MSP-EXP430G2ET TI | Alldatasheet
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Contents
www.ti.com 3SLAU772A–June 2018–Revised March 2020 Submit Documentation Feedback Copyright © 2018–2020, Texas Instruments Incorporated MSP430G2553 LaunchPad™ Development Kit (MSP‑EXP430G2ET) List of Tables Trademarks LaunchPad, MSP430, BoosterPack, Code Composer Studio, EnergyTrace, ControlSuite, TivaWare, E2E are trademarks of Texas Instruments. IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems. All other trademarks are the property of their respective owners.
Getting Started www.ti.com
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1 Getting Started
1.1 Introduction
The MSP430G2553 16-bit MCU has 16KB of flash, 512 bytes of RAM, up to 16-MHz CPU speed, an 8- channel 10-bit ADC, capacitive-touch enabled I/Os, a universal serial communication interface, and more – plenty to get started in your development. Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers that support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. You can either design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers. The LaunchPad development kit features an integrated DIP target socket that supports up to 20 pins, allowing MSP430 entry-level MCUs to be plugged into the LaunchPad development kit. The MSP‑EXP430G2ET LaunchPad development kit comes with an MSP430G2553 MCU by default. The MSP430G2553 MCU has the most memory available of the compatible entry-level MCUs. Free software development tools are also available, such as TI's Eclipse-based Code Composer Studio™ IDE (CCS) and IAR Embedded Workbench® for MSP430 IDE (IAR EW430). Both of these IDEs support EnergyTrace™ technology for real-time power profiling and debugging when paired with the MSP430G2553 LaunchPad development kit. More information about the LaunchPad development kit, including documentation and design files, can be found on the MSP430G2553 LaunchPad development kit tool page.
1.2 Key Features
- High-quality 20-pin DIP socket for an easy plug-in or removal of the target MCU
- Supports MSP430G2xx1, MSP430G2xx2, MSP430G2xx3, and MSP430F20xx MCUs in PDIP14 or PDIP20 packages (see Section 2.9 for a list of supported MCUs)
- EnergyTrace technology available for ultra-low-power debugging
- 20-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
- Onboard eZ-FET debug probe
- 1 button and 3 LEDs for user interaction
1.3 What's Included
1.3.1 Kit Contents
- 1x MSP-EXP430G2ET LaunchPad development kit
- 1x micro USB-B cable
- 1x quick start guide
1.3.2 Software Examples
- Out-of-box software
1.4 First Steps: Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box code. It demonstrates some key features of the EVM.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit to a computer using the included USB cable. The green power and yellow LDO LEDs should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by installing an IDE such as TI CCS or IAR EW430. Drivers are also available at http://www.ti.com/MSPdrivers.
www.ti.com Getting Started 5SLAU772A–June 2018–Revised March 2020 Submit Documentation Feedback Copyright © 2018–2020, Texas Instruments Incorporated MSP430G2553 LaunchPad™ Development Kit (MSP‑EXP430G2ET)
1.4.2 Running the Out-of-Box Experience
The LaunchPad development kit includes a pre-programmed MSP430G2553 MCU already installed in the target socket. When the LaunchPad development kit is connected through USB, the Out-of-Box Experience (OOBE) demo starts with a two LED toggle sequence. Press button P1.3 to switch the application to the Live Temperature mode. The LaunchPad development kit should start streaming live temperature data to the PC to be visualized in the MSP-EXP430G2ET OOBE GUI or displayed in a serial terminal. A reference temperature is taken at the beginning of this mode, and the LEDs of the LaunchPad development kit signal a rise or fall in temperature by varying the brightness of the on-board red or green LED, respectively. The reference temperature can also be recalibrated to the ambient temperature with another button press on P1.3. You can influence the temperature of the MCU by blowing hot or cold air onto it, and you can then see changes in the LED brightness or data changes on the GUI. This GUI is created with GUI Composer 2.0 with the source available for customization, imported from the TI Cloud Gallery. The serial communication port on the PC must be configured with 9600 bps, one stop bit, and no flow control to display the values correctly. NOTE: The OOB cloud GUI is supported in only the latest version of Chrome, Firefox, and Safari browsers. An installer for the offline standalone GUI can also be downloaded from the TI Cloud Gallery.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It is time to open an integrated development environment and start editing the code examples. See Section 4 for available IDEs and where to download them. The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in MSPWare. Code Composer Studio Cloud is a simple cloud-based IDE that enables developing and running applications on the LaunchPad development kit. The out-of-box source code and more code examples are provided and available on the download page. Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs. Section 3 describes all functions in detail and provides a project structure to help familiarize you with the code. With the onboard eZ-FET debug probe, debugging and downloading new code is simple. A USB connection between the EVM and a PC through the provided USB cable is all that is needed.
