MMBT1010LT1 MOTOROLA | Alldatasheet

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1Motorola Small–Signal Transistors, FETs and Diodes Device Data /C0076/C0111/C0119 /C0083/C0097/C0116/C0117/C0114/C0097/C0116/C0105/C0111/C0110 /C0086/C0111/C0108/C0116/C0097/C0103/C0101 /C0080/C0078/C0080 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0068/C0114/C0105/C0118/C0101/C0114 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114/C0115 Part of the GreenLine Portfolio of devices with energy–conserving traits. This PNP Silicon Epitaxial Planar Transistor is designed to conserve energy in general purpose driver applications. This device is housed in the SOT-23 and SC–59 package s which are designed for low powe r surface m ount applications.

  • Low VCE(sat), < 0.1 V at 50 mA

Applications

  • LCD Backlight Driver
  • Annunciator Driver
  • General Output Device Driver MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit Collector-Base Voltage V(BR)CBO 45 Vdc Collector-Emitter Voltage V(BR)CEO 15 Vdc Emitter-Base Voltage V(BR)EBO 5.0 Vdc Collector Current — Continuous IC 100 mAdc DEVICE MARKING MMBT1010LT1 = GLP MSD1010T1 = GLP THERMAL CHARACTERISTICS Rating Symbol Max Unit Power Dissipation TA = 25°C Derate above 25°C PD (1) 225 1.8 mW mW/ °C Thermal Resistance Junction to Ambient R θJA 556 °C/W Junction Temperature TJ 150 °C Storage Temperature Range Tstg –55 ~ +150 °C

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Condition Min Max Unit Collector-Emitter Breakdown Voltage V(BR)CEO IC = 10 mA, IB = 0 15 — Vdc Emitter-Base Breakdown Voltage V(BR)EBO IE = 10 µA, IE = 0 5.0 — Vdc Collector-Base Cutoff Current ICBO VCB = 20 V, IE = 0 — 0.1 µA Collector-Emitter Cutoff Current ICEO VCE = 10 V, IB = 0 — 100 µA DC Current Gain hFE1 (2) VCE = 5 V, IC = 100 mA 300 600 — Collector-Emitter Saturation Voltage VCE(sat)(2) IC = 10 mA, IB = 1.0 mA IC = 50 mA, IB = 5.0 mA IC = 100 mA, IB = 10 mA 0.1 0.1 0.19 Vdc Base-Emitter Saturation Voltage VBE(sat)(2) IC = 100 mA, IB = 10 mA — 1.1 Vdc (1)Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. (2) Pulse Test: Pulse Width ≤/n636861720000000000000000300 µs, D.C. ≤/n6368617200000000000000002%. GreenLine is a trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. REV 1 Order this document by MMBT1010LT1/D /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0077/C0066/C0084/C0049/C0048/C0049/C0048/C0076/C0084/C0049 /C0077/C0083/C0068/C0049/C0048/C0049/C0048/C0084/C0049 PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT CASE 318–07, STYLE 6 SOT-23 Motorola Preferred Devices COLLECTOR BASE EMITTER CASE 318D–03, STYLE 1 SC-59 MMBT1010LT1 MSD1010T1  Motorola, Inc. 1995

/C0077/C0077/C0066/C0084/C0049/C0048/C0049/C0048/C0076/C0084/C0049 /C0077/C0083/C0068/C0049/C0048/C0049/C0048/C0084/C0049

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 2.5-3.0 0.039 1.0 0.094 0.8 0.098-0.118 2.4 0.031 0.95 0.037 0.95 0.037 SOT–23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 SC–59 SC-59/SOT-23 POWER DISSIPATION The power dissipation of the SC-59/SOT-23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum p ower dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction tempera- ture of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = TJ(max) – TA R θJA The values for the equation are found in the m aximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150°C – 25°C 556°C/W = 225 milliwatts The 556°C/W a ssume s the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board m aterial such as Thermal Clad, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the therma l stress to which the devices are subjected.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
  • The soldering temperature and time should not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

or stainless steel with a typical thickness of 0.008 inches. board, i.e., a 1:1 registration. make up a heating “profile” for that particular circuit board. soldering a surface mount device to a printed circuit board. profiles are based on a high density and a low density board. degrees cooler than the adjacent solder joints.

40 TO 80 SECONDS

Figure 1. Typical Solder Heating Profile associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

/C0077/C0077/C0066/C0084/C0049/C0048/C0049/C0048/C0076/C0084/C0049 /C0077/C0083/C0068/C0049/C0048/C0049/C0048/C0084/C0049

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR D JK L A C B S H GV 1 2 DIM A MIN MAX MIN MAX MILLIMETERS 0.1102 0.1197 2.80 3.04 INCHES B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11 D 0.0150 0.0200 0.37 0.50 G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177 K 0.0180 0.0236 0.45 0.60 L 0.0350 0.0401 0.89 1.02 S 0.0830 0.0984 2.10 2.50 V 0.0177 0.0236 0.45 0.60 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. CASE 318–07 ISSUE AD SOT–23 S G H D C B L A J K DIM A MIN MAX MIN MAX INCHES 2.70 3.10 0.1063 0.1220 MILLIMETERS B 1.30 1.70 0.0512 0.0669 C 1.00 1.30 0.0394 0.0511 D 0.35 0.50 0.0138 0.0196 G 1.70 2.10 0.0670 0.0826 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.65 0.0493 0.0649 S 2.50 3.00 0.0985 0.1181 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. CASE 318D–03 ISSUE E SC–59 STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR How to reach us: USA / EUROPE : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, T oshikatsu Otsuki, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 T atsumi Koto–Ku, T okyo 135, Japan. 03–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, T ai Po, N.T ., Hong Kong. 852–26629298 MMBT1010LT1/D /C0042/C0077/C0077/C0066/C0084/C0049/C0048/C0049/C0048/C0076/C0084/C0049/C0047/C0068/C0042