MSMP6.0A VISHAY | Alldatasheet
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MSMP6.0A thru MSMP20A www.vishay.com Vishay General Semiconductor Revision: 10-Dec-13 1 Document Number: 89457 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Surface Mount TRANSZORB® Transient Voltage Suppressors TYPICAL APPLICATIONS Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for protecting sensitive equipment against transient overvoltages.
FEATURES
- Very low profile - typical height of 0.65 mm
- Ideal for automated placement
- Oxide planar chip junction
- Uni-directional polarity only
- Peak pulse power: 150 W (10/1000 μs)
- ESD capability: 15 kV (air), 8 kV (contact)
- Meets MSL level 1, per J-STD-020C, LF maximum peak of 260 °C
- Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 MECHANICAL DATA Case: MicroSMP Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-fr ee, RoHS-compliant, and commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test Polarity: Color band denotes the cathode end Notes (1) Non-repetitive current pulse, per fig. 1 (2) Mounted on 6.0 mm x 6.0 mm copper pads to each terminal (3) Mounted on minimum recommended pad layout PRIMARY CHARACTERISTICS VBR 6.67 V to 24.5 V VWM 6.0 V to 20 V PPPM (10 x 1000 μs) 150 W TJ max. 150 °C Polarity Uni-directional Package MicroSMP MicroSMP eSMP ® Series Top View Bottom View MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Peak power dissipation with a 10/1000 μs waveform (fig. 1) P PPM (1)(2) 150 W Peak pulse current with a 10/1000 μs waveform I PPM (1) See next table A Power dissipation T M = 120 °C P D (2) 1.0 W Power dissipation T A = 25 °C P D (3) 0.5 Operating junction and storage temperature range T J, TSTG - 55 to + 150 °C
MSMP6.0A thru MSMP20A www.vishay.com Vishay General Semiconductor Revision: 10-Dec-13 2 Document Number: 89457 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) Pulse test: tp 50 ms (2) Surge current waveform per Fig. 1 and derate per Fig. 3 (3) To calculate maximum clamping voltage at surge current uses the following formula: VCL max. = RD x IPP + VBR max. Notes (1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance RJA - junction to ambient (2) Units mounted on PCB with 6.0 mm x 6.0 mm copper pad areas; RJM - junction to mount Notes (1) Immunity to IEC 61000-4-2 air discharge mode has a typical performance > 30 kV (2) System ESD standard ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) DEVICE TYPE DEVICE MARKING CODE BREAKDOWN VOLTAGE VBR AT IT (1) (V) TEST CURRENT IT (mA) STAND-OFF VOLTAGE VWM (V) MAXIMUM REVERSE LEAKAGE CURRENT IR AT VWM (μA) MAXIMUM VC AT IPPM RD MAXIMUM VC AT IPPM RD 10/1000 μs 8/20 μs MIN. MAX. V C (V) I PPM (A) R D ()V C (V) I PPM (A) R D () THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Typical thermal resistance R JA (1) 250 °C/WRJM (2) 30 IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25 °C unless otherwise noted) STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE AEC-Q101-001 Human body model (con tact mode) C = 100 pF, R = 1.5 k V C H3B > 8 kV IEC 61000-4-2 (2) Human body model (air discharge mode) (1) C = 150 pF, R = 330 4 > 15 kV ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE MSMP6.0A-M3/89A 0.006 89A 4500 7" di ameter plastic tape and reel
MSMP6.0A thru MSMP20A www.vishay.com Vishay General Semiconductor Revision: 10-Dec-13 3 Document Number: 89457 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Fig. 1 - Pulse Waveform Fig. 2 - Peak Pulse Power Rating Curve Fig. 3 - Pulse Power or Current vs. Initial Junction Temperature Fig. 4 - Typical Junction Capacitance Fig. 5 - Power Dissipation Derating Curve Fig. 6 - Typical Transient Thermal Impedance 100 150 1.0 2.0 3.0 4.0 tr = 10 μs tr = 8 μs td = 1000 μs td = 20 μs IPPM - Peak Pul se Current (% I RSM t - Time (ms) td Peak Value I PPM Half Value - I PPM IPP TJ = 25 °C Pulse Width (td) is Defined as the Point Where the Peak Current Decays to 50 % of IPPM 0.1 0.01 0.1 100 1 10 100 1000 10 000 P PPM - Peak Pul se Power (kW) td - Pulse Width (μs) Copper Pad Areas Non-Repetitive Pulse Waveform Shown in Fig. 1 TA = 25 °C 100 0 50 75 100 125 175 Peak Pul se Power (P PP ) or Current (I PP Derating in Percentage (%) TJ - Initial Temperature (°C) 25 150 100 1000 6 8 10 12 14 16 18 20 CJ - Junction Capacitance (pF) VWM - Reverse Stand-Off Voltage (V) Measured at Stand-off Voltage, VWM Measured at Zero Bias TJ = 25 °C f = 1.0 MHz V sig = 50 mVp-p 0.0 0.2 0.4 0.6 0.8 1.0 1.2 500 100 150 175 Ambient Temperature (°C) P D - Power Di ss ipation (W) 25 75 125 Mounted on Minimum Recommende Pad Area TA = TM, Mounted on 6.0 mm x 6.0 mm Copper Pad 1000 100 0.10.01 1 10 100 1000 t - Pulse Duration (s) Transient Thermal Impedance (°C/W) Junction to Ambient
MSMP6.0A thru MSMP20A www.vishay.com Vishay General Semiconductor Revision: 10-Dec-13 4 Document Number: 89457 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 0.106 (2.70) 0.091 (2.30) 0.055 (1.40) 0.047 (1.20) Cathode Band MicroSMP 0.030 (0.75) 0.022 (0.55) 0.030 (0.75) 0.022 (0.55) 0.059 (1.50) 0.043 (1.10) 0.039 (0.98) 0.031 (0.78) 0.091 (2.30) 0.083 (2.10) 0.020 (0.50) 0.043 (1.10) 0.011 (0.27) 0.005 (0.12) 0.079 (2.00) 0.032 (0.80) 0.032 (0.80) Mounting Pad Layout 0.029 (0.73) 0.025 (0.63)
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