssolutionstofrequentlyasked questionsregardingtheMSP-FET430 hardware. 29SLAU278F –May 2009–RevisedDecember 2010 FrequentlyAsked Questionsand Known Issues SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Hardware FAQs www.ti.com A.1 Hardware FAQs 1. The stateofthedevice(CPU registers,RAM memory, etc.)isundefinedfollowinga reset. Exceptionstotheabove statementarethatthePC isloadedwiththeword at0xFFFE (i.e.,thereset vector),thestatusregisteriscleared,and theperipheralregisters(SFRs)areinitializedas documented inthedevicefamilyuser's guides.The CCE/CCS debuggerand C-SPY resetthedeviceafter programmingit. 2. MSP430F22xx TargetSocket Module (MSP-TS430DA38) – ImportantInformation Due tothelargecapacitivecouplingintroducedby thedevicesocketbetween theadjacentsignals XIN/P2.6(socketpin6)and RST/SBWTDIO (socketpin7),in-systemdebuggingcan disturbthe LFXT1 low-frequencycrystaloscillatoroperation(ACLK).ThisbehaviorappliesonlytotheSpy-Bi-Wire (2-wire)JTAG configurationand onlytotheperiodwhilea debug sessionisactive. Workarounds:

Use the4-wireJTAG mode debug configurationinsteadoftheSpy-Bi-Wire(2-wire)JTAG configuration.Thiscan be achievedby placingjumpersJP4 throughJP9 accordingly.
Use thedebuggeroption"Run Free"thatcan be selectedfromtheAdvanced Run drop-down menu (attopofDebug View).ThispreventsthedebuggerfromaccessingtheMSP430 whilethe applicationisrunning.Note that,inthismode, a manual haltisrequiredtosee ifa breakpointwas hit.See theIDE documentationformore informationon thisfeature.
Use an externalclocksourcetodriveXIN directly. 3. With currentinterfacehardware and software,thereisa weakness when adaptingtargetboards thatarepowered externally.Thisleadstoan accidentalfusecheckintheMSP430. Thisisvalidfor PIF and UIF butismainlyseen on UIF.A solutionisbeingdeveloped. Workarounds:
ConnectRST/NMI pintoJTAG header(pin11),LPT/USB toolsareabletopulltheRST line,which alsoresetsthedeviceinternalfuselogic.
Use thedebuggeroption"ReleaseJTAG On Go "thatcan be selectedfromtheIDE drop-down menu. ThispreventsthedebuggerfromaccessingtheMSP430 whiletheapplicationisrunning. Note thatinthismode, a manual haltisrequiredtosee ifa breakpointwas hit.See theIDE documentationformore informationon thisfeature.
Use an externalclocksourcetodriveXIN directly. 4. The 14-conductorcableconnectingtheFET interfacemodule and thetargetsocketmodule must not exceed 8 inches(20centimeters)inlength. 5. The signalassignmenton the14-conductorcableisidenticalfortheparallelportinterfaceand the USB FET . 6. To utilizetheon-chipADC voltagereferences,C6 (10?F,6.3V,lowleakage)must be installedon thetargetsocketmodule. 7. To utilizethecharge pump on thedeviceswithLCD+ Module, C4 (10?F,lowleakage)must be installedon thetargetsocketmodule. 8. Crystals/resonatorsQ1 and Q2 (ifapplicable)arenot providedon thetargetsocketmodule. For MSP430 devicesthatcontainuser-selectableloadingcapacitors,theeffectivecapacitanceisthe selectedcapacitanceplus3 pF (padcapacitance)dividedby two. 9. Crystals/resonatorshave no effectupon theoperationofthetooland theCCE/CCS debugger or C-SPY (asany requiredclocking/timingisderivedfromtheinternalDCO/FLL). 10. On 20-pinand 28-pindeviceswithmultiplexedport/JTAG pins(P1.4toP1.7),touse thesepinin theirportcapacity: ForCCE/CCS: "Run Free"(inRun pull-downmenu attopofDebug View)must be selected. ForC-SPY: "ReleaseJTAG On Go "must be selected. 11. As an alternativetosharingtheJTAG and portpins(on20 and 28 pindevices),considerusing an MSP430 devicethatisa "superset" ofthesmallerdevice.A verypowerfulfeatureofthe MSP430 isthatthefamilymembers arecode and architecturallycompatible,so code developedon one device(forexample,one withoutsharedJTAG and portpins)portseffortlesslytoanother (assumingan equivalentsetofperipherals).

30 FrequentlyAsked Questionsand Known Issues SLAU278F –May 2009–RevisedDecember 2010

www.ti.com Hardware FAQs 12. Informationmemory may not be blank(erasedto0xFF)when thedeviceisdeliveredfromTI. Customersshoulderasetheinformationmemory beforeitsfirstuse.Main memory ofpackaged devicesisblankwhen thedeviceisdeliveredfromTI. 13. The devicecurrentincreasesby approximately10 ?A when a deviceinlow-power mode is stopped [usingHalt(CCE/CCS) orEsc (C-SPY)]and then thelow-power mode isrestored[using Run (CCE/CCS) orGo (C-SPY)].Thisbehaviorappearstohappen on alldevicesexceptthe MSP430F12x. 14.The followingZIFsocketsareused intheFET toolsand targetsocketmodules:

14-pindevice(PW package):EnplasOTS-14-065-01
14-pinpackage for'L092 (PW package):YamaichiIC189-0142-146
24-pinpackage (PW package):EnplasOTS-24(28)-0.65-02
28-pindevice(DW package):Wells-CTI652 D028
28-pindevice(PW package):EnplasOTS-28-0.65-01
38-pindevice(DA package):YamaichiIC189-0382-037
40-pindevice(RHA package):EnplasQFN-40B-0.5-01
40-pindevice(RSB package):EnplasQFN-40B-0.4
48-pindevice(RGZ package):YamaichiQFN11T048-008 A101121-001
48-pindevice(DL package):YamaichiIC51-0482-1163
64-pindevice(PM package):YamaichiIC51-0644-807
64-pindevice(RGC package):YamaichiQFN11T064-006
80-pindevice(PN package):YamaichiIC201-0804-014
100-pindevice(PZ package):YamaichiIC201-1004-008 Enplas:www.enplas.com Wells-CTI:www.wellscti.com Yamaichi:www.yamaichi.us 31SLAU278F –May 2009–RevisedDecember 2010 FrequentlyAsked Questionsand Known Issues SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Known Issues www.ti.com A.2 Known Issues MSP-FET430PIF Some PCs do not supply 5 V through theparallelport Problem Description Deviceidentificationproblemswithmodern PCs, because theparallelportoftendoes not deliver5 V as was common withearlierhardware. 1. When connectedtoa laptop,thetestsignalisclamped to2.5V. 2. When theexternalVCC becomes lessthan3 V,up to10 mA isflowingintheadapter viapin4 (sense). Solution Measure thevoltageleveloftheparallelport.Ifitistoolow,provideexternal5 V tothe VCC pads oftheinterface.The jumperon a thetargetsocketmust be switchedto externalpower. MSP-FET430UIF CurrentdetectionalgorithmoftheUIF firmware Problem Description Ifhighcurrentisdetected,theICC Monitoralgorithmstaysina loopoffrequently switchingon and offthetargetpower supply.Thispower switchingputssome MSP430 devicessuch as theMSP430F5438 ina statethatrequiresa power cycletoreturnthe devicetoJTAG control. A sideissueisthatiftheUIF firmwarehas enteredthisswitchon /switchoffloop,itis notpossibletoturnoffthepower supplytothetargetby callingMSP430_VCC(0). A power cycleisrequiredtoremove thedevicefromthisstate. Solution IAR KickStartand Code Composer Essentialsthathave theMSP430.dllversion 2.04.00.003and higherdo notshow thisproblem.Update thesoftwaredevelopmenttool tothisversionorhighertoupdatetheMSP-FET430UIF firmware.

32 FrequentlyAsked Questionsand Known Issues SLAU278F –May 2009–RevisedDecember 2010

SLAU278F –May 2009–RevisedDecember 2010 Hardware Thisappendixcontainsinformationrelatingto the FET hardware,includingschematics,PCB pictorials, and billsofmaterials.Allothertools,such as theeZ430 series,aredescribedinseparateproduct-specific user'sguides. 33SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PW14 www.ti.com B.1 MSP-TS430PW14 FigureB-1.MSP-TS430PW14 TargetSocket Module, Schematic

34 Hardware SLAU278F –May 2009–RevisedDecember 2010

Jumper J5 to 'ext' LED connected to P1.0 Jumpers J7 to J12 Close 1-2 to debug in Spy-Bi-Wire Mode. Close 2-3 to debug in 4-wire JTAG mode. www.ti.com MSP-TS430PW14 FigureB-2.MSP-TS430PW14 TargetSocket Module, PCB 35SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PW14 www.ti.com TableB-1.MSP-TS430PW14 BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard

1 C1, C2 0 12pF,SMD0805 DNP

2 C7 1 10uF/10V,TantalSizeB 511-1463-2-ND

3 C3, C5 1 100nF,SMD0805 478-3351-2-ND DNP: C3

4 C8 0 2.2nF,SMD0805 DNP

5 D1 1 greenLED, SMD0603 475-1056-2-ND

DNP: Headers and receptacles"SAM1029-07-6 J1,J2 0 7-pinheader,TH enclosedwithkit.Keep viasfreeofNDSAM1213-07-ND " solder:Header:Receptacle J3,J5,J7, Placejumperson headersJ5,J7,J8,7 J8,J9,J10, 8 3-pinheader,male,TH SAM1035-03-ND J9,J10,J11,J12;Pos 1-2J11,J12

8 J4,J6 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

9 9 Jumper 15-38-1024-ND Placeon:J5,J7-J12;Pos 1-2 14-pinconnector,male,10 JTAG 1 HRP14H-NDTH MicroCrystalMS1V-T1K 12 Q1 0 Crystal 32.768kHz,C(Load)= DNP: keep viasfreeofsolder 12.5pF

13 R2, R3 2 330 Ω,SMD0805 541-330ATR-ND

15 R5 1 47k Ω,SMD0805 541-47000ATR-ND

16 U1 1 Socket:OTS-14-0.65-01 Manuf.:Enplas

17 PCB 1 56 x 53 mm 2 layers

Adhesive about6mm width,2mm e.g.,3M Bumpons Part18 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

19 MSP430 2 MSP430F2013IPW DNP: enclosedwithkit,suppliedby TI

36 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430L092 B.2 MSP-TS430L092 FigureB-3.MSP-TS430L092 TargetSocket Module, Schematic 37SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430L092 www.ti.com SettingsoftheMSP-TS430L092 TargetSocket FigureB-4 shows thePCB layoutoftheMSP-TS430L092 targetsocket.The followingpinningis recommended:

