MSM SPSEMI | Alldatasheet
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Technical content
Surface Mount Devices Almost anywhere there is a low voltage Lead free deivce power supply, up to DC33V and a load Size 4532mm/1812 mils to be protested, including: Surface Mount packaging for automated assembly Computer mother board,Modem,USB hub Agency recognition:UL PDAs & Charger,Analog & digital line card Digital cameras,Dish drivers, CD-ROMs Model D E min max min max min max min min Dimensions (mm) A B C Product dimensions (mm) Test Passive aging Humidity aging Thermal shock Resistance to solvent Vibration Maximum surface of the device in the tripped state is 125℃ Environmental Specifications 85℃,85%℃R.H.,168hrs 85℃,to-40℃,13times ±5% typical ±5% typical ±33% typical Ambient operating confitions:-40℃ to 85℃ Conditions MIL-STD-202,Method 215 MIL-STD-202,Method 201 Resistance change No change No change 85℃,1000hrs 3.2 ± 0.1 3.2 ± 0.1 PPTC/MSM Series 01 | www.spsemi.cn MSM020/60 MSM075/16/24/33 MSM110/16/24/33 MSM150/16/24 MSM200/12 MSM260/13.2/16 MSM010 MSM014 MSM030 REV.2014.05.01
Model Ihold Itrip Vmax Imax Pd max Current Time Rmin Rmax (A) (A) (Vdc) (A) (w) (A) (S) (Ω) (Ω) Ihold Itrip Vmax Imax Pd Rmin/max R1max *CAUTION Model Maximum resistance of device at 25℃ measured one hour after trippde tripping. Operation beyond the specified rating may result in damage and possible arcing. Maximum operating volatge device can withstand without damage at ratde current(imax). Maximum fault current device can withstand without damage at rated voltage(Vmax). Typical power dissipatde from device when in the tripped state in 25℃ still air. Minimum/Maximum device resistance prior to tripping at 25℃. maximun ambient operating temperature(Tmao)vs.hold current(Ihold) Ihold versus tempetature Electrical characteristics(25℃) Trip current:Minimum current at which the device will always trip in 25℃ still air Maximum Time To Trip Resistance Hold Current:Maximum current device will not trip in 25℃ still air. MSM110/16 MSM125 MSM150 MSM150/24 MSM160 MSM200 MSM260 MSM300 MSM350 0.84 0.63 PPTC/MSM Series 02 | www.spsemi.cn MSM200/12 REV.2014.05.01
Termination pad characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Thermal Derating Curve Typical Time-To-Trip At 25°C Recommended Solder Reflow Conditions Soldering ‧Recommended reflow methods ：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note ：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. mSMD mSMD SeriesPreheating Cooling Derating Curves for mSMD Series 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (° C) Percentage of Derated Current 60-120 sec. 120 sec. 30-60 sec. 300 200 160 250 190 100 Temperature(°C) Average Time Current Curves 0.001 0.01 0.1 100 0.1 1 10 100 Current In Amperes Time In Seconds 0.10A 0.14A 0.20A 0.30A 0.50A 0.75A 1.10A 1.25A 1.50A 2.00A 2.50A 2.60A
Package Information
Reel: MSM010～350 1500pcs/reel PPTC/MSM Series 03 | www.spsemi.cn REV.2014.05.01