4 MHz
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2 Hardware
Figure 2 shows an overview of the MSP-EXP430G2ET hardware. Figure 2. MSP-EXP430G2ET Overview
2.1 Block Diagram
Figure 3 shows the block diagram. Figure 3. MSP-EXP430G2ET Block Diagram
16 RST/NMI/SBWTDIO
17 TEST/SBWTCK
20 DVSS
2.2 Hardware Features
2.2.1 MSP430G2553 MCU
low-power modes, is optimized to achieve extended battery life in portable measurement applications.
- 1.8-V to 3.6-V operation
- 16-bit RISC architecture up to 16-MHz system clock
- 16KB of flash memory and 512 bytes of SRAM
- 8-channel 10-bit ADC
- 8-channel comparator
- Two 16-bit timers with three capture/compare registers (Timer_A)
- 24 GPIOs
- One universal serial communication interface (USCI_A) supports UART, IrDA, and SPI
- One USCI (USCI_B) supports SPI and I2C Figure 4 shows the pinout of the MSP430G2553 20-pin N (PDIP) package.
Figure 4. MSP430G2553 20-Pin N Package (Top View)
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Figure 5. eZ-FET Debug Probe across the MSP430 portfolio. Table 1. EnergyTrace Technology on the isolation jumper block, see Section 2.2.3. connection, see Section 2.2.4. Design Files. For more information about the software and the debugger, see the eZ-FET wiki.
2.2.3 Debug Probe Connection: Isolation Jumper Block
application UART signals, and 3.3-V and 5-V power.
- To remove any and all influence from the eZ-FET debug probe for high-accuracy target power measurements
- To control 3-V and 5-V power flow between the eZ-FET and target domains
- To expose the target MCU pins for uses other than onboard debugging and application UART communication
- To expose the programming and UART interface of the eZ-FET so that it can be used for MCUs other than the onboard MCU.
Table 2. Isolation Block Connections RXD << Backchannel UART: The target G2553 receives data through this signal. The arrows indicate the direction of the signal. TXD >> Backchannel UART: The target G2553 sends data through this signal. The arrows indicate the direction of the signal. SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low). SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal. Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or Backchannel) UART
programs on the PC that communicate with the LaunchPad development kit.
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Windows PCs, Device Manager can assist. Figure 7. Application Backchannel UART in Device Manager communication to it from the host. the same rate as the USCI_A0.
2.3 Power
FET as well as external or BoosterPack plug-in module power (see Figure 8). Figure 8. MSP-EXP430G2ET Power Block Diagram
www.ti.com Hardware 11SLAU772A–June 2018–Revised March 2020 Submit Documentation Feedback Copyright © 2018–2020, Texas Instruments Incorporated MSP430G2553 LaunchPad™ Development Kit (MSP‑EXP430G2ET) 2.3.1 eZ-FET USB Power The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For 3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack Plug-in Module and External Power Supply
Header J4 is present on the board to supply external power directly. It is important to comply with the MCU voltage operation specifications when supplying external power. The MSP430G2553 has an operating range of 1.8 V to 3.6 V. For more information, see the MSP430G2x53, MSP430G2x13 Mixed- Signal Microcontrollers data sheet.
2.4 Measure MSP430 Current Draw
To measure the current draw of the MSP430G2553 using a multi-meter, use the 3V3 jumper on the J101 jumper isolation block. The current measured includes the target MCU and any current drawn through the BoosterPack plug-in module headers. To measure ultra-low power, follow these steps: 1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper. 2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430G2553 may have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider their current sinking and sourcing capability in the final measurement. 3. Make sure there are no floating inputs/outputs (I/Os) on the MSP430G2553. These cause unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or low level. 4. Begin target execution. 5. Measure the current. If the current levels are fluctuating, it may be difficult to get a stable measurement. It is easier to measure quiescent states. EnergyTrace technology can also be used to compare various current profiles and better optimize your energy performance.
2.5 Clocking
The MSP-EXP430G2ET provides an external clock in addition to the internal clocks in the MCU.
