MSK106RH ANAREN | Alldatasheet

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Technical content

FEATURES:

  • Manufactured using Space Qualified RH101 Die
  • Radiation Hardened to 100 Krads(Si) (Method 1019.7 Condition A)
  • High Output Current - 2 Amps Peak
  • Low Power Consumption-Class C Design
  • Programmable Current Limit
  • Rad Hard Design
  • Output Short Circuit Capability
  • Rad Hard Replacement for MSK0021FP
  • Available to DLA SMD 5962R11228
  • Functionally Equivalent Non Rad Hard Device MSK0021FP DESCRIPTION: The MSK106RH is a Radiation Hardened Class C power operational amplifier. This amplifier offers large output currents, making it an excellent choice for motor drive circuits. The amplifier and load can be protected from fault conditions through the use of internal current limit circuitry that can be user programmed with two external resistors. These devices are also compensated with a single external capacitor. The MSK106RH is packaged in a 20 pin hermetic metal flatpack that is available with straight or gull wing leads. CASE IS ALSO VOUT MSK106RHG MSK106RH RADIATION HARDENED HIGH POWER OP-AMP

1 ISC-

2 ISC-

3 ISC-

4 VOUT

5 VOUT

6 VOUT

7 VOUT

8 ISC+

9 ISC+

10 ISC+

14 Compensation

12 GND

  • Servo Amplifier
  • Motor Driver
  • Audio Amplifier
  • Programmable Power Supply MIL-PRF-38534 AND 38535 CERTIFIED FACILITY 8548-7 Rev. K 8/17 106RH EQUIVALENT SCHEMATIC TYPICAL APPLICATIONS PIN-OUT INFORMATION

2 8548-7 Rev. K 8/17 ABSOLUTE MAXIMUM RATINGS ELECTRICAL SPECIFICATIONS NOTES: 1 Unless otherwise specified, ±VCC = ±15V, CC = 3000pF. 2 Guaranteed by design but not tested. 3 Typical parameters are representative of actual device performance but are for reference only. 4 Industrial grade devices shall be tested to subgroups 1 and 4 unless otherwise specified. 5 Military grade devices (K/H suffix) shall be 100% tested to subgroups 1, 2, 3 and 4. Subgroup 1, 4 TA = +25°C 2, 5 TA = +125°C 3, 6 TA = -55°C 6 Reference DLA SMD 5962R11228 for electrical specifications for devices purchased as such. 7 Subgroup 5 and 6 testing available upon request. 8 Continuous operation at or above absolute maximum ratings may adversly effect the device performance and/or life cylcle. 9 Pre and post irradiation limits at 25°C, up to 100Krad TID, are identical unless otherwise specified. Parameter Test Conditions 9 Group A Subgroup MSK106K/H RH MSK106 RH Units STATIC Supply Voltage Range 2 - ±5 ±15 ±22 ±5 ±15 ±22 V Quiescent Current VIN = 0V 1 - ±1.7 ±3.5 - ±1.7 ±4.0 mA Power Consumption 2 VIN = 0V 1,2,3 - 75 225 - 75 225 mW INPUT Input Offset Voltage VIN = 0V 1 - ±0.5 ±3.0 - ±0.5 ±5.0 mV Input Bias Current VCM = 0V 1 - ±100 ±500 - ±150 ±500 nA Either Input 2, 3 - ±0.4 ±2.0 - - - µA Input Offset Current VCM = 0V 1 - ±2.0 ±100 - ±2.0 ±300 nA Input Capacitance 3 F = DC - - 3 - - 3 - pF Input Resistance 2 F = DC - 0.3 1.0 - 0.3 1.0 - MΩ Common Mode Rejection Ratio F = 10Hz VCM = ±10V 4 70 90 - 70 90 - dB 5,6 70 90 - - - - dB Power Supply Rejection Ratio VCC = ±5V to ±15V 1 80 95 - 80 95 - dB Input Noise Voltage 3 F = 10Hz to 10KHz - - 5 - - 5 - µVRMS OUTPUT Output Voltage Swing RL =100Ω F =100Hz 4 ±13.5 ±14 - ±13.0 ±14 - V RL =10Ω F =100Hz 4 ±11 ±12 - ±10.5 ±12 - V RSC = 5Ω VOUT = GND 4 50 150 250 50 150 250 mA Settling Time 3 0.1% 2V step - - 4 - - 4 - µS TRANSFER CHARACTERISTICS Slew Rate VOUT = ±10V RL = 10Ω 4 1.2 1.4 - 1.0 1.4 - V/µS Post Radiation 4 1.1 - - 1.1 - - V/µS Open Loop Voltage Gain F = 10HZ RL = 1KΩ 4 100 105 - 100 105 - dB 5,6 88 96 - - - - dB Transition Times 1V to 2V P Rise and Fall 4 - 0.8 1.0 - 0.8 1.2 µS Post Radiation 4 - 1.0 1.2 - 1.0 1.2 µS Overshoot 0V to 1V P Small Signal 4 - 5 20 - 5 20 %