JP1 iswriteenablefortheEPROM. Ifthisisnotset,theEPROM can onlybe read.
JP2 and JP3 connectdevicesupplywithboostconverter.They can be opened tomeasure device currentconsumption.Fordefaultoperation,theyshouldbe closed. FigureB-4.MSP-TS430L092 TargetSocket Module, PCB

38 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430L092 TableB-2.MSP-TS430L092 BillofMaterials No. PerPos. Ref Des No. Description DigiKeyPartNo. CommentBoard

1 C1, C2 2 330nF,SMD0603

2 C5 1 100n,SMD0603

3 C6 1 10u,SMD0805

4 C10 1 100n,SMD0603

5 EEPROM1 1 M95512 SO08 (SO8) ST MicroM95160R Digikey:497-8688-1-ND

DNP: headersand receptaclesenclosedwithkit. Keep viasfreeofsolder.7 J1,J2 2 7-pinheader,TH SAM1213-07-ND :Header SAM1035-07-ND :Receptacle

8 J3 1 3-pinheader,male,TH SAM1035-03-ND

DNP; Keep viasfreeof9 J4,J5 2 FE4L, FE4H 4 pol.Stiftreihe solder. Reichelt:

11 J13 1 MICRO_STECKV_10 MicroMaTch-Connector:MM

12 JP1,JP2,JP3 3 2-pinheader,male,TH SAM1035-02-ND placejumperon header

15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell:151-5557

16 LED1, LED4 2 LEDCHIPLED_0603 Farnell:1686065

17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC

18 R0, R6, R7 3 2K7,SMD0603

19 R1 1 1k,SMD0603

20 R2 1 47k,SMD0603

R4,R5,R8,21 6 10k,SMD0603R10, RC, RD 22 RA 1 3.9k,SMD0603 23 RB 1 6.8k,SMD0603 14 PinSocket-24 U1 1 Manuf.YamaichiIC189-0142-146 DNP: enclosedwithkit.Is22 MSP430 2 MSP430L092PWR suppliedby TI 39SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430L092 ActiveCable www.ti.com B.3 MSP-TS430L092 ActiveCable FigureB-5.MSP-TS430L092 ActiveCable TargetSocket Module, Schematic

40 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430L092 ActiveCable FigureB-6 shows thePCB layoutfortheActiveCable.The followingpinningispossible:

JP1 has two jumpers(Jumper1 and Jumper 2)thatcan be setas shown inTableB-3. TableB-3.MSP-TS430L092 JP1 Settings Jumper 1 Jumper 2 Description Off Off The activecablehas no power and does notfunction. The activecablereceivespower fromtargetsocket.Forthisoption,theOff On targetsocketmust have itsown power supply. On Off The activecablereceivespower fromtheJTAG connector. The JTAG connectorpowers theactivecableand thetargetsocket.For On On thisoption,thetargetsocketmust nothave itsown power source,as this wouldcause a notdefinedstate.
JP2 isforreset.ForthestandardMSP-TS430L092, thisjumpermust be set.Itsetstheresetpinto highand can alsocontrolit.Withoutthisjumperon theMSP-TS430L092, resetissettozero. FigureB-6.MSP-TS430L092 ActiveCable TargetSocket Module, PCB 41SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430L092 ActiveCable www.ti.com TableB-4.MSP-TS430L092 ActiveCable BillofMaterials No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard C1, C3, C5,1 4 100nF,SMD0603C6

2 C2, C4 2 1uF,SMD0805

3 R1, R10 2 10K,SMD0603

4 R2 1 4K7,SMD0603

R5, R6, R7,5 4 100,SMD0603R9

6 R8 1 680k,SMD0603

7 R11, R15 2 1K,SMD0603

8 R12 0 SMD0603 DNP

9 R13 0 SMD0603 DNP

10 R14 1 0,SMD0603

11 IC1 1 SN74AUC1G04DBVR Manu: TI

12 IC2,IC3,IC4 3 SN74AUC2G125DCTR Manu: TI

Reichelt:

13 J2 1 MICRO_STECKV_10 MicroMaTch-Connector:MM

Putjumperon Position1 and14 JP1 1 2x2 Header JP2Q 2.Do notmix direction.

15 JP2 1 2-pinheader,male,TH SAM1035-02-ND placejumperon header

16 JTAG 1 14-pinconnector,male,TH HRP14H-ND

BC817-25LT1SMD, Digi-Key:17 Q1 1 SOT23-BEC BC817-25LT1GOSCT-ND

18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI

42 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PW24 B.4 MSP-TS430PW24 FigureB-7.MSP-TS430PW24 TargetSocket Module, Schematic 43SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Orient Pin 1 of MSP430 device D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode MSP-TS430PW24 www.ti.com FigureB-8.MSP-TS430PW24 TargetSocket Module, PCB

44 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PW24 TableB-5.MSP-TS430PW24 BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard 2 C5 1 2.2nF,SMD0805

3 C3, C7 2 10uF/10V,SMD0805

4 C4, C6, C8 3 100nF,SMD0805 478-3351-2-ND

5 D1 1 greenLED, SMD0805 P516TR-ND

DNP: Headers and receptacles"SAM1029-07-6 J1,J2 0 12-pinheader,TH enclosedwithkit.Keep viasfreeofNDSAM1213-07-ND " solder.(Header& Receptacle) J5,JP1, JP4,JP5, Placejumperon 1-2ofJP4-JP97 8 3-pinheader,male,TH SAM1035-03-NDJP6,JP7, Placeon 1-2on JP1 JP8,JP9

8 JP2,JP3 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

9 9 Jumper 15-38-1024-ND see Pos 7 an 8 14-pinconnector,male,10 JTAG 1 HRP14H-NDTH

11 Q1 0 Crystal DNP: keep viasfreeofsolder

12 R1, R7 2 330 Ω,SMD0805 541-330ATR-ND

R5, R6,13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6R8, R9,

14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND

Socket:OTS15 U1 1 Manuf.:Enplas24(28)-065-02-00 16 PCB 1 68.5x 61 mm 2 layers Adhesive about6mm width,2mm e.g.,3M Bumpons Part17 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

18 MSP430 2 MSP430AFE2xx DNP: enclosedwithkit,suppliedby TI

MSP-TS430DW28 www.ti.com B.5 MSP-TS430DW28 FigureB-9.MSP-TS430DW28 TargetSocket Module, Schematic

46 Hardware SLAU278F –May 2009–RevisedDecember 2010

LED connected to P1.0 www.ti.com MSP-TS430DW28 FigureB-10.MSP-TS430DW28 TargetSocket Module, PCB 47SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430DW28 www.ti.com TableB-6.MSP-TS430DW28 BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard DNP: C1, C2, Cover holeswhile1 C1, C2 0 12pF,SMD0805 soldering

2 C5 1 100nF,SMD0805

3 C7 1 10uF/10V TantalElkoB

4 C8 1 10nF SMD0805

5 D1 1 LED3 T1 3mm yellow RS: 228-4991

6 Q1 0 QUARZ, Crystal 32.768kHz,C(Load)= DNP: Cover holeswhilesoldering 12.5pF DNP: Headers and receptacles 7 J1,J2 2 14-pinheader,TH male enclosedwithkit.Keep viasfreeof solder.:Header:Receptacle DNP: Headers and receptacles14-pinheader,TH7.1 2 enclosedwithkit.Keep viasfreeoffemale solder.:Header:Receptacle

8 J3 1 3-PinConnector,male

9 J4,J5 2 2-PinConnector,male Withjumper

10 BOOTST 0 ML10, 10-PinConn.,m RS: 482-115 DNP, Cover holeswhilesoldering 11 JTAG 1 ML14, 14-PinConn.,m RS: 482-121 R1, R2, R6, R7,12 4 0R, SMD0805 DNP: R1, R2, R9, R10R8,R9, R10, R11

13 R3 1 560R, SMD0805

14 R5 1 47K,SMD0805

Yamaichi:15 U1 1 SOP28DW socket IC189-0282-042

16 U2 0 TSSOP DNP

48 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PW28 B.6 MSP-TS430PW28 FigureB-11.MSP-TS430PW28 TargetSocket Module, Schematic 49SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

LED D1 connected to P5.1 Jumper JP1 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of Device MSP-TS430PW28 www.ti.com FigureB-12.MSP-TS430PW28 TargetSocket Module, PCB

50 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PW28 TableB-7.MSP-TS430PW28 BillofMaterials(1) No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: C1, C2 ,Cover holes1 C1, C2 0 12pF,SMD0805 whilesoldering

2 C3 1 10uF/10V TantalElkoB

3 C4 1 100nF,SMD0805

4 C5 0 2.2nF,SMD0805 DNP

5 D1 1 LED greenSMD0603

MicroCrystalMS1V-T1K DNP: Cover holesand 6 Q1 0 QUARZ, Crystal 32.768kHz,C(Load)= neighboringholeswhile 12.5pF soldering DNP: Headers and receptaclesenclosedwith 7 J1,J2 2 14-pinheader,TH male kit.Keepviasfreeof solder.:Header: Receptacle DNP: headersand receptaclesenclosedwith 7.1 2 14-pinheader,TH female kit.Keepviasfreeof solder.:Header: Receptacle

8 J5,IP1 1 3-PinConnector,male

JP1,JP4, JP5,JP6,8a 7 3-PinConnector,male Jumper on Pos 1-2JP7,JP8, JP9

9 JP2,JP3 2 2-PinConnector,male withJumper

DNP: Cover holeswhile10 BOOTST 0 ML10, 10-PinConn. ,m RS: 482-115 soldering 11 JTAG 1 ML14, 14-PinConn. ,m RS: 482-121

12 R1, R7 2 330R, SMD0805

R2, R3, R5,12 0 0R, SMD0805 DNPR6

14 R4 1 47K,SMD0805

15 U1 1 SOP28PW socket Enplas:OTS-28-0.65-01 (1) PCB 66 x 79 mm, two layers;Rubber standoff,fourpieces 51SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PW28A www.ti.com B.7 MSP-TS430PW28A FigureB-13.MSP-TS430PW28A TargetSocket Module, Schematic

52 Hardware SLAU278F –May 2009–RevisedDecember 2010

Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Connector J5 External power connector Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode www.ti.com MSP-TS430PW28A FigureB-14.MSP-TS430PW28A TargetSocket Module, PCB (Red) 53SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PW28A www.ti.com TableB-8.MSP-TS430PW28A BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard 2 C5 1 2.2nF,SMD0805

3 C3 1 10uF/10V,SMD0805

4 C4, C6, 2 100nF,SMD0805 478-3351-2-ND

DNP: Headers and receptacles 6 J1,J2 0 14-pinheader,TH enclosedwithkit.Keep viasfreeof solder:(Header& Receptacle) J5,JP1, JP4,JP5, Placejumperon 1-2ofJP4-JP97 8 3-pinheader,male,TH SAM1035-03-NDJP6,JP7, Placeon 1-2on JP1 JP8,JP9 9 9 Jumper 15-38-1024-ND see Pos 7 an 8 14-pinconnector,male,10 JTAG 1 HRP14H-NDTH

11 BOOTST 0 DNP Keep viasfreeofsolder

12 Q1 0 Crystal 32.768kHz,C(Load)= DNP: keep viasfreeofsolder 12.5pF

13 R1, R7 2 330 Ω,SMD0805 541-330ATR-ND

R2, R3,R5,14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5,R6R6,

15 R4 1 47k Ω,SMD0805 541-47000ATR-ND

16 U1 1 Socket:OTS-28-0.65-01 Manuf.:Enplas 17 PCB 1 63.5x 64.8mm 2 layers Adhesive about6mm width,2mm e.g.,3M Bumpons Part18 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

19 MSP430 2 MSP430G2553IPW28 DNP: enclosedwithkit,suppliedby TI

54 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430DA38 B.8 MSP-TS430DA38 FigureB-15.MSP-TS430DA38 TargetSocket Module, Schematic 55SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

LED connected to P1.0 Connector J3 External power connector Jumper JP1 to 'ext' Jumper JP3 Open to disconnect LED Jumper JP2 Open to measure current Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire Mode, Close 2-3 to debug in 4-wire JTAG Mode MSP-TS430DA38 www.ti.com FigureB-16.MSP-TS430DA38 TargetSocket Module, PCB

56 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430DA38 TableB-9.MSP-TS430DA38 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard

3 C5 1 100nF,SMD0805 478-3351-2-ND

4 C8 0 2.2nF,SMD0805 DNP DNP: headersand receptaclesenclosedwith"SAM1029-19-6 J1,J2 0 19-pinheader,TH kit.KeepviasfreeofNDSAM1213-19-ND " solder.:Header: Receptacle "J3,JP1, Placejumperson headersJP4,JP5,7 8 3-pinheader,male,TH SAM1035-03-ND JP1,JP4,JP5,JP6,JP7,JP6,JP7, JP8,JP9;Pos 1-2JP8,JP9" Placeon:JP1 -JP9;Pos9 9 Jumper 15-38-1024-ND 1-2

10 JTAG 1 14-pinconnector,male,TH HRP14H-ND

DNP: Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder MicroCrystalMS1V-T1K DNP: Keep viasfreeof12 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF

13 R1, R3 2 330 Ω,SMD0805 541-330ATR-ND

14 R10, R11 0 0 Ω,SMD0805 541-000ATR-ND DNP

16 U1 1 Socket:IC189-0382--037 Manuf.:Yamaichi

17 PCB 1 67 x 66 mm 2 layers

Adhesive e.g.,3M Bumpons PartNo. Applytocornersatbottom18 4 ~6mm width,2mm heightPlasticfeet SJ-5302 side DNP: enclosedwithkit19 MSP430 2 MSP430F2274IDA suppliedby TI 57SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430QFN23x0 www.ti.com B.9 MSP-TS430QFN23x0 FigureB-17.MSP-TS430QFN23x0 TargetSocket Module, Schematic

58 Hardware SLAU278F –May 2009–RevisedDecember 2010

to P1.0 Connector J5 External power connector Jumper JP1 to 'ext' Jumper JP3 Open to disconnect LED Jumper JP2 Open to measure current www.ti.com MSP-TS430QFN23x0 FigureB-18.MSP-TS430QFN23x0 TargetSocket Module, PCB 59SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430QFN23x0 www.ti.com TableB-10.MSP-TS430QFN23x0 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard

2 C3 1 10uF/10V,TantalSizeB 511-1463-2-ND

3 C4 1 100nF,SMD0805 478-3351-2-ND

4 C5 1 10nF,SMD0805 478-1383-2-ND

DNP: headersand receptaclesenclosedwithJ1,J2,J3, SAM1034-10-NDSAM1212-6 0 10-pinheader,TH kit.KeepviasfreeofJ4 10-ND solder.:Header: Receptacle Placejumperon header7 J5,JP1 2 3-pinheader,male,TH SAM1035-03-ND JP1;Pos 1-2. 9 3 Jumper 15-38-1024-ND Placeon:JP1,JP2,JP3 DNP: Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder MicroCrystalMS1V-T1K DNP: Keep viasfreeof12 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF

13 R1 1 330 Ω,SMD0805 541-330ATR-ND

14 R2, R3 0 0 Ω,SMD0805 541-000ATR-ND DNP

16 U1 1 Socket:QFN-40B-0.5-01 Manuf.:Enplas

17 PCB 1 79 x 66 mm 2 layers

Adhesive e.g.,3M Bumpons PartNo. Applytocornersatbottom18 4 ~6mm width,2mm heightPlasticfeet SJ-5302 side DNP: enclosedwithkit19 MSP430 2 MSP430F2370IRHA suppliedby TI

60 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RSB40 B.10 MSP-TS430RSB40 FigureB-19.MSP-TS430RSB40 TargetSocket Module, Schematic 61SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1.0 Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Connector J5 External power connector Jumper JP1 to "ext" MSP-TS430RSB40 www.ti.com FigureB-20.MSP-TS430RSB40 TargetSocket Module, PCB

62 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RSB40 TableB-11.MSP-TS430RSB40 BillofMaterials No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard

1 C1, C2 0 12pF,SMD0805 DNP: C1, C2

C3, C7, C10,2 3 10uF/10V,SMD 0805 445-1371-1-ND DNP C12C12 C4, C6, C8,3 3 100nF,SMD0805 311-1245-2-ND DNP C11C11 4 C5 1 2.2nF,SMD0805

5 C9 1 470nF,SMD0805

6 D1 1 greenLED, SMD0805 P516TR-ND

DNP: headersand receptaclesenclosedwithkit.7 J1,J2,J3,J4 4 10-pinheader,TH Keep viasfreeofsolder.: Header :Receptacle DNP: headersand receptaclesenclosedwithkit.7.1 4 10-pinheader,TH Keep viasfreeofsolder.: Header :Receptacle JP1, JP4,JP5, Jumper:1-2on JP1,JP10;8 JP6,JP7, 9 3-pinheader,male,TH SAM1035-03-ND 2-3on JP4-JP9JP8,JP9,J5, JP10

9 JP2,JP3 2 2-pinheader,male,TH SAM1035-02-ND placejumperon header

DNP. Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder QFN-40B-0.4_12 U1 1 EnplasENPLAS_SOCKET MicroCrystalMS3V-T1R DNP: Q1. Keep viasfreeof13 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF Placeon:JP1,JP2,JP3, 15 10 Jumper 15-38-1024-ND JP4,JP5,JP6,JP7,JP8, JP9,JP10

16 R1,R7 2 330R SMD0805

R2, R3, R5,

17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6

18 R4 1 47k SMD0805

DNP: enclosedwithkit.Is19 MSP430 2 MSP430F5132 suppliedby TI Rubber stand selectappropriate;e.g., applytocornersatbottom20 4off Buerklin:20H1724 side 63SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430RHA40A www.ti.com B.11 MSP-TS430RHA40A FigureB-21.MSP-TS430RHA40A TargetSocket Module, Schematic

64 Hardware SLAU278F –May 2009–RevisedDecember 2010

Jumper JP1 to "ext" Jumpers JP4 to JP9 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device www.ti.com MSP-TS430RHA40A FigureB-22.MSP-TS430RHA40A TargetSocket Module, PCB 65SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430RHA40A www.ti.com TableB-12.MSP-TS430RHA40A BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard 2 C5 0 2.2nF,SMD0805 DNP C12

3 C3, C7 2 10uF/10V,SMD0805 5 DNP C11

4 C4, C6 2 100nF,SMD0805 478-3351-2-ND

DNP: headersand receptaclesJ1,J2,J3,7 4 10-pinheader,TH enclosedwithkit.Keep viasfreeofJ4 solder.:Header :Receptacle DNP: headersand receptacles 7.1 4 10-pinheader,TH enclosedwithkit.Keep viasfreeof solder.:Header :Receptacle J5,JP1, JP4,JP5, Placejumperon 1-2ofJP4-JP9;8 8 3-pinheader,male,TH SAM1035-03-NDJP6,JP7, Placeon 1-2on JP1 JP8,JP9 10 9 Jumper 15-38-1024-ND see Pos 8 an 9 14-pinconnector,male,11 JTAG 1 HRP14H-NDTH 10-pinconnector,male,12 BOOTST 0 DNP. Keep viasfreeofsolderTH 13 U1 1 Socket:QFN-40B-0.5-01 Manuf.:Enplas MicroCrystalMS3V-T1R 14 Q1 0 Crystal 32.768kHz,C(Load)= DNP: Q1. Keep viasfreeofsolder 12.5pF

15 R1,R7 2 330R SMD0805 541-330ATR-ND

R2, R3,

16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6

R8, R9,

17 R4 1 47k SMD0805

18 PCB 1 79 x 66 mm 2 layers

Rubber selectappropriate;e.g.,19 4 applytocornersatbottomsidestandoff Buerklin:20H1724 DNP: enclosedwithkit.Issuppliedby20 MSP430 2 MSP430N5736IRHA TI

66 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430DL48 B.12 MSP-TS430DL48 FigureB-23.MSP-TS430DL48 TargetSocket Module, Schematic 67SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

to P1.0 Orient pin 1 of MSP430 device Jumper J5 Open to measure current Connector J3 External power connector Jumper JP1 to ‘ext’ MSP-TS430DL48 www.ti.com FigureB-24.MSP-TS430DL48 TargetSocket Module, PCB

68 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430DL48 TableB-13.MSP-TS430DL48 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard

2 C4, C7 2 10uF/10V,TantalSizeB 511-1463-2-ND

3 C3, C5 2 100nF,SMD0805 478-3351-2-ND

4 C8 1 10nF,SMD0805 478-1383-2-ND

5 D1 1 yellowLED, TH, 3mm, T1 511-1251-ND

DNP: Headers and receptaclesenclosedwithSAM1034-12-NDSAM1212-6 J1,J2 0 24-pinheader,TH kit.Keepviasfreeof12-ND solder.:Header: Receptacle Placejumperon header7 J3,JP1,JP2 2 3-pinheader,male,TH SAM1035-03-ND JP1;Pos 1-2.DNP: JP2

8 J4,J5 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

9 3 Jumper 15-38-1024-ND Placeon:JP1,J4,J5 DNP: Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder MicroCrystalMS1V-T1K DNP: Keep viasfreeof12 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF

13 R3 1 560 Ω,SMD0805 541-560ATR-ND

R4, R6, R7,14 2 0 Ω,SMD0805 541-000ATR-ND DNP: R6, R7R12 Socket:IC51-138716 U1 1 Manuf.:YamaichiKS-15186

17 PCB 1 58 x 66 mm 2 layers

Adhesive e.g.,3M Bumpons PartNo. Applytocornersatbottom18 4 ~6mm width,2mm heightPlasticfeet SJ-5302 side DNP: Enclosedwithkit19 MSP430 2 MSP430F4270IDL suppliedby TI 69SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430RGZ48B www.ti.com B.13 MSP-TS430RGZ48B FigureB-25.MSP-TS430RGZ48B TargetSocket Module, Schematic

70 Hardware SLAU278F –May 2009–RevisedDecember 2010

Jumper JP1 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device www.ti.com MSP-TS430RGZ48B FigureB-26.MSP-TS430RGZ48B TargetSocket Module, PCB 71SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430RGZ48B www.ti.com TableB-14.MSP-TS430RGZ48B BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard

2 C3, C4 0 47pF,SMD0805 DNP

C6, C7,3 3 10uF/6.3V,SMD0805C12 C5, C11,4 4 100nF,SMD0805 311-1245-2-NDC13, C14 5 C8 1 2.2nF,SMD0805

6 C9 1 470nF,SMD0805 478-1403-2-ND

7 D1 1 greenLED, SMD0805 P516TR-ND

SAM1029-12-ND DNP: Headers and receptaclesJ1,J2,J3, (Header)8 0 12-pinheader,TH enclosedwithkit.Keep viasfreeofJ4 SAM1213-12-ND solder:(Receptacle)

9 J5 1 3-pinheader,male,TH

JP3,JP5, placejumperson pins2-3on JP5,JP6,JP7,10 7 3-pinheader,male,TH SAM1035-03-ND JP6,JP7,JP8,JP9,JP10 placeJP8,JP9, jumperson pins1-2on JP3,JP10

11 JP1,JP2 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

12 9 Jumper 15-38-1024-ND See Pos.10and Pos.11 14-pinconnector,male,13 JTAG 1 HRP14H-NDTH 10-pinconnector,male,14 BOOTST 0 "DNP Keep viasfreeofsolder"TH MicroCrystalMS3V-T1R 15 Q1 0 Crystal 32.768kHz,C(Load)= DNP: Q1 Keep viasfreeofsolder 12.5pF Q2: 4MHz Buerklin:16 Q2 0 Crystal DNP: Q2 Keep viasfreeofsolder78D134

18 R3, R7 2 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4, R6,

19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

R9,R10, R11, R12

20 R5 1 47k Ω,SMD0805 541-47000ATR-ND

Socket: 21 U1 1 QFN11T048- Manuf.:Yamaichi 008_A101121_RGZ48

22 PCB 1 81 x 76 mm 2 layers

Adhesive about6mm width,2mm e.g.,3M Bumpons Part23 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

24 MSP430 2 MSP430F5342IRGZ DNP: enclosedwithkit,suppliedby TI

72 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PM64 B.14 MSP-TS430PM64 NOTE: Connectionsbetween theJTAG headerand pinsXOUT and XIN areno longerrequiredand shouldnotbe made. FigureB-27.MSP-TS430PM64 TargetSocket Module, Schematic 73SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PM64 www.ti.com FigureB-28.MSP-TS430PM64 TargetSocket Module, PCB

74 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PM64 TableB-15.MSP-TS430PM64 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: Only 1.1 C3, C4 0 47pF,SMD0805 recommendation.Check yourcrystalspec.

2 C6, C7 1 10uF/10V,TantalSizeB 511-1463-2-ND DNP: C6

5 C9 1 470nF,SMD0805 478-1403-2-ND

DNP: Headers and receptaclesenclosedwithJ1,J2,J3, SAM1029-16-NDSAM1213-7 0 16-pinheader,TH kit.KeepviasfreeofJ4 16-ND solder.:Header: Receptacle

8 J5 1 3-pinheader,male,TH SAM1035-03-ND

9 J6,J7 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

11 2 Jumper 15-38-1024-ND Placeon:J6,J7

12 JTAG 1 14-pinconnector,male,TH HRP14H-ND

DNP: Keep viasfreeof13 BOOTST 0 10-pinconnector,male,TH solder Q1: MicroCrystal DNP: Keep viasfreeof14 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz, solderC(Load)= 12.5pF

15 R3 1 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4, R6, R7, R8, DNP: R4, R6, R7, R9, R10,16 R9, R10, 3 0 Ω,SMD0805 541-000ATR-ND R11, R12, R13, R14R11, R12, R13, R14

17 R5 1 47k Ω,SMD0805 541-47000ATR-ND

18 U1 1 Socket:IC51-0644-807 Manuf.:Yamaichi

19 PCB 1 78 x 75 mm 2 layers

Rubber Applytocornersatbottom20 4 selectappropriatestandoff side MSP430F2619IPM DNP: Enclosedwithkit21 MSP430 22 MSP430F417IPM suppliedby TI 75SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PM64A www.ti.com B.15 MSP-TS430PM64A FigureB-29.MSP-TS430PM64A TargetSocket Module, Schematic

76 Hardware SLAU278F –May 2009–RevisedDecember 2010

LED D1 connected to P5.1 Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Jumper JP4 to JP9: Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode Orient Pin 1 of Device www.ti.com MSP-TS430PM64A FigureB-30.MSP-TS430PM64A TargetSocket Module, PCB 77SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PM64A www.ti.com TableB-16.MSP-TS430PM64A BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard

1 C1, C2, 0 12pF,SMD0805 DNP

2 C3 0 2.2nF,SMD0805 DNP

3 C6, 1 10uF/10V,TantalSizeB 511-1463-2-ND

4 C4, C5 2 100nF,SMD0805 478-3351-2-ND

DNP: Headers and receptaclesenclosedwithJ1,J2,J3, SAM1029-16-NDSAM1213-6 0 16-pinheader,TH kit.Keep viasfreeofJ4 16-ND solder.:Header: Receptacle J5,JP3, JP4,JP5,7 8 3-pinheader,male,TH SAM1035-03-NDJP6,JP7, JP8,JP9

8 JP1,JP2 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

9 2 Jumper 15-38-1024-ND Placeon:J6,J7 DNP: Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder MicroCrystalMS1V-T1K DNP: Keep viasfreeof12 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF

13 R3, R6 2 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R5, R7, R9, R10, DNP: R5, R7, R9, R10,14 2 0 Ω,SMD0805 541-000ATR-NDR11, R13, R11, R13, R14 R14 16 U1 1 Socket:IC51-0644-807 Manuf.:Yamaichi

17 PCB 1 78 x 75 mm 4 layers

Rubber Applytocornersatbottom18 4 selectappropriatestandoff side DNP: Enclosedwithkit19 MSP430 2 MSP430F4152IPM suppliedby TI

78 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RGC64B B.16 MSP-TS430RGC64B FigureB-31.MSP-TS430RGC64B TargetSocket Module, Schematic 79SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Jumper JP3 to "ext" Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 If the system should be supplied via LDOI (J6), close JP4 and set JP3 to externalOrient Pin 1 of MSP430 device MSP-TS430RGC64B www.ti.com FigureB-32.MSP-TS430RGC64B TargetSocket Module, PCB

80 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RGC64B TableB-17.MSP-TS430RGC64B BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard C6, C7,3 3 10uF/6.3V,SMD0805C10 C5, C11,

4 C13, C14, 5 100nF,SMD0805 311-1245-2-ND

5 C8 1 2.2nF,SMD0805 7 C16 1 4.7uF,SMD0805

8 C17 1 220nF,SMD0805

9 D1 1 greenLED, SMD0805 P516TR-ND

SAM1029-16-ND DNP: Headers and receptaclesJ1,J2,J3, (Header)10 0 16-pinheader,TH enclosedwithkit.Keep viasfreeofJ4 SAM1213-16-ND solder:(Receptacle)

11 J5 ,J6 2 3-pinheader,male,TH

JP3,JP5, placejumperson pins2-3on JP5,JP6,JP7,12 7 3-pinheader,male,TH SAM1035-03-ND JP6,JP7,JP8,JP9,JP10 placeJP8,JP9, jumperson pins1-2on JP3,JP10 JP1,JP2,13 3 2-pinheader,male,TH SAM1035-02-ND Placejumperon headerJP4 14 10 Jumper 15-38-1024-ND See Pos.12 and Pos.13 14-pinconnector,male,15 JTAG 1 HRP14H-NDTH 10-pinconnector,male,16 BOOTST 0 "DNP Keep viasfreeofsolder"TH MicroCrystalMS3V-T1R 17 Q1 0 Crystal 32.768kHz,C(Load)= DNP: Q1 Keep viasfreeofsolder 12.5pF Q2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep viasfreeofsolder78D134

20 R3, R7 2 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4, R6,

21 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

R9,R10, R11, R12

22 R5 1 47k Ω,SMD0805 541-47000ATR-ND

Socket:23 U1 1 Manuf.:YamaichiQFN11T064-006-N-HSP

24 PCB 1 85 x 76 mm 2 layers

Adhesive about6mm width,2mm e.g.,3M Bumpons Part25 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP: enclosedwithkit,suppliedby TI

MSP-TS430RGC64USB www.ti.com B.17 MSP-TS430RGC64USB Due totheuse ofdiodesinthepower chain,thevoltageon theMSP430F5xx deviceisapproximately 0.3V lowerthanissetby thedebuggingtool.SetthevoltageintheIDE to0.3V higherthandesired;for example,toruntheMCU at3.0V,setitto3.3V. FigureB-33.MSP-TS430RGC64USB TargetSocket Module, Schematic

82 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RGC64USB FigureB-34.MSP-TS430RGC64USB TargetSocket Module, PCB 83SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430RGC64USB www.ti.com TableB-18.MSP-TS430RGC64USB BillofMaterials No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard

1.1 C3, C4 2 47pF,SMD0805

2 C6, C7 2 10uF/6.3V,TantalSizeB 511-1463-2-ND C5, C11,3 4 100nF,SMD0805 311-1245-2-NDC13, C14

3.1 C10, C12 0 10uF,SMD0805 DNP: C10, C12

4 C8 1 2.2nF,SMD0805 DNP: headersand receptaclesenclosedwithkit. Keep viasfreeofsolder.7 J1,J2,J3,J4 4 16-pinheader,TH SAM1029-16-ND :Header SAM1213-16-ND :Receptacle JP5,JP6,

9 JP7,JP8, 6 3-pinheader,male,TH SAM1035-03-ND placejumperson pins2-3

JP9,JP10 JP1,JP2,10 3 2-pinheader,male,TH SAM1035-02-ND placejumperon headerJP4

11 JP3 1 3-pinheader,male,TH SAM1035-03-ND placejumperon pins1-2

Placeon:JP1,JP2,JP3, 12 10 Jumper 15-38-1024-ND JP4,JP5,JP6,JP7,JP8, JP9,JP10

13 JTAG 1 14-pinconnector,male,TH HRP14H-ND

Q1: MicroCrystalMS1V-T1K DNP: Q114 Q1 0 Crystal 32.768kHz,C(Load)= Keep viasfreeofsolder"12.5pF

15 Q2 1 Crystal Q2: 4MHz Buerklin:78D134

16 R3, R7 2 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4,

17 R6, R8, R9, 2 0 Ω,SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

18 R10 1 100 Ω,SMD0805 Buerklin:07E500

18 R11 1 1M Ω,SMD0805

18 R5 1 47k Ω,SMD0805 541-47000ATR-ND

19 U1 1 Socket:QFN11T064-006 Manuf.:Yamaichi

20 PCB 1 79 x 77 mm 2 layers

Rubber stand applytocornersatbottom21 4 Buerklin:20H1724off side DNP: enclosedwithkit.Is22 MSP430 2 MSP430F5509 RGC suppliedby TI

27 C33 1 220n SMD0603 Buerklin:53D2074

28 C35 1 10p SMD0603 Buerklin:56D102

29 C36 1 10p SMD0603 Buerklin:56D102

30 C38 1 220n SMD0603 Buerklin:53D2074

31 C39 1 4u7 SMD0603 Buerklin:53D2086

32 C40 1 0.1uSMD0603 Buerklin:53D2068

33 D2, D3, D4 3 LL103A Buerklin:24S3406

84 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430RGC64USB TableB-18.MSP-TS430RGC64USB BillofMaterials(continued) No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard

34 IC7 1 TPD4E004 Manu: TI

36 LED 0 JP3QE SAM1032-03-ND DNP

37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP

38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP

39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP

R13, R15,40 0 470R Buerklin:07E564 DNPR16

41 R33 1 1k4 /1k5 Buerklin:07E612

42 R34 1 27R Buerklin:07E444

43 R35 1 27R Buerklin:07E444

44 R36 1 33k Buerklin:07E740

45 S1 0 PB P12225STB-ND DNP

46 S2 0 PB P12225STB-ND DNP

46 S3 1 PB P12225STB-ND

47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885

MSP-TS430PN80 www.ti.com B.18 MSP-TS430PN80 NOTE: ForMSP430F(G)47x devices: Connectpins7 and 10 (GND) externallytoDV SS (seedatasheet). Connectloadcapacitanceon Vrefpin60 when SD16 isused (seedatasheet). FigureB-35.MSP-TS430PN80 TargetSocket Module, Schematic

86 Hardware SLAU278F –May 2009–RevisedDecember 2010

Orient Pin 1 of MSP430 device www.ti.com MSP-TS430PN80 FigureB-36.MSP-TS430PN80 TargetSocket Module, PCB 87SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PN80 www.ti.com TableB-19.MSP-TS430PN80 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: Only 1.1 C3, C4 0 47pF,SMD0805 recommendation.Check yourcrystalspec.

2 C6, C7 1 10uF/10V,TantalSizeB 511-1463-2-ND

DNP: Headers and receptaclesenclosedwithJ1,J2,J3, SAM1029-20-NDSAM1213-6 0 25-pinheader,TH kit.KeepviasfreeofJ4 20-ND solder.:Header: Receptacle

7 J5,JP1 2 3-pinheader,male,TH SAM1035-03-ND

8 J6,JP2 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

Placeon:J6,JP2,9 3 Jumper 15-38-1024-ND JP1/Pos1-2 DNP: Keep viasfreeof11 BOOTST 0 10-pinconnector,male,TH solder Q1: MicroCrystal DNP: Keep viasfreeof12 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz, solderC(Load)= 12.5pF R1, R2, R4, DNP: R4, R6, R7, R10,14 R6, R7, R10, 2 0 Ω,SMD0805 541-000ATR-ND R11, R12R11, R12 16 U1 1 Socket:IC201-0804-014 Manuf.:Yamaichi

17 PCB 1 77 x 77 mm 2 layers

Adhesive e.g.,3M Bumpons PartNo. Applytocornersatbottom18 4 ~6mm width,2mm heightPlasticfeet SJ-5302 side DNP: Enclosedwithkit19 MSP430 2 MSP430FG439IPN suppliedby TI

88 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PN80A B.19 MSP-TS430PN80A FigureB-37.MSP-TS430PN80A TargetSocket Module, Schematic 89SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Jumper JP3 to "ext" Orient Pin 1 of MSP430 device Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED If the system should be supplied via LDOI (J6), close JP4 and set JP3 to external MSP-TS430PN80A www.ti.com FigureB-38.MSP-TS430PN80A TargetSocket Module, PCB

90 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PN80USB TableB-20.MSP-TS430PN80A BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard C6, C7,3 3 10uF/6.3V,SMD0805 DNP C10C10, C12 C5, C11, 5 C8 1 2.2nF,SMD0805 7 C16 1 4.7uF,SMD0805 SAM1029-20-ND DNP: Headers and receptaclesJ1,J2,J3, (Header)10 0 20-pinheader,TH enclosedwithkit.Keep viasfreeofJ4 SAM1213-20-ND solder:(Receptacle) JP3,JP5, placejumperson pins2-3on JP5,JP6,JP7,12 7 3-pinheader,male,TH SAM1035-03-ND JP6,JP7,JP8,JP9,JP10 placeJP8,JP9, jumperson pins1-2on JP3,JP10 JP1,JP2,13 3 2-pinheader,male,TH SAM1035-02-ND Placejumperon headerJP4 14 10 Jumper 15-38-1024-ND See Pos.12 and Pos.13 14-pinconnector,male,15 JTAG 1 HRP14H-NDTH 10-pinconnector,male,16 BOOTST 0 "DNP Keep viasfreeofsolder"TH MicroCrystalMS3V-T1R 17 Q1 0 Crystal 32.768kHz,C(Load)= DNP: Q1 Keep viasfreeofsolder 12.5pF Q2: 4MHz Buerklin:18 Q2 0 Crystal DNP: Q2 Keep viasfreeofsolder78D134

20 D3,D4 2 LL103A Buerklin:24S3406

21 R3, R7 2 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4, R6,

22 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

R9,R10, R11, R12

23 R5 1 47k Ω,SMD0805 541-47000ATR-ND

24 U1 1 Socket:IC201-0804-014 Manuf.:Yamaichi

25 PCB 1 77 x 91 mm 2 layers

Adhesive about6mm width,2mm e.g.,3M Bumpons Part26 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

27 MSP430 2 MSP430F5329IPN DNP: enclosedwithkit,suppliedby TI

B.20 MSP-TS430PN80USB Due totheuse ofdiodesinthepower chain,thevoltageon theMSP430F5xx deviceisapproximately 0.3V lowerthanissetby thedebuggingtool.SetthevoltageintheIDE to0.3V higherthandesired;for example,toruntheMCU at3.0V,setitto3.3V. 91SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PN80USB www.ti.com NOTE: R11 shouldbe populated. FigureB-39.MSP-TS430PN80USB TargetSocket Module, Schematic

92 Hardware SLAU278F –May 2009–RevisedDecember 2010

1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External p ower supply Connector J5 External power connector Jumper JP3 to ‘ext’ USB Connector BSL invoke button S3 Jumper JP4 Close for USB bus powered device Jumper JP2 Open to disconnect LED LED connected to P1.0 Jumper JP1 Open to measure current Jumper JP5 to JP10 Close 1-2 to debug in Spy-Bi- Wire mode. Close 2-3 to debug in 4 -wire JTAG mode. www.ti.com MSP-TS430PN80USB FigureB-40.MSP-TS430PN80USB TargetSocket Module, PCB 93SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PN80USB www.ti.com TableB-21.MSP-TS430PN80USB BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard 2 C6, C7 2 10uF/6.3V,TantalSizeB 511-1463-2-ND C5, C11,3 4 100nF,SMD0805 311-1245-2-NDC13, C14

3.1 C10, C12 0 10uF,SMD0805 311-1245-2-ND DNP: C10, C12

4 C8 1 2.2nF,SMD0805 DNP: headersand receptaclesenclosedwithJ1,J2,J3,7 4 20-pinheader,TH SAM1029-20-ND kit.Keep viasfreeofJ4 solder.:Header: Receptacle DNP: headersand receptaclesenclosedwith 7.1 4 20-pinheader,TH SAM1213-20-ND kit.Keep viasfreeof solder.:Header: Receptacle JP5,JP6, JP7,9 6 3-pinheader,male,TH SAM1035-03-ND Placejumperson pins2-3JP8,JP9, JP10

10 JP1,JP2 2 2-pinheader,male,TH SAM1035-02-ND Placejumperon header

Placejumperonlyon oneJP4 1 SAM1035-02-ND pin Placeon:JP1,JP2,JP3, 12 10 Jumper 15-38-1024-ND JP4,JP5,JP6,JP7,JP8, JP9,JP10 MicroCrystalMS1V-T1K DNP: Q1 Keep viasfreeof14 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF "Q2: 4MHzBuerklin:15 Q2 1 Crystal 78D134 " R1, R2, R4,

18 R11 0 1M Ω,SMD0805 DNP

19 U1 1 Socket:IC201-0804-014 Manuf.:Yamaichi Rubber Applytocornersatbottom21 4 Buerklin:20H1724standoff side DNP: Enclosedwithkit22 MSP430 2 MSP430F5529 suppliedby TI

27 C33 1 220n Buerklin:53D2074

28 C35 1 10p Buerklin:56D102

94 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PN80USB TableB-21.MSP-TS430PN80USB BillofMaterials(continued) No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard

29 C36 1 10p Buerklin:56D102

30 C38 1 220n Buerklin:53D2074

31 C39 1 4u7 Buerklin:53D2086

32 C40 1 0.1u Buerklin:53D2068 R13, R15,40 0 470R Buerklin:07E564 DNPR16

41 R33 1 1k4 Buerklin:07E612

MSP-TS430PZ100 www.ti.com B.21 MSP-TS430PZ100 NOTE: Connectionsbetween theJTAG headerand pinsXOUT and XIN areno longerrequiredand shouldnotbe made. FigureB-41.MSP-TS430PZ100 TargetSocket Module, Schematic

96 Hardware SLAU278F –May 2009–RevisedDecember 2010

Orient Pin 1 of MSP430 device Jumper J7 Open to measure current www.ti.com MSP-TS430PZ100 FigureB-42.MSP-TS430PZ100 TargetSocket Module, PCB 97SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PZ100 www.ti.com TableB-22.MSP-TS430PZ100 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: Only 1b C3, C4 0 47pF,SMD0805 recommendation.Check yourcrystalspec.

6 D1 1 yellowLED, TH, 3mm, T1 511-1251-ND

DNP: Headers and receptaclesenclosedwithJ1,J2,J3, SAM1029-25-NDSAM1213-7 0 25-pinheader,TH kit.KeepviasfreeofJ4 25-ND solder.:Header: Receptacle 10 2 Jumper 15-38-1024-ND Placeon:J6,J7

11 JTAG 1 14-pinconnector,male,TH HRP14H-ND

DNP: Keep viasfreeof12 BOOTST 0 10-pinconnector,male,TH solder Q1: MicroCrystal DNP: Keep viasfreeof13 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz, solderC(Load)= 12.5pF

14 R3 1 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4,

15 R8, R9, R10, 3 0 Ω,SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12

R11, R12

16 R5 1 47k Ω,SMD0805 541-47000ATR-ND

"Socket:IC201-1004-008or17 U1 1 Manuf.:YamaichiIC357-1004-53N"

18 PCB 1 82 x 90 mm 2 layers

Adhesive e.g.,3M Bumpons PartNo. Applytocornersatbottom19 4 ~6mm width,2mm heightPlasticfeet SJ-5302 side DNP: enclosedwithkit20 MSP430 2 MSP430FG4619IPZ suppliedby TI

98 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ100A B.22 MSP-TS430PZ100A FigureB-43.MSP-TS430PZ100A TargetSocket Module, Schematic 99SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

LED D1 connected to P5.1 Jumper JP3 1-2 (int): Power supply via JTAG interface 2-3 (ext): External Power Supply Orient Pin 1 of Device MSP-TS430PZ100A www.ti.com FigureB-44.MSP-TS430PZ100A TargetSocket Module, PCB

100 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ100A TableB-23.MSP-TS430PZ100A BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: Only 1b C3, C4 0 47pF,SMD0805 recommendation.Check yourcrystalspec.

2 C7, C9 2 10uF/10V,TantalSizeB 511-1463-2-ND

C5, C11,3 3 100nF,SMD0805 311-1245-2-NDC14

4 C8 1 10nF,SMD0805 478-1358-1-ND

5 C6 0 470nF,SMD0805 478-1403-2-ND DNP

6 D1 1 greenLED, SMD0805 67-1553-1-ND

DNP: Headers and receptaclesenclosedwithJ1,J2,J3, SAM1029-25-NDSAM1213-7 0 25-pinheader,TH kit.KeepviasfreeofJ4 25-ND solder.:Header: Receptacle

10 JP1,JP2 2 2-pinheader,male,TH SAM1035-02-ND pPlacejumperon header

12 3 Jumper 15-38-1024-ND Placeon:JP1,JP2,JP3 DNP: Keep viasfreeof14 BOOTST 0 10-pinconnector,male,TH solder Q1: MicroCrystal DNP: Keep viasfreeof15 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz, solderC(Load)= 12.5pF

16 R3 1 330 Ω,SMD0805 541-330ATR-ND

R1, R2, R4, R6, R7, R8, DNP: R4, R6, R7, R8, R9,17 2 0 Ω,SMD0805 541-000ATR-NDR9, R10, R10, R11, R12 R11, R12 19 U1 1 Socket:IC357-1004-53N Manuf.:Yamaichi

20 PCB 1 90 x 82 mm 4 layers

Rubber Applytocornersatbottom21 4 Selectappropriatestandoff side DNP: Enclosedwithkit22 MSP430 2 MSP430F5438IPZ suppliedby TI 101SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PZ100B www.ti.com B.23 MSP-TS430PZ100B FigureB-45.MSP-TS430PZ100B TargetSocket Module, Schematic

102 Hardware SLAU278F –May 2009–RevisedDecember 2010

Jumper JP1 to "ext" Jumper JP1 Open to measure current Orient Pin 1 of MSP430 device Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode Close 2-3 to debug in 4-wire JTAG mode JP11, JP12, JP13 Connect 1-2 to connect AUXVCCx with DVCC or drive AUXVCCx externally D1 LED connected to P1.0 Jumper JP2 Open to disconnect LED www.ti.com MSP-TS430PZ100B FigureB-46.MSP-TS430PZ100B TargetSocket Module, PCB 103SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PZ100B www.ti.com TableB-24.MSP-TS430PZ100B BillofMaterials No. perPosition Ref Des Description DigiKeyPartNo. CommentBoard C4, C5, C6 2 ,C7, C8, 6 100nF,SMD0805 311-1245-2-ND

3 C10, C26 2 470 nF,SMD0805 478-1403-2-ND

4 C11, C12 1 10 uF /6.3V SMD0805 C12 DNP C13, C14, 5 C16, C18, 6 4.7uF SMD0805 C19, C29 SAM1029-25-ND DNP: Headers and receptaclesJ1,J2,J3, (Header)7 0 25-pinheader,TH enclosedwithkit.Keep viasfreeofJ4 SAM1213-25-ND solder:(Receptacle)

8 J5 1 3-pinheader,male,TH

JP3,JP5, placejumperson pins2-3on JP5,JP6,JP7,9 7 3-pinheader,male,TH SAM1035-03-ND JP6,JP7,JP8,JP9,JP10 placeJP8,JP9, jumperson pins1-2on JP3,JP10 JP1,JP2,10 3 2-pinheader,male,TH SAM1035-02-ND Placejumperon headerJP4 JP11,11 3 4-pinheader,male,TH placejumperon header1-2JP12,JP13 12 13 Jumper 15-38-1024-ND See Pos.9 and Pos.10 and Pos.11 14-pinconnector,male,15 JTAG 1 HRP14H-NDTH 10-pinconnector,male,16 BOOTST 0 "DNP Keep viasfreeofsolder"TH

17 Q1 0 Crystal DNP: Q1 Keep viasfreeofsolder

R1, R2, R4, R6,22 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11R8, R10, R11 24 U1 1 Socket:IC357-1004-53N Manuf.:Yamaichi

25 PCB 1 90 x 82 mm 2 layers

Adhesive about6mm width,2mm e.g.,3M Bumpons Part26 4 Applytocornersatbottomsideplasticfeet height No. SJ-5302

27 MSP430 2 MSP430F6733IPZ DNP: enclosedwithkit,suppliedby TI

104 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ5x100 B.24 MSP-TS430PZ5x100 FigureB-47.MSP-TS430PZ5x100 TargetSocket Module, Schematic 105SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Jumper J3 to ‘ext’ Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1-2 to debug in Spy-Bi-Wire mode. Close 2-3 to debug in 4-wire JTAG mode. Jumper JP2 Open to disconnect LED LED connected to P1.0 Jumper JP3 1-2 (int): Power supply via JTAG debug interface 2-3 (ext): External power supply MSP-TS430PZ5x100 www.ti.com FigureB-48.MSP-TS430PZ5x100 TargetSocket Module, PCB

106 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ100USB TableB-25.MSP-TS430PZ5x100 BillofMaterials No. perPos. Ref Des Description DigiKeyPartNo. CommentBoard DNP: Only 1b C3, C4 47pF,SMD0805 recommendation.Check yourcrystalspec.

2 C6, C7 2 10uF/10V,TantalSizeB 511-1463-2-ND

C5, C10, C11,3 4 100nF,SMD0805 311-1245-2-ND DNP: C12, C14C12,C13, C14 4 C8 0 2.2nF,SMD0805 DNP DNP: headersand receptaclesenclosedwithJ1,J2,J3, "SAM1029-25-7 0 25-pinheader,TH kit.Keep viasfreeofJ4 NDSAM1213-25-ND " solder.:Header: Receptacle JP5,JP6, JP7,9 6 3-pinheader,male,TH SAM1035-03-ND Placejumperson pins2-3JP8,JP9, JP10 Placeon JP1,JP2,JP3, 12 9 Jumper 15-38-1024-ND JP5,JP6,JP7,JP8,JP9, JP10 DNP: Keep viasfreeof14 BOOTST 0 10-pinconnector,male,TH solder Q1: MicroCrystal DNP: Keep viasfreeof15 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz, solderC(Load)= 12.5pF R1, R2, R4, R6, R8, R9, DNP: R6, R8, R9, R10,17 3 0 Ω,SMD0805 541-000ATR-NDR10, R11, R11, R12 R12 19 U1 1 Socket:IC357-1004-53N Manuf.:Yamaichi

20 PCB 1 90 x 82 mm 2 layers

Rubber Applytocornersatbottom21 4 Selectappropriatestandoff side DNP: Enclosedwithkit22 MSP430 2 MSP430F5438IPZ suppliedby TI B.25 MSP-TS430PZ100USB Due totheuse ofdiodesinthepower chain,thevoltageon theMSP430F5xx deviceisapproximately 0.3V lowerthanissetby thedebuggingtool.SetthevoltageintheIDE to0.3V higherthandesired;for example,toruntheMCU at3.0V,setitto3.3V. 107SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PZ100USB www.ti.com FigureB-49.MSP-TS430PZ100USB TargetSocket Module, Schematic

108 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ100USB FigureB-50.MSP-TS430PZ100USB TargetSocket Module, PCB 109SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-TS430PZ100USB www.ti.com TableB-26.MSP-TS430PZ100USB BillofMaterials No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard 2 C6, C7 2 10uF/6.3V,TantalSizeB 511-1463-2-ND C5, C11,

3 C13, C14, 5 100nF,SMD0805 311-1245-2-ND

C10, C12,3.1 0 100nF,SMD0805 311-1245-2-ND DNP: C10, C12,C18,C17C18,17 4 C8 1 2.2nF,SMD0805 DNP: headersand receptaclesenclosedwithkit. 7 J1,J2,J3,J4 4 25-pinheader,TH SAM1029-25-ND Keep viasfreeofsolder. :Header :Receptacle DNP: headersand receptaclesenclosedwithkit. 7.1 4 25-pinheader,TH SAM1213-25-ND Keep viasfreeofsolder. :Header :Receptacle JP5,JP6, JP9,JP10 JP1,JP2,10 3 2-pinheader,male,TH SAM1035-02-ND placejumperon headerJP4 Placeon:JP1,JP2,JP3, 12 10 Jumper 15-38-1024-ND JP4,JP5,JP6,JP7,JP8, JP9,JP10 MicroCrystalMS1V-T1K DNP: Q1. Keep viasfreeof14 Q1 0 Crystal 32.768kHz,C(Load)= solder12.5pF

15 Q2 1 Crystal Q2: 4MHz, Buerklin:78D134

R1, R2, R4,

17 R6, R8, R9, 3 0 Ω,SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12

18 R11 1 1M Ω,SMD0603 notexistinginRev 1.0 19 U1 1 Socket:IC201-1004-008 Manuf.:Yamaichi Rubber stand applytocornersatbottom21 4 Buerklin:20H1724off side DNP: enclosedwithkit.Is22 MSP430 2 MSP430F5529 suppliedby TI 24 C16 1 4.7nF SMD0603

28 C35, C36 2 10p SMD0603 Buerklin:56D102

110 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-TS430PZ100USB TableB-26.MSP-TS430PZ100USB BillofMaterials(continued) No. PerPos. Ref Des Description DigiKeyPartNo. CommentBoard 32 C40 1 0.1uSMD0603 Buerklin:53D2068

35 LED 0 JP3QE SAM1032-03-ND DNP

LED1, LED2,36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNPLED3 R13, R15,37 0 470R SMD0603 Buerklin:07E564 DNPR16

38 R33 1 1k4 /1k5 SMD0603 Buerklin:07E612

39 R34 1 27R SMD0603 Buerklin:07E444

40 R35 1 27R SMD0603 Buerklin:07E444

41 R36 1 33k SMD0603 Buerklin:07E740

42 S1,S2,S3 1 PB P12225STB-ND DNP S1 and S2.(OnlyS3)

43 USB1 1 USB_RECEPTACLE FARNELL: 117-7885

44 JP11 1 4-pinheader,male,TH SAM1035-04-ND placejumperonlyon Pin1

VCC external VCC01 = Vdd DVCC= Vdda A VDD RF A VCC RF1 = _ / _ Vdda A VCC2 = Port connectors CON1 .. CON Port Port of cc3 = 1 .. 3 430 CON spare4 = CON XIN XOUT5 = 1: 2: CON Vdd GND Vcore6 = , , , COM LCDCAP0, CON Vdda Vdda GND7 = 1, 2, , AGND CON JTAG BASE8 = _ ( )JTAG Port CON Vdd GND AGND9 = , , (May b e addedc lose to therespectivepin s to r educee missions at G Hz tol evel5 required byETSI) EM430F5137RF900 www.ti.com B.26 EM430F5137RF900 FigureB-51.EM430F5137RF900 TargetSocket Module, Schematic

112 Hardware SLAU278F –May 2009–RevisedDecember 2010

LED D2 (red) connected to P3.6 via JP10 LED D1 (green) connected to P1.0 via JP5 RF - Crystal Q1 26 MHz RF - Signal SMA Reset button S1 Push-button S2 connected to P1.7 Jumper JP1 Close JT AG position to debug in JT AG mode Jumper JP2 Close EXT for external supply Close INT for JT AG supply Close SBW position to debug in Spy-Bi-Wire mode Jumper JP1 Spy-Bi-Wire mode Footprint for 32kHz crystal Use 0 resistor for R431/R441 to make XIN/XOUT available on connector port5 Ω Open to measure current jumper JP3 www.ti.com EM430F5137RF900 FigureB-52.EM430F5137RF900 TargetSocket Module, PCB 113SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

EM430F5137RF900 www.ti.com TableB-27.EM430F5137RF900 BillofMaterials No. per Manufacturer'sItem Reference Description Value Manufacturer CommentBoard PartNumber (CUSTOMER SUPPLY )CRYSTAL, AKER1 Q1 1 26M ASX-531(CS)SMT, 4P,26MHz ELECTRONIC C1-C5, C082, C222, C271, C281, CAPACITOR, SMT, 0402,CER, 0402YC104KAT22 14 0.1uF AVXC311, C321, 16V,10%, 0.1uF A C341, C412, C452 CAPACITOR, SMT, 0603, 0603YD474KAT23 C071 1 0.47uF AVXCERAMIC, 0.47uF,16V,10%, X5R A CRCW04024702F4 R401 1 RES0402, 47.0K 47kΩ DALE100 HEADER, THU, MALE, 14P,2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm HEADER, THU, MALE, 10P,2X5,6 CON10 0 09 18 510 6323 HARTING DNP20.32x9.2x9.45mm 7 D1 1 LED, SMT, 0603,GREEN, 2.1V active APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603,RED, 2.0V active APT1608EC KINGBRIGHT UNINSTALLED CRYSTAL, SMT, 3P, MICRO9 Q3 0 32.768k MS1V-T1K (UN) DNPMS1V (CustomerSupply) CRYSTAL HEADER, THU, MALE, 3P,1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm GRM36COG270J11 C251, C261 2 50V,5%, 27pF 27pF MURATA50 FERRITE, SMT, 0402,1.0kΩ, BLM15HG102SN12 L341 1 1kΩ MURATA250mA 1D CAPACITOR, SMT, 0402, GRM1555C1H10113 C293 1 CERAMIC, 100pF,50V,0.25pF, 100pF MURATAJZ01C0G(NP0) INDUCTOR, SMT, 0402,2.2nH, 0.0022u LQP15MN2N2B014 L304 1 MURATA0.1nH,220mA, 500MHz H 2 INDUCTOR, SMT, 0402,15nH, 2%, LQW15AN15NG015 L303,L305 2 0.015uH MURATA450mA, 250MHz 0 INDUCTOR, SMT, 0402,18nH, 2%, LQW15AN18NG016 L292,L302 2 0.018uH MURATA370mA, 250MHz 0 CAPACITOR, SMT, 0402, GRM1555C1H1R17 C291 1 CERAMIC, 1pF,50V,0.05pF, 1pF MURATA0WZ01C0G(NP0) CAPACITOR, SMT, 0402, GRM1555C1H8R18 C303 1 CERAMIC, 8.2pF,50V,0.05pF, 8.2pF MURATA2WZ01C0G(NP0) C292, CAPACITOR, SMT, 0402, GRM1555C1H1R19 C301-C302, 4 CERAMIC, 1.5pF,50V,0.05pF, 1.5pF MURATA5WZ01C304 C0G(NP0) INDUCTOR, SMT, 0402,12nH, 2%, LQW15AN12NG020 L291,L301 2 0.012uH MURATA500mA, 250MHz 0 C282, C312, CAPACITOR, SMT, 0402, GRM1555C1H2R21 C351, C361, 5 2.0pF MurataCERAMIC, 2pF,50V,0.1pF,C0G 0BZ01C371 INDUCTOR, SMT, 0402,6.2nH, LQP15MN6N2B022 L1 1 6.2nH Murata0.1nH,130mA, 500MHz 2 ULTRA-SMALL TACTILE SWITCH, 23 S1-S2 2 SMT, 2P,SPST-NO, 1.2x3x2.5mm, B3U-1000P OMRON 0.05A,12V R4-R5, UNINSTALLED

24 R051, R061, 0 RESISTOR/JUMPER, SMT, 0402,0 0Ω ERJ-2GE0R00X PANASONIC DNP

R431, R441 Ω,5%, 1/16W

114 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com EM430F5137RF900 TableB-27.EM430F5137RF900 BillofMaterials(continued) No. per Manufacturer'sItem Reference Description Value Manufacturer CommentBoard PartNumber RESISTOR/JUMPER, SMT, 0402,024a R7 1 0Ω ERJ-2GE0R00X PANASONICΩ,5%, 1/16W RESISTOR, SMT, 0402,THICK25 R2-R3,R6 3 330Ω ERJ-2GEJ331 PANASONICFILM,5%, 1/16W,330 CAPACITOR, SMT, 0402,CER,26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC12pF,50V,5%, NPO CAPACITOR, SMT, 0402,CER, 0.0022u27 C401 1 ECJ-0EB1H222K PANASONIC2200pF,50V,10%, X7R F RESISTOR, SMT, THICK FILM,56K,28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC1/16W,5% C081, C221, CAPACITOR, SMT, 0603,29 4 10uF ECJ-1VB0J106M PANASONICC411, C451 CERAMIC, 10uF,6.3V,20%, X5R RESISTOR/JUMPER, SMT, 0402,030 R1 1 0Ω ERJ-2GE0R00X PANASONICΩ,5%, 1/16W UNINSTALLED CAP CERAMIC31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP4.7UF 6.3VX5R 0603 ROSENBERG32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ER 33 Q2 0 Crystal,SMT, 32.768kHz 32.768k MS3V-T1R MicroCrystal DNP DUT, SMT, PQFP, RGZ-48, 34 U1 1 0.5mmLS, 7.15x7.15x1mm, CC430F52x1 TI THRM.PAD

35 JP1 1 PinConnector2x4pin 61300821121 WUERTH

CON1-36 0 PinConnector2x4pin 61300821121 WUERTH DNPCON9

37 JP2 1 PinConnector1x3pin 61300311121 WUERTH

JP3,JP5,38 3 PinConnector1x2pin 61300211121 WUERTHJP10 38a JP7,CON13 0 PinConnector1x2pin 61300211121 WUERTH DNP

39 JP4 1 PinConnector2x2pin 61300421121 WUERTH DNP

40 JP1a 1 PinConnector2x3pin 61300621121 WUERTH

VCC external VCC01 = Vdd DVCC= Vdda A VDD RF A VCC RF1 = _ / _ Vdda A VCC2 = Port connectors CON1 .. CON Port Port of cc5 = 1 .. 5 430 CON Vdd GND Vcore6 = , , , COM LCDCAP0, CON Vdda Vdda GND7 = 1, 2, , AGND CON JTAG BASE8 = _ ( )JTAG Port CON Vdd GND AGND9 = , , (May beaddedcl ose to ther espectivepi ns to r educee missions at GH zto l evel5 required b y E TSI) EM430F6137RF900 www.ti.com B.27 EM430F6137RF900 FigureB-53.EM430F6137RF900 TargetSocket Module, Schematic

116 Hardware SLAU278F –May 2009–RevisedDecember 2010

LED D2 (red) connected to P3.6 via JP10 LED D1 (green) connected to P1.0 via JP5 RF - Crystal Q1 26 MHz RF - Signal SMA Reset button S1 Push-button S2 connected to P1.7 Jumper JP1 Close JT AG position to debug in JT AG mode Jumper JP2 Close EXT for external supply Close INT for JT AG supply Close SBW position to debug in Spy-Bi-Wire mode Jumper JP1 Spy-Bi-Wire mode Footprint for 32kHz crystal Use 0 resistor for R541/R551 to makeP5.0/P5.1 available on connector port5 Ω Open to measure current jumper JP3 C392 C422 L451 www.ti.com EM430F6137RF900 FigureB-54.EM430F6137RF900 TargetSocket Module, PCB 117SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

EM430F6137RF900 www.ti.com TableB-28.EM430F6137RF900 BillofMaterials No. Pos. Ref Des per Description PartNo. Manufacturer Board (CUSTOMER SUPPLY )CRYSTAL, SMT, AKER1 Q1 1 ASX-531(CS)4P,26MHz ELECTRONIC C1-C5,C112, C252, C381, CAPACITOR, SMT, 0402,CER, 16V,10%,2 C391, C421, 14 0402YC104KAT2A AVX0.1uFC431, C451, C522, C562 CAPACITOR, SMT, 0603,CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V,10%, X5R 4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE HEADER, THU, MALE, 14P,2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm,90deg 7 D1 1 LED, SMT, 0603,GREEN, 2.1V APT1608MGC KINGBRIGHT 8 D2 1 LED, SMT, 0603,RED, 2.0V APT1608EC KINGBRIGHT HEADER, THU, MALE, 3P,1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm

11 C361, C371 2 50V,±5%, 27pF GRM36COG270J50 MURATA

12 L451 1 FERRITE, SMT, 0402,1.0kΩ,250mA BLM15HG102SN1D MURATA CAPACITOR, SMT, 0402,CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V,±0.25pF,C0G(NP0) INDUCTOR, SMT, 0402,2.2nH,±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHz INDUCTOR, SMT, 0402,15nH, ±5%, 460mA,15 L413,L415 2 LQW15AN15NJ00 MURATA250MHz INDUCTOR, SMT, 0402,18nH, ±5%, 370mA,16 L402,L412 2 LQW15AN18NJ00 MURATA250MHz CAPACITOR, SMT, 0402,CER, 1pF,50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF,NP0 CAPACITOR, SMT, 0402,CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V,±0.25pF,C0G(NP0) C402, CAPACITOR, SMT, 0402,CERAMIC, 1.5pF,19 C411-C412, 4 GRM1555C1H1R5CZ01 MURATA50V,±0.25pF,C0G(NP0)C414 INDUCTOR, SMT, 0402,12nH, ±5%, 500mA,20 L401,L411 2 LQW15AN12NJ00 MURATA250MHz C46-C48, CAPACITOR, SMT, 0402,CERAMIC, 2.0pF,21 5 GRM1555C1H2R0CZ01 MurataC392, C422 50V,±0.25pF,C0G(NP0) INDUCTOR, SMT, 0402,6.2nH,±0.1nH,22 L1 1 LQW15AN6N2D00 Murata700mA, 250MHz ULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm,0.05A,12V RESISTOR/JUMPER, SMT, 0402,0 Ω,5%,24 R7 1 ERJ-2GE0R00X (UN) PANASONIC1/16W RESISTOR, SMT, 0402,THICK FILM,5%,25 R2-R3,R6 3 ERJ-2GEJ331 PANASONIC1/16W,330 CAPACITOR, SMT, 0402,CER, 2200pF,27 C511 1 ECJ-0EB1H222K PANASONIC50V,10%, X7R C111, C251, CAPACITOR, SMT, 0603,CERAMIC, 10uF,28 4 ECJ-1VB0J106M PANASONICC521, C561 6.3V,20%, X5R 28a C041 1 CAP CERAMIC 4.7UF 6.3VX5R 0603 ECJ-1VB0J475M PANASONIC RESISTOR, SMT, THICK FILM,56K,1/16W,29 R441 1 ERJ-2RKF5602 PANASONIC1% RESISTOR/JUMPER, SMT, 0402,0 Ω,5%,30 R1 1 ERJ-2GE0R00X PANASONIC1/16W

31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

118 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com EM430F6137RF900 TableB-28.EM430F6137RF900 BillofMaterials(continued) No. Pos. Ref Des per Description PartNo. Manufacturer Board DUT, SMT, PQFP, RGC-64, 0.5mmLS,33 U1 1 CC430F6137 TI9.15x9.15x1mm,THRM.PAD

34 JP1 1 PinConnector2x4pin 61300821121 WUERTH

35 JP2 1 PinConnector1x3pin 61300311121 WUERTH

36a JP3,JP5,JP10 3 PinConnector1x2pin 61300211121 WUERTH

38 JP1a 1 PinConnector2x3pin 61300621121 WUERTH

MSP-FET430PIF www.ti.com B.28 MSP-FET430PIF FigureB-55.MSP-FET430PIF FET InterfaceModule, Schematic

120 Hardware SLAU278F –May 2009–RevisedDecember 2010

MSP-FET430UIF www.ti.com B.29 MSP-FET430UIF FigureB-57.MSP-FET430UIF USB Interface,Schematic (1of4)

122 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-FET430UIF FigureB-58.MSP-FET430UIF USB Interface,Schematic (2of4) 123SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-FET430UIF www.ti.com FigureB-59.MSP-FET430UIF USB Interface,Schematic (3of4)

124 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-FET430UIF FigureB-60.MSP-FET430UIF USB Interface,Schematic (4of4) 125SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

MSP-FET430UIF www.ti.com FigureB-61.MSP-FET430UIF USB Interface,PCB

126 Hardware SLAU278F –May 2009–RevisedDecember 2010

www.ti.com MSP-FET430UIF B.29.1 MSP-FET430UIF RevisionHistory Revision1.3

Initialreleasedhardwareversion Assembly change on 1.3(May 2005)
R29, R51, R42, R21, R22, R74: valuechanged from330R to100R Changes 1.3to1.4(Aug 2005)
J5:VBUS and RESET additionallyconnected
R29, R51, R42, R21, R22, R74: valuechanged from330R to100R
U1, U7: F1612 can resetTUSB3410; R44 = 0R added
TARGET-CON.: pins6,10,12,13,14 disconnectedfromGND
Firmware-upgradeoptionthroughBSL: R49, R52, R53, R54 added;R49, R52 arecurrentlyDNP
Pullupson TCK and TMS: R78, R79 added
U2: Changed fromSN74LVC1G125DBV toSN74LVC1G07DBV NOTE: Using a locallypowered targetboard withhardware revision1.4 Usingan MSP-FET430UIF interfacehardwarerevision1.4withpopulatedR62 inconjunction witha locallypowered targetboardisnotpossible.Inthiscase,thetargetdeviceRESET signalispulleddown by theFET tool.Itisrecommended toremove R62 toeliminatethis restriction.Thiscomponent islocatedclosetothe14-pinconnectoron theMSP-FET430UIF PCB. See theschematicand PCB drawingsinthisdocument fortheexactlocationofthis component. Assembly change on 1.4(January2006)
R62: notpopulated 127SLAU278F –May 2009–RevisedDecember 2010 Hardware SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

128 Hardware SLAU278F –May 2009–RevisedDecember 2010

SLAU278F –May 2009–RevisedDecember 2010 Hardware InstallationGuide ThissectiondescribesthehardwareinstallationprocessofthefollowingUSB debug interfaceson a PC runningWindows XP:

MSP-FET430UIF
eZ430-F2013
eZ430-RF2500
eZ430-Chronos The installationprocedureforothersupportedversionsof Windows isvery similarand, therefore,not shown here. 129SLAU278F –May 2009–RevisedDecember 2010 Hardware InstallationGuide SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Hardware Installation www.ti.com C.1 Hardware Installation 1. ConnecttheUSB Debug Interfacewitha USB cabletoa USB portofthePC. (eZ430-F2013, eZ430-RF2500 and eZ430-Chronoscan be connectedwithouta cable.) 2. Windows shouldnow recognizethenew hardwareas an "MSP430 XXX x.xx.xx"(seeFigureC-1).The devicename may be differentfromtheone shown here. FigureC-1.Windows XP Hardware Recognition 3. ForCCE v3.1SR1 and CCSv4.x thedriverswillbe installedautomaticallywithoutuserinteraction (continuewithstep13).ForIAR theHardware Wizardstartsautomaticallyand may opens the"Found New Hardware Wizard"window. NOTE: ThisWindow may notappear.Ifitdoes not,thedriverswillbe installedautomatically. Continuewithstep13. 4. Click"Next".The Hardware Wizardtriestofindthedriverinthesystem.Ifthedriverisfound,continue withstep8.Ifnot,press"Back"and continuewithstep5. 5. Select"Installfroma listorspecificlocation(Advanced)"(seeFigureC-2). FigureC-2.Windows XP Hardware Wizard

130 Hardware InstallationGuide SLAU278F –May 2009–RevisedDecember 2010

www.ti.com Hardware Installation 6. Browse tothefolderwhere thedriverinformationfilesarelocated(seeFigureC-3). <br/> ForCCE, thedefaultfolderis: C:\\ProgramFiles\\TexasInstruments\\MSP430_USB_DRIVERS_v3.1\\ <br/> ForCCS, thedefaultfolderis: C:\\ProgramFiles\\TexasInstruments\\ccs4\\emulation\\drivers\\msp430\\ <br/> ForIAR Embedded Workbench,thedefaultfolderis: C:\\ProgramFiles\\TexasInstruments\\IARSystems\\Embedded Workbench 4.0\\ 430\\drivers\\TIUSBFET\\WinXP FigureC-3.Windows XP DriverLocationSelectionFolder 7. The Wizardgeneratesa message thatan appropriatedriverhas been found. 131SLAU278F –May 2009–RevisedDecember 2010 Hardware InstallationGuide SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Hardware Installation www.ti.com 8. Note thatWindows may show a warningthatthedriverisnotcertifiedby Microsoft.Ignorethiswarning and click"ContinueAnyway "(seeFigureC-4). FigureC-4.Windows XP DriverInstallation 9. The wizardinstallsthedriverfiles. 10.The wizardshows a message thatithas finishedtheinstallationofthesoftwarefor"MSP-FET430UIF (TIUSB FET) Adapter"(or"MSP430 ApplicationUART "). 11. NOTE: ThisstepisforMSP-FET430UIF and eZ430-F2013 only. Afterclosingthehardwarewizard,Windows automaticallyrecognizesanothernew hardwaredevice called"MSP-FET430UIF -SerialPort". 12. NOTE: ThisstepisforMSP-FET430UIF and eZ430-F2013 only. Dependingon thecurrentupdateversionoftheoperatingsystem,correspondingdriversareinstalled automaticallyorthehardwarewizardopens again.Ifthewizardstartsagain,repeattheprevious steps.

132 Hardware InstallationGuide SLAU278F –May 2009–RevisedDecember 2010

www.ti.com Hardware Installation 13.The USB debug interfaceisinstalledand readytouse.The DeviceManager listsa new entryas shown inFigureC-5,FigureC-6,orFigureC-7. FigureC-5.Device Manager Using MSP-FET430UIF or eZ430-F2013 (CCE and CCS Only) 133SLAU278F –May 2009–RevisedDecember 2010 Hardware InstallationGuide SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Hardware Installation www.ti.com FigureC-6.Device Manager Using MSP-FET430UIF or eZ430-F2013 (IAROnly)

134 Hardware InstallationGuide SLAU278F –May 2009–RevisedDecember 2010

www.ti.com Hardware Installation FigureC-7.Device Manager Using eZ430-RF2500 (CCE/CCS and IAR) 135SLAU278F –May 2009–RevisedDecember 2010 Hardware InstallationGuide SubmitDocumentationFeedback © 2009–2010,Texas InstrumentsIncorporated

Document RevisionHistory www.ti.com Document RevisionHistory Version Changes/Comments SLAU278 Initialrelease SLAU278A Updated USB driverinstallationaccordingtoCCE v3.1SR1 and CCS v4. SLAU278B Added informationaboutMSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos. Added billsofmaterialsand updatedsome PCBs inAppendixB.SLAU278C Added informationaboutMSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28. Added informationaboutMSP-TS430L092, MSP-TS430RSB40, MSP-TS430RGC64USB, MSP-TS430PZ100USB,SLAU278D MSP-FET430F5137RF900 Added jumperinformationforMSP-TS430L092 PCBs toAppendixB.SLAU278E Added new supporteddevicesinChapter1. Added informationaboutMSP-TS430PW24, MSP-TS430PW28A, MSP-TS430RHA40A, MSP-TS430RGZ48B, SLAU278F MSP-TS430RGC64B, MSP-TS430PN80A, and MSP-TS430PZ100B. Updated MSP-TS430RSB40 schematics NOTE: Page numbers forpreviousrevisionsmay differfrompage numbers inthecurrentversion.

136 RevisionHistory SLAU278F –May 2009–RevisedDecember 2010

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Product Information

MSP-TS430DA38 specifications and overview.

Summary

MSP430 Hardware Tools User Guide

Description

MSP430 Hardware Tools User Guide

Source title MSP-TS430DA38 Datasheet(PDF) - Texas Instruments

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