- Y1: 32.768-kHz 12.5-pF crystal The 32.768-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clock sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used. By default, the crystal is not connected to the MSP430G2553 because the target pins are multiplexed with two BoosterPack plug-in module header pins. 0-Ω resistors R3 and R9 must be removed, while R5 and R7 must be shorted across to connect the external crystal to the MSP430G2553. See the onboard crystal selection resistors silkscreen for how to configure the resistors to select between the crystal or the BoosterPack plug-in module pins. The internal clocks in the MCU default to the following configuration:
- MCLK: DCO at 1 MHz
- SMCLK: DCO at 1 MHz
- ACLK: LFXT1 at 32.768 kHz For more information about configuring internal clocks and using the external oscillators, see the MSP430x2xx Family User's Guide.
2.6 Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 MCUs, not just the onboard MSP430G2553 target MCU.
Hardware www.ti.com
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Submit Documentation Feedback Copyright © 2018–2020, Texas Instruments Incorporated MSP430G2553 LaunchPad™ Development Kit (MSP‑EXP430G2ET) 1. Disconnect every jumper in the isolation jumper block. This is necessary, because the debug probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection. 2. Make sure the target board has proper connections for SBW. Note that to be compatible with SBW, the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430 JTAG interface circuitry is the MSP430 Hardware Tools User's Guide. 3. Connect these signals from the debug probe side of the isolation jumper block to the target hardware:
- 5 V (if 5 V is needed)
- 3.3 V
- GND
- SBWTDIO
- SBWTCK
- TXD (if the UART backchannel is to be used)
- RXD (if the UART backchannel is to be used) This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the isolation jumper block.
2.7 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 20-pin LaunchPad development kit pinout standard. A standard was created to aid compatibility between LaunchPad development kit and BoosterPack plug-in module tools across the TI ecosystem. While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSP- EXP430G2ET LaunchPad development kit is compatible with all 20-pin BoosterPack plug-in modules that comply with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly indicate compatibility with the MSP-EXP430G2ET LaunchPad development kit, compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility. Sometimes conflicts can be resolved by changing the MSP430G2553 pin function configuration in software. To check the compatibility of your desired BoosterPack plug-in modules for your design, with a LaunchPad development kit of your choice, you can use the BoosterPack Checker tool (see Figure 9). This allows you to select any LaunchPad development kit we offer and determine its compatibility with any number of BoosterPack plug-in modules that we offer. You can also add your own BoosterPack plug-in module to check its compatibility as you prototype that next design.
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Figure 11. Insert Device Into Target Socket
2.9 Supported Devices
kit. Table 3 lists the supported MCUs. Table 3. Supported Devices
Table 3. Supported Devices (continued)
2.10 Design Files
2.10.1 Hardware
Gerber files, and documentation are available in the MSP-EXP430G2ET Hardware Design Files.
2.10.2 Software
documentation are available in the MSP-EXP430G2ET LaunchPad development kit download page.
2.11 Hardware Change log
Table 4 lists the revision history of the MSP430G2553 LaunchPad development kit hardware. Table 4. Hardware Change Log
3 Software Examples
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Table 5. Software Examples development environment (IDE) that supports the MSP430G2553 MCU. Table 6. IDE Minimum Requirements for MSP-EXP430G2ET
3.1 Out-of-Box Software Example
sequence. The demo also implements a real-time temperature sensor.
3.1.1 Source File
The OOBE project includes one main.c source file (see Table 7). Table 7. Source File
3.1.2 Overview
the demo to the PC (application UART settings: 9600, 8, 1, n). a two LED toggle sequence. At any time, press S1 to switch to the Live Temperature mode.
3.1.3 Live Temperature Mode
temperature and transfers the data to the PC through UART. LED, respectively. The reference temperature can also be recalibrated with another button press on P1.3. illuminate, and if the measured temperature is above the threshold, the green LED will illuminate.
is from the threshold, the brighter the corresponding LEDs will illuminate. in the user LED brightness or see data changes on the GUI. without any change in the program.
3.2 Blink LED Example
3.2.1 Source File Structure
The Blink LED project includes one main.c source file (see Table 8). Table 8. Source File and Folders P1.0 GPIO pin connected to the LED inside a software loop.
4 Resources
4.1 Integrated Development Environments
4.1.1 TI Cloud Development Tools
4.1.1.1 TI Resource Explorer Cloud
found in MSPWare without having to download files to your local drive. Try TI Resource Explorer Cloud now at https://dev.ti.com/.