The MSK106RH has an on-board current limit scheme designed to limit the output drivers anytime output current exceeds a predetermined limit. The following formula may be used to determine the value of the current limit resistance necessary to establish the desired current limit. Current Limit Connection: See "Application Circuits" in this data sheet for additional information on current limit connections. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0.1 microfarad ceramic capacitor in parallel with a 4.7 microfarad tantalum capacitor from each power supply pin to ground. It is also a good practice with high power op-amps, such as the MSK106RH, to place a 30-50 microfarad capacitor with a low effective series resistance, in parallel with the other two power supply decoupling capacitors. This capacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible. TOTAL DOSE RADIATION TEST PERFORMANCE Radiation performance curves for TID testing have been generated for all radiation testing performed by MSK. These curves show performance trends throughout the TID test process and can be located in the MSK106RH radiation test report. The complete radiation test report is available in the RAD HARD PRODUCTS section on the MSK website. HEAT SINKING To select the correct heat sink for your application, refer to the thermal model and governing equation below. Thermal Model: Governing Equation: Tj = Pd X (RθJC + RθCS + RθSA) + Ta Where T j = Junction Temperature P d = Total Power Dissipation R θJC = Junction to Case Thermal Resistance R θCS = Case to Heat Sink Thermal Resistance R θSA = Heat Sink to Ambient Thermal Resistance T c = Case Temperature T a = Ambient Temperature T s = Sink Temperature Example: In our example the amplifier application requires the output to drive a 10 volt peak sine wave across a 10 ohm load for 1 amp of output current. For a worst case analysis we will treat the 1 amp peak output current as a D.C. output current. The power supplies are ±15 VDC. 1.) Find Power Dissipation P d = [(quiescent current) X (+VCC - (-VCC))] + [(Vs - Vo) X IOUT] = 0.1W + 5W = 5.1W 2.) For conservative design, set Tj = +125°C. 3.) For this example, worst case Ta = +25°C. 4.) RθJC = 6.0°C/W 5.) Rearrange governing equation to solve for RθSA: R θSA = (Tj - Ta) / Pd - (RθJC) - (RθCS) = 13.5°C/W The heat sink in this example must have a thermal resistance of no more than 13.5°C/W to maintain a junction temperature of less than +125°C APPLICATION NOTES 3 8548-7 Rev. K 8/17 RSC = 0.7V ISC

4 8548-7 Rev. K 8/17

TYPICAL PERFORMANCE CURVES 5 8548-7 Rev. K 8/17

NOTE: ALL DIMENSIONS ARE ±0.010 INCHES UNLESS OTHERWISE LABELED. ESD Triangle indicates pin 1. WEIGHT= 4.1 GRAMS TYPICAL MECHANICAL SPECIFICATIONS 6 8548-7 Rev. K 8/17

ORDERING INFORMATION

MSK106HRH MIL-PRF-38534 CLASS H MSK106KRH MIL-PRF-38534 CLASS K 5962R11228 DLA SMD

WEIGHT= 4.0 GRAMS TYPICAL MECHANICAL SPECIFICATIONS CONTINUED 7 8548-7 Rev. K 8/17 NOTE: ALL DIMENSIONS ARE ±0.010 INCHES UNLESS OTHERWISE LABELED. ESD Triangle indicates pin 1. MSK106HRHG MIL-PRF-38534 CLASS H MSK106KRHG MIL-PRF-38534 CLASS K 5962R11228 DLA SMD

REVISION HISTORY

REV STATUS DATE DESCRIPTION K Released 08/17 Editorial in Electrical Spec; update format. The information contained herein is believed to be accurate at the time of printing. Anaren, MSK products reserves the right to make changes to its products or specifications without notice, however and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet. ANAREN, MSK Products www.anaren.com/msk 8 8548-7 Rev. A 8/17