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Figure 12. TI Resource Explorer Cloud
4.1.1.2 Code Composer Studio Cloud
Cloud supports debug features such as execution control, breakpoints and viewing variables. For a comparison of CCS Cloud and CCS Desktop, visit Should I use CCS Cloud or CCS Desktop. Visit Code Composer Studio Cloud now at http://dev.ti.com. Figure 13. CCS Cloud
4.1.2 Code Composer Studio IDE
compiler, source code editor, project build environment, debugger, profiler, and many other features. You can learn more about CCS and download it at http://www.ti.com/tool/ccstudio. Figure 14. Directing the Project>Import Function to the Demo Project Selecting the \\CCS subdirectory also works. The CCS-specific files are located there. has found it is that the project appears in the box shown in Figure 15, and it has a checkmark to the left.
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Figure 15. When CCS Has Found the Project do not see it in the CCS workspace, be sure to check the workspace directory on the file system.
4.1.3 IAR Embedded Workbench for 430 IDE
utility, and IAR C-SPY® Debugger. You can learn more about IAR Embedded Workbench for MSP430 and download it at the IAR website. desired demo. All workspace information is contained within this file. clicking Project>Add-Existing-Project… . are already included in a CCS installation (unless the user selected otherwise).
4.2 LaunchPad Development Kit Websites
- MSP-EXP430G2ET tool folder: Resources specific to this particular LaunchPad development kit
- TI's LaunchPad portal: Information about all LaunchPad development kits from TI
4.3 MSPWare and TI Resource Explorer
Cloud. See Section 4.1.1 for more information. information can be found at http://www.ti.com/tool/mspware. Figure 16. Using TI Resource Explorer to Browse MSP-EXP430G2ET in MSPWare
4.4 MSP430G2553 MCU
4.4.1 Device Documentation
MSP430 MCU, the documentation is organized as shown in Table 9. Table 9. How MSP Device Documentation is Organized and peripherals such as clocks, timers, ADC, and so on.
Resources www.ti.com
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4.4.2 MSP430G2553 Code Examples
MSP430G2x53, MSP430G2x33, MSP430G2x13, MSP430G2x03 Code Examples is a set of simple C examples that demonstrate how to use the entire set of peripherals on the MSP430G2553 MCU, including serial communication, ADC10, timer, and others, through direct register access. Every MSP derivative has a set of these code examples. When starting a new project or adding a new peripheral, these examples serve as a great starting point.
4.4.3 MSP430 Application Notes and TI Designs
There are many application notes that can be found at http://www.ti.com/msp430, as well as TI Designs with practical design examples and topics.
4.5 Community Resources
4.5.1 TI E2E™ Community
Search the forums at https://e2e.ti.com. If you cannot find your answer, post your question to the community.
4.5.2 Community at Large
Many online communities focus on the LaunchPad development kit – for example, http://www.43oh.com. You can find additional tools, resources, and support from these communities.
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5 FAQ
Q: I can't get the backchannel UART to connect. What's wrong? A: Check the following:
- Do the baud rate in the host terminal application and the USCI settings match?
- Are the appropriate jumpers in place, on the isolation jumper block?
- Probe on RXD and send data from the host. If you don't see data, it might be a problem on the host side.
- Probe on TXD while sending data from the MSP. If you don't see data, it might be a configuration problem with the USCI module. Q: The device is not answering to any communication, JTAG or UART. A: If you are experiencing difficulties in communicating to the attached MSP430 target MCU, even though all the communication drivers for the MSP-EXP430G2ET are loaded correctly, the emulator is probably set to a wrong communication state. This can be fixed by reconnecting the LaunchPad development kit and restarting the communicating application. Also make sure that all the jumpers on J101 are connected properly between the emulator and the target MCU.
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6 Schematics
Figure 17. Schematics (1 of 3)
Figure 18. Schematics (2 of 3)
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Figure 19. Schematics (3 of 3)
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. WARNING Evaluation Kits are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User shall operate the Evaluation Kit within TI’s recommended guidelines and any applicable legal or environmental requirements as well as reasonable and customary safeguards. Failure to set up and/or operate the Evaluation Kit within TI’s recommended guidelines may result in personal injury or death or property damage. Proper set up entails following TI’s instructions for electrical ratings of interface circuits such as input, output and electrical loads. NOTE: EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
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3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
www.ti.com Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur
3.3 Japan
輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products”in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, 2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or 3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
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